# ESD8D8V0

**MDD（Microdiode Electronics）** · ESD Protection Devices · DFN1006-2

ESD8D8V0 from MDD（Microdiode Electronics）, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MDD（Microdiode Electronics） |
| Package | DFN1006-2 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse working voltage (ESD8D8V0) | VRWM |  |  | 8 | V |  | 2 |
| Reverse leakage current (ESD8D8V0) | IR |  |  | 1 | µA |  | 2 |
| Breakdown voltage (ESD8D8V0) | VB | 8.5 |  |  | V |  | 2 |
| Test current (ESD8D8V0) | IT |  |  | 1 | mA |  | 2 |
| Clamping voltage, first VC column (ESD8D8V0) | VC |  |  | 15 | V | @ 5.0 A (first VC column, printed @A) | 2 |
| Clamping voltage, second VC column (ESD8D8V0) | VC |  |  | 18 | V | @ 6.0 A (second VC column, printed @A) | 2 |
| Peak pulse power (ESD8D8V0) | PPK |  |  | 108 | W |  | 2 |
| Junction capacitance (ESD8D8V0) | CJ |  |  | 65 | Pf |  | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 |  | 30 | KV | ESD per IEC 61000-4-2 (Air), printed ± 30 | 1 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -22 |  | 22 | KV | ESD per IEC 61000-4-2 (Contact), printed ± 22 | 1 |
| Operating temperature | TOPT | -55 |  | 125 | °C |  | 1 |
| Total power dissipation | PD |  |  | 150 | mW | Total power dissipation on FR-5 Board (Note 1) @ Ta=25C | 1 |
| Storage temperature | TSTG | -55 |  | 150 | °C |  | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | gold |  Terminals: Gold plated, solderable per MIL-STD-750, method 2026 | 1 |

## CAD (KiCad official)

- Symbol: `ESD8D8V0`
- Footprint: `Diode_SMD:D_SOD-882`
- 3D model: DFN1006-2 (KiCad packages3D, STEP)
- 3D model files: `esd8d8v0-etched.step` / `esd8d8v0-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esd8d8v0.step` / `esd8d8v0.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MDD（Microdiode Electronics） datasheet](docs/esd8d8v0-datasheet.pdf) (4 pp, sha256 `1944e50ff2aa3c10`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esd8d8v0-datasheet.pdf)