component
ESD8351XV2T1G
Public Made by Adomby adom
onsemi ESD Protection Devices, SOD-523. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownESD8351XV2T1G
onsemi · ESD Protection Devices · SOD-523
ESD8351XV2T1G from onsemi, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the ESD protection diode, identified by the polarity band on the SOD-523 Style 1 outline; the datasheet rates the device at a 3.3 V working peak voltage (I/O pin to GND) and 5.0 A maximum peak pulse current (8/20 µs at TA = 25°C). |
| 2 | Anode | passive | Anode terminal of the ESD protection diode, paired with pin 1 cathode in the SOD-523 Style 1 outline; the datasheet specifies a 0.55 pF maximum I/O-to-GND capacitance and IEC 61000-4-2 Level 4 protection (±8 kV contact, ±15 kV air). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOD-523 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Breakdown Voltage | VBR | 5.5 | 7 | 7.8 | V | IT = 1 mA, I/O Pin to GND | 2 |
| Junction Capacitance (Low Capacitance feature) | CJ | 0.55 | pF | I/O to GND | 1 | ||
| Operating Junction Temperature Range | TJ | -55 | 125 | °C | 1 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 1 | ||
| Lead Solder Temperature Maximum | TL | 260 | °C | 10 seconds | 1 | ||
| IEC 61000-4-2 Contact (ESD) | -15 | 15 | kV | IEC 61000-4-2 Contact | 1 | ||
| IEC 61000-4-2 Air (ESD) | -15 | 15 | kV | IEC 61000-4-2 Air | 1 | ||
| ISO 10605 ESD | -30 | 30 | kV | ISO 10605, 330 pF / 2 kΩ, Contact | 1 | ||
| Maximum Peak Pulse Current | Ipp | 5 | A | 8/20 s @ TA = 25°C | 1 | ||
| Reverse Working Voltage | VRWM | 3.3 | V | I/O Pin to GND | 2 | ||
| Maximum Reverse Leakage Current | IR | 500 | nA | VRWM = 3.3 V, I/O Pin to GND | 2 | ||
| Holding Reverse Voltage | VHOLD | 1.15 | V | I/O Pin to GND | 2 | ||
| Holding Reverse Current | IHOLD | 20 | mA | I/O Pin to GND | 2 | ||
| Clamping Voltage (TLP, IEC Level 2 equivalent) | VC | 6.5 | V | IPP = 8 A, IEC 61000-4-2 Level 2 equivalent (±4 kV Contact, ±4 kV Air) | 2 | ||
| Clamping Voltage (TLP, IEC Level 4 equivalent) | VC | 11.2 | V | IPP = 16 A, IEC 61000-4-2 Level 4 equivalent (±8 kV Contact, ±15 kV Air) | 2 | ||
| Clamping Voltage (8/20 pulse) | VC | 8.2 | V | IPP = 5 A, tp = 8 x 20 s | 2 | ||
| Dynamic Resistance | RDYN | 0.62 | Pin1 to Pin2 | 2 | |||
| Dynamic Resistance | RDYN | 0.59 | Pin2 to Pin1 | 2 |
CAD (KiCad official)
- Symbol:
ESD8351XV2T1G - Footprint:
Diode_SMD:D_SOD-523 - 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files:
esd8351xv2t1g-etched.step/esd8351xv2t1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd8351xv2t1g.step/esd8351xv2t1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (10 pp, sha256
52082506715f58e3, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).