# ESD8L5.0C-HXY

**HXY MOSFET** · ESD And Surge Protection (TVS/ESD) · DFN1006-2L

ESD8L5.0C-HXY from HXY MOSFET, in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One of two terminals of the bidirectional ESD protection line; the datasheet gives no individual function label, and the part is rated for a 5 V stand-off voltage (VRWM) with 0.6 pF maximum capacitance. |
| 2 | 2 | passive | The other terminal of the bidirectional ESD protection line; the datasheet gives no individual function label, and the part is rated for a 5 V stand-off voltage (VRWM) with 0.6 pF maximum capacitance. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HXY MOSFET |
| Package | DFN1006-2L |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power (tp = 8/20 µs) | PPP |  |  | 45 | W | tp = 8/20μs | 1 |
| Storage temperature range | Tstg | -55 |  | 150 | °C |  | 1 |
| Operating temperature range | Top | -40 |  | 125 | °C |  | 1 |
| Maximum junction temperature | Tj |  |  | 150 | °C |  | 1 |
| Maximum lead temperature for soldering | TL |  |  | 260 | °C | during 10s | 1 |
| IEC61000-4-2 ESD air discharge |  | -10 |  | 10 | kV | IEC61000-4-2 (ESD) air discharge | 1 |
| IEC61000-4-2 ESD contact discharge |  | -15 |  | 15 | kV | IEC61000-4-2 (ESD) contact discharge | 1 |
| Reverse stand-off voltage | VRWM |  |  | 5 | V |  | 2 |
| Reverse leakage current | IR |  |  | 1 | µA | @ VRWM | 2 |
| Breakdown voltage | VBR | 6.5 |  |  | V | @ IT = 1.0 mA, TA = 25°C, pulse test | 2 |
| Diode capacitance | C |  |  | 0.6 | pF |  | 2 |

## CAD (KiCad official)

- Symbol: `ESD8L5.0C-HXY`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2L (KiCad packages3D, STEP)
- 3D model files: `esd8l5-0c-hxy-etched.step` / `esd8l5-0c-hxy-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esd8l5-0c-hxy.step` / `esd8l5-0c-hxy.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HXY MOSFET datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757782828522184704) (5 pp, sha256 `add26df0a743c4de`, retrieved 2026-10-15, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esd8l5-0c-hxy-datasheet.pdf)