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ESD9N5B-2

WILLSEMI(Will Semicon) · TVS · DFN1006-2L

ESD9N5B-2 from WILLSEMI(Will Semicon), in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive One terminal of the bi-directional TVS line protection, rated for a reverse stand-off voltage of ±5V max and ±30kV ESD (contact and air) per IEC61000-4-2.
2 Pin2 passive The other terminal of the bi-directional TVS line protection, rated for a reverse stand-off voltage of ±5V max and withstanding peak pulse current up to 8A (8/20μs) per IEC61000-4-5.

Key specifications

Parameter Value
Manufacturer WILLSEMI(Will Semicon)
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse stand-off voltage VRWM -5 5 V 3
Reverse leakage current IR 1 μA VRWM = 5.0V 3
Reverse breakdown voltage VBR 5.6 8.5 V IBR = 1mA 3
Reverse holding voltage VHOLD 5.6 8.5 V IHOLD = 50mA 3
Clamping voltage (TLP) VCL 11 V IPP = 16A, tp = 100ns 3
Clamping voltage (ESD) VCL 11 V VESD = 8kV 3
Clamping voltage (surge) VCL 9 V IPP = 1A, tp = 8/20μs 3
Clamping voltage (surge) VCL 12 V IPP = 8A, tp = 8/20μs 3
Junction capacitance CJ 17.5 22 pF VR = 0V, f = 1MHz 3
Junction capacitance CJ 11.5 15 pF VR = 5.0V, f = 1MHz 3
Peak pulse power Ppk 96 W tp = 8/20μs 2
Peak pulse current Ipp 8 A tp = 8/20μs 2
ESD according to IEC61000-4-2 air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD according to IEC61000-4-2 contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Junction temperature TJ 125 °C 2
Operating temperature TOP -40 85 °C 2
Lead temperature TL 260 °C 2
Storage temperature TSTG -55 150 °C 2

CAD (KiCad official)

  • Symbol: ESD9N5B-2
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: esd9n5b-2-etched.step / esd9n5b-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd9n5b-2.step / esd9n5b-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI(Will Semicon) datasheet (6 pp, sha256 3f21bbe424cb9997, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF