Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

ESD5B3CM

MDD(Microdiode Electronics) · ESD Protection Devices · SOD-523

ESD5B3CM from MDD(Microdiode Electronics), in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Bidirectional TVS terminal 1 (no polarity), protects one I/O line with 3.3V working voltage, 4.0-6.0V breakdown at 1mA and 38-45pF capacitance at 0V.
2 2 passive Bidirectional TVS terminal 2 (no polarity), connect to ground or the other side of the protected line; rated 400W peak pulse power (8/20μs) and ±30kV IEC 61000-4-2 ESD.

Key specifications

Parameter Value
Manufacturer MDD(Microdiode Electronics)
Package SOD-523
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Breakdown Voltage VBR 4 6 V IT = 1mA 2
Reverse Working Voltage VRWM 3.3 V 2
Reverse Leakage Current IR 1 μA VRWM = 3.3V 2
Clamping Voltage VC 6.5 V IPP = 1A, tp = 8/20μs 2
Clamping Voltage VC 13 18 V IPP = 23A, tp = 8/20μs 2
Junction Capacitance CJ 38 45 pF VR = 0V, f = 1MHz 2
ESD per IEC 61000-4-2 (Air) VESD -30 30 KV 1
ESD per IEC 61000-4-2 (Contact) VESD -30 30 KV 1
Peak Pulse Power PPP 400 W 8/20us 1
Operating Temperature TOPT -55 150 °C 1
Storage Temperature TSTG -55 150 °C 1
Lead Solder Temperature TL 260 °C 10 sec. duration 1

CAD (KiCad official)

  • Symbol: ESD5B3CM
  • Footprint: Diode_SMD:D_SOD-523
  • 3D model: SOD-523 (KiCad packages3D, STEP)
  • 3D model files: esd5b3cm-etched.step / esd5b3cm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd5b3cm.step / esd5b3cm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MDD(Microdiode Electronics) datasheet (4 pp, sha256 f1606faade90fe30, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF