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ESD56131W-2

WILLSEMI Will Semicon · ESD And Surge Protection (TVS/ESD) · SOD-323F

ESD56131W-2 from WILLSEMI Will Semicon, in a SOD-323F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive One terminal of the bi-directional TVS, rated for a reverse stand-off voltage of ±4.6V and ±30kV ESD (contact and air) per IEC61000-4-2; the datasheet gives no pin-specific limits.
2 Pin2 passive The other terminal of the bi-directional TVS, rated for a reverse stand-off voltage of ±4.6V and ±30kV ESD (contact and air) per IEC61000-4-2; the datasheet gives no pin-specific limits.

Key specifications

Parameter Value
Manufacturer WILLSEMI Will Semicon
Package SOD-323F
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse maximum working voltage VRWM -4.6 4.6 V 3
Reverse leakage current IR 1 μA VRWM = 4.6V 3
Reverse breakdown voltage VBR 4.8 V IBR = 1mA 3
Reverse holding voltage VHOLD 4.8 V IHOLD = 50mA 3
Clamping voltage (ESD, contact discharge) VCL 8 V VESD = 8kV 3
Clamping voltage (surge) VCL 6 V IPP = 1A, tp = 8/20μs 3
Clamping voltage (surge) VCL 10 V IPP = 50A, tp = 8/20μs 3
Clamping voltage (surge) VCL 14 V IPP = 100A, tp = 8/20μs 3
Junction capacitance CJ 250 300 pF VR = 0V, f = 1MHz 3
Peak pulse power Ppk 1400 W tp = 8/20μs 2
Peak pulse current IPP 100 A tp = 8/20μs 2
ESD according to IEC61000-4-2 air discharge VESD -30 30 kV 2
ESD according to IEC61000-4-2 contact discharge VESD -30 30 kV 2
Junction temperature TJ 125 oC 2
Operating temperature TOP -40 85 oC 2
Lead temperature TL 260 oC 2
Storage temperature TSTG -55 150 oC 2

CAD (KiCad official)

  • Symbol: ESD56131W-2
  • Footprint: Diode_SMD:D_SOD-323F
  • 3D model: SOD-323F (KiCad packages3D, STEP)
  • 3D model files: esd56131w-2-etched.step / esd56131w-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd56131w-2.step / esd56131w-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI Will Semicon datasheet (6 pp, sha256 209c0ca4da9e0879, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF