component
ESD73011N-2
Public Made by Adomby adom
WILLSEMI(Will Semicon) ESD Protection Devices, DFN1006-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownESD73011N-2
WILLSEMI(Will Semicon) · ESD Protection Devices · DFN1006-2L
ESD73011N-2 from WILLSEMI(Will Semicon), in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Pin1 | passive | Pin 1 is one terminal of the bidirectional single-line ESD TVS, marked as Pin1 on the DFN1006-2L bottom view, and the datasheet gives no separate per-pin voltage or current limit for it (ratings apply to the device, e.g. VRWM 5.0V max, IPP 5.5A, ±20kV contact ESD). |
| 2 | Pin2 | passive | Pin 2 is the other terminal of the bidirectional single-line ESD TVS, marked as Pin2 on the DFN1006-2L bottom view, and the datasheet gives no separate per-pin voltage or current limit for it (ratings apply to the device, e.g. VRWM 5.0V max, IPP 5.5A, ±20kV contact ESD). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | WILLSEMI(Will Semicon) |
| Package | DFN1006-2L |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power (tp = 8/20μs) | Ppk | 46 | W | tp = 8/20μs | 2 | ||
| Peak pulse current (tp = 8/20μs) | IPP | 5.5 | A | tp = 8/20μs | 2 | ||
| ESD according to IEC61000-4-2 air discharge | VESD | -20 | 20 | kV | ESD according to IEC61000-4-2 air discharge | 2 | |
| ESD according to IEC61000-4-2 contact discharge | VESD | -20 | 20 | kV | ESD according to IEC61000-4-2 contact discharge | 2 | |
| Junction temperature | TJ | 125 | °C | 2 | |||
| Operating temperature | TOP | -40 | 85 | °C | 2 | ||
| Lead temperature | TL | 260 | °C | 2 | |||
| Storage temperature | TSTG | -55 | 150 | °C | 2 | ||
| Reverse maximum working voltage | VRWM | 5 | V | 3 | |||
| Reverse leakage current | IR | 50 | nA | VRWM = 5V | 3 | ||
| Reverse breakdown voltage | VBR | 7 | V | IT = 1mA | 3 | ||
| Junction capacitance | CJ | 0.4 | 0.5 | pF | VR = 0V, f = 1MHz | 3 | |
| Clamping voltage (TLP) | VCL | 9.5 | V | IPP = 16A, tp = 100ns | 3 | ||
| Dynamic resistance (TLP) | RDYN | 0.3 | Ω | 3 | |||
| Clamping voltage (ESD) | VCL | 9.5 | V | VESD = 8kV | 3 | ||
| Clamping voltage (8/20μs) | VCL | 5.5 | V | IPP = 1A, tp = 8/20μs | 3 | ||
| Clamping voltage (8/20μs) | VCL | 8.5 | V | IPP = 5.5A, tp = 8/20μs | 3 |
CAD (KiCad official)
- Symbol:
ESD73011N-2 - Footprint:
Diode_SMD:D_SOD-882 - 3D model: DFN1006-2L (KiCad packages3D, STEP)
- 3D model files:
esd73011n-2-etched.step/esd73011n-2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd73011n-2.step/esd73011n-2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: WILLSEMI(Will Semicon) datasheet (7 pp, sha256
2a2180ed64627da6, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).