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Contents

README

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ESD5681N07-2

WILLSEMI(Will Semicon) · TVS · DFN1006-2L

ESD5681N07-2 from WILLSEMI(Will Semicon), in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive Cathode of the uni-directional TVS diode (cathode marking on package); protects the power line with 7V reverse stand-off voltage (VRWM) for ESD5681N07, ±30kV IEC61000-4-2 and 27A IEC61000-4-5 rated peak pulse current.
2 Pin2 passive Anode of the uni-directional TVS diode, normally connected to ground; the clamping voltage of 16V at 27A (8/20μs) is measured from pin 1 to pin 2.

Key specifications

Parameter Value
Manufacturer WILLSEMI(Will Semicon)
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power Ppk 450 W tp=8/20μs 2
ESD IEC61000-4-2 air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD IEC61000-4-2 contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Junction temperature TJ 125 °C 2
Operating temperature TOP -40 85 °C 2
Lead temperature TL 260 °C 2
Storage temperature TSTG -55 150 °C 2
Reverse stand-off voltage VRWM 7 V TA=25°C 3
Breakdown voltage VBR 8 9 10 V IBR = 1mA 3
Reverse leakage current IRM 10 1000 nA at VRWM 3
Forward voltage VF 0.45 1.25 V IF = 20mA 3
Junction capacitance CJ 140 210 pF F=1MHz, VR=0V 3
Rated peak pulse current IPP 27 A 8/20μs, IEC61000-4-5, pin 1 to pin 2 3
Clamping voltage at rated IPP VCL 16 V at IPP=27A, 8/20μs, pin 1 to pin 2 3
Clamping voltage at IPP=16A VCL 11 V IPP = 16A, tp = 100ns, pin 1 to pin 2 3
Clamping voltage at VESD=8kV VCL 11 V VESD = 8kV, pin 1 to pin 2 3

CAD (KiCad official)

  • Symbol: ESD5681N07-2
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: esd5681n07-2-etched.step / esd5681n07-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd5681n07-2.step / esd5681n07-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI(Will Semicon) datasheet (6 pp, sha256 2fde214b9db31fba, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF