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ESD5621W10-2

WILLSEMI(Will Semicon) · TVS · SOD-323F

ESD5621W10-2 from WILLSEMI(Will Semicon), in a SOD-323F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin 1 passive Terminal 1 of the uni-directional TVS (clamping voltage is measured from pin 1 to pin 2); ESD5621W10 has 10V reverse stand-off voltage and 13.2V typical breakdown at 1mA.
2 Pin 2 passive Terminal 2 of the uni-directional TVS, the return terminal for the pin 1-to-pin 2 clamping measurements; ESD5621W10 is rated for ±30kV IEC61000-4-2 ESD and 60A peak pulse current (8/20μs).

Key specifications

Parameter Value
Manufacturer WILLSEMI(Will Semicon)
Package SOD-323F
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power Ppk 1400 W tp=8/20μs 2
ESD IEC61000-4-2 air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD IEC61000-4-2 contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Junction temperature TJ 125 °C 2
Operating temperature TOP -40 85 °C 2
Lead temperature TL 260 °C 2
Storage temperature TSTG -55 150 °C 2
Reverse stand-off voltage VRWM 10 V TA=25°C 3
Breakdown voltage VBR 11.5 13.2 15 V IBR = 1mA 3
Reverse leakage current IRM 0.1 μA at VRWM 3
Forward voltage VF 0.45 1.25 V IF = 20mA 3
Junction capacitance CJ 350 500 pF F = 1MHz, VR = 0V 3
Rated peak pulse current IPP 60 A 8/20μs, IEC61000-4-5, pin 1 to pin 2 3
Clamping voltage at IPP VCL 25 V at rated IPP, 8/20μs, IEC61000-4-5, pin 1 to pin 2 3
Clamping voltage TLP VCL 15 V IPP = 16A, tp = 100ns, IEC61000-4-2, pin 1 to pin 2 3
Clamping voltage at ESD 8kV VCL 16 V VESD = 8kV, IEC61000-4-2, pin 1 to pin 2 3

CAD (KiCad official)

  • Symbol: ESD5621W10-2
  • Footprint: Diode_SMD:D_SOD-323F
  • 3D model: SOD-323F (KiCad packages3D, STEP)
  • 3D model files: esd5621w10-2-etched.step / esd5621w10-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd5621w10-2.step / esd5621w10-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI(Will Semicon) datasheet (6 pp, sha256 fcc9b68db464cac6, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF