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ESD56371N-2

WILLSEMI(Will Semicon) · ESD Protection Devices · DFN1006-2L

ESD56371N-2 from WILLSEMI(Will Semicon), in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive One of two terminals of the bi-directional TVS, which protects the line against ESD of ±30kV (contact and air, IEC61000-4-2) and 22A surge (8/20μs, IEC61000-4-5) with a reverse stand-off voltage of ±15V Max.
2 Pin2 passive The second terminal of the bi-directional TVS, which protects the line against ESD of ±30kV (contact and air, IEC61000-4-2) and 22A surge (8/20μs, IEC61000-4-5) with a reverse stand-off voltage of ±15V Max.

Key specifications

Parameter Value
Manufacturer WILLSEMI(Will Semicon)
Package DFN1006-2L
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power (tp = 8/20μs) Ppk 470 W tp = 8/20μs 2
Peak pulse current (tp = 8/20μs) IPP 22 A tp = 8/20μs 2
ESD according to IEC61000-4-2 air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD according to IEC61000-4-2 contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Junction temperature TJ 125 oC 2
Operating temperature TOP -40 85 oC 2
Lead temperature TL 260 oC 2
Storage temperature TSTG -55 150 oC 2
Reverse stand-off voltage VRWM -15 15 V 3
Reverse leakage current IR 1 50 nA VRWM = 15V 3
Clamping voltage (8/20μs, 1A) VCL 16 18 V IPP = 1A, tp = 8/20μs 3
Clamping voltage (8/20μs, 22A) VCL 19.5 21.5 V IPP = 22A, tp = 8/20μs 3
Junction capacitance CJ 31 40 pF VR = 0V, f = 1MHz 3
Reverse breakdown voltage VBR 16 V IT = 1mA 3
Clamping voltage (TLP) VCL 16 V IPP = 16A, tp = 100ns (TLP, Z0 = 50Ω) 3
Dynamic resistance (TLP) RDYN 0.03 Ω TLP, calculated from 4A to 16A 3

CAD (KiCad official)

  • Symbol: ESD56371N-2
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: esd56371n-2-etched.step / esd56371n-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd56371n-2.step / esd56371n-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI(Will Semicon) datasheet (7 pp, sha256 6c72b2eaaec6ad28, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF