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ESD5491S-2

WILLSEMI(Will Semicon) · ESD Protection Devices · SOD-523

ESD5491S-2 from WILLSEMI(Will Semicon), in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive Bi-directional TVS terminal 1 (circuit diagram Pin1), protects one line with stand-off voltage of ±3.3V max and ±30kV IEC61000-4-2 contact ESD rating; interchangeable with Pin2.
2 Pin2 passive Bi-directional TVS terminal 2 (circuit diagram Pin2), protects one line with stand-off voltage of ±3.3V max and 9A (8/20μs) peak pulse current; interchangeable with Pin1.

Key specifications

Parameter Value
Manufacturer WILLSEMI(Will Semicon)
Package SOD-523
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse stand-off voltage VRWM -3.3 3.3 V 3
Reverse leakage current IR 11 100 nA VRWM = 3.3V 3
Reverse breakdown voltage VBR 3.3 V IBR = 1mA 3
Reverse holding voltage VHOLD 3.3 V IHOLD = 50mA 3
Junction capacitance CJ 9.9 12 pF VR = 0V, f = 1MHz 3
Junction capacitance CJ 7.4 9 pF VR = 3.3V, f = 1MHz 3
Clamping voltage (TLP) VCL 9 V IPP = 16A, tp = 100ns 3
Clamping voltage (contact discharge) VCL 9 V VESD = 8kV 3
Clamping voltage VCL 6 V IPP = 1A, tp = 8/20μs 3
Clamping voltage VCL 8 V IPP = 5A, tp = 8/20μs 3
Clamping voltage VCL 10 V IPP = 9A, tp = 8/20μs 3
Dynamic resistance RDYN 0.2 Ω 3
Peak pulse power Ppk 90 W tp = 8/20μs 2
Peak pulse current IPP 9 A tp = 8/20μs 2
ESD air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Operation junction temperature TJ 125 °C 2
Lead temperature TL 260 °C 2
Storage temperature TSTG -55 150 °C 2

CAD (KiCad official)

  • Symbol: ESD5491S-2
  • Footprint: Diode_SMD:D_SOD-523
  • 3D model: SOD-523 (KiCad packages3D, STEP)
  • 3D model files: esd5491s-2-etched.step / esd5491s-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd5491s-2.step / esd5491s-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI(Will Semicon) datasheet (7 pp, sha256 413b836f01cc9241, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF