component
ESD5621W04-2
Public Made by Adomby adom
WILLSEMI(Will Semicon) ESD Protection Devices, SOD-323F. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownESD5621W04-2
WILLSEMI(Will Semicon) · ESD Protection Devices · SOD-323F
ESD5621W04-2 from WILLSEMI(Will Semicon), in a SOD-323F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Pin 1 | passive | Terminal of the 1-line uni-directional TVS (VRWM 4.5V, VBR 5.2-7.0V at 1mA for ESD5621W04), with clamping voltage measured from pin 1 to pin 2. |
| 2 | Pin 2 | passive | Second terminal of the 1-line uni-directional TVS, the reference terminal for clamping voltage measured from pin 1 to pin 2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | WILLSEMI(Will Semicon) |
| Package | SOD-323F |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse stand-off voltage | VRWM | 4.5 | V | 3 | |||
| Breakdown voltage | VBR | 5.2 | 6.1 | 7 | V | IBR = 1mA | 3 |
| Reverse leakage current | IRM | 5 | μA | at VRWM | 3 | ||
| Forward voltage | VF | 0.45 | 1.25 | V | IF = 20mA | 3 | |
| Junction capacitance | CJ | 900 | 1200 | pF | F = 1MHz, VR = 0V | 3 | |
| Rated peak pulse current | IPP | 95 | A | 8/20μs, non-repetitive, pin 1 to pin 2 | 3 | ||
| Clamping voltage at IPP | VCL | 14.5 | V | at IPP, 8/20μs, pin 1 to pin 2 | 3 | ||
| Clamping voltage at IPP = 16A | VCL | 7 | V | IPP = 16A, tp = 100ns, IEC61000-4-2, pin 1 to pin 2 | 3 | ||
| Clamping voltage at VESD = 8kV | VCL | 8 | V | VESD = 8kV, IEC61000-4-2, pin 1 to pin 2 | 3 | ||
| Peak pulse power | Ppk | 1400 | W | tp=8/20μs | 2 | ||
| ESD air discharge | VESD | -30 | 30 | kV | IEC61000-4-2 air discharge | 2 | |
| ESD contact discharge | VESD | -30 | 30 | kV | IEC61000-4-2 contact discharge | 2 | |
| Junction temperature | TJ | 125 | °C | 2 | |||
| Operating temperature | TOP | -40 | 85 | °C | 2 | ||
| Lead temperature | TL | 260 | °C | 2 | |||
| Storage temperature | TSTG | -55 | 150 | °C | 2 |
CAD (KiCad official)
- Symbol:
ESD5621W04-2 - Footprint:
Diode_SMD:D_SOD-323F - 3D model: SOD-323F (KiCad packages3D, STEP)
- 3D model files:
esd5621w04-2-etched.step/esd5621w04-2-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd5621w04-2.step/esd5621w04-2.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: WILLSEMI(Will Semicon) datasheet (6 pp, sha256
fcc9b68db464cac6, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).