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Contents

README

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ESDA041-2W3Y

STMicroelectronics · ESD Protection Devices · SOT-323-3

ESDA041-2W3Y from STMicroelectronics, in a SOT-323-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K1 passive Cathode of the first unidirectional TVS diode (line 1 to be protected), with VRM 3.6 V, VBR 6.2 V min at 1 mA and VCL max 9 V at IPP 7 A (8/20 µs).
2 A2 passive Anode of the second TVS diode, the lower connection of the two-cell stack, with the same 3.6 V stand-off and 6.2 V min breakdown ratings.
3 A1/K2 passive Common node joining the anode of the first TVS diode and the cathode of the second, on the single-lead side of the package.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package SOT-323-3
Category TVS/Fuse/Board Level Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse leakage current at VR, 25 °C IRM 0.05 µA VR = 3.6 V, Tamb = 25 °C 2
Reverse leakage current at VR, 85 °C IRM 0.1 µA VR = 3.6 V, Tamb = 85 °C 2
Reverse leakage current at VRM, 25 °C IRM 0.1 µA VRM = 4 V, Tamb = 25 °C 2
Reverse leakage current at VRM, 85 °C IRM 0.2 µA VRM = 4 V, Tamb = 85 °C 2
Breakdown voltage VBR 6.2 6.5 6.8 V at 1 mA 2
Forward voltage VF 0.78 0.9 V at 10 mA 2
Clamping voltage VCL 9 V 8/20 µs, IPP = 7 A 2
Peak pulse current (test) IPP 7 A 8/20 µs 2
Dynamic resistance RD 0.3 Ω 8/20 µs 2
Capacitance C 190 pF 0 V 2
Peak pulse current IPP 20 A 8/20 µs 2
Peak pulse voltage, contact discharge VPP 30 kV ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω) 2
Peak pulse voltage, air discharge VPP 30 kV ISO10605 / IEC 61000-4-2 (C = 150 pF, R = 330 Ω) 2
Peak pulse voltage VPP 30 kV ISO 10605 - C = 330 pF, R = 2 kΩ 2
Operating junction temperature range Tj -55 150 °C 2
Storage temperature range Tstg -55 150 °C 2
Maximum lead temperature for soldering TL 260 °C during 10 s 2

CAD (KiCad official)

  • Symbol: ESDA041-2W3Y
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SOT-323-3 (KiCad packages3D, STEP)
  • 3D model files: esda041-2w3y-etched.step / esda041-2w3y-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esda041-2w3y.step / esda041-2w3y.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (14 pp, sha256 2ab0f060dc1522e0, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF