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Ray Publish 0.1.0 853e0f2 13d ago

ESD5431N-2

WILLSEMI(Will Semicon) · TVS · DFN1006-2L

ESD5431N-2 from WILLSEMI(Will Semicon), in a DFN1006-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Pin1 passive Pin 1 is one terminal of the bi-directional TVS, which is rated for a reverse stand-off voltage of ±3.3V max and is protected in both directions (Pin2 to Pin1 and Pin1 to Pin2 are both characterized).
2 Pin2 passive Pin 2 is the other terminal of the bi-directional TVS, which is rated for a reverse stand-off voltage of ±3.3V max and is protected in both directions (Pin2 to Pin1 and Pin1 to Pin2 are both characterized).

Key specifications

Parameter Value
Manufacturer WILLSEMI(Will Semicon)
Package DFN1006-2L
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power Ppk 100 W tp = 8/20μs 2
Peak pulse current IPP 10 A tp = 8/20μs 2
ESD according to IEC61000-4-2 air discharge VESD -30 30 kV IEC61000-4-2 air discharge 2
ESD according to IEC61000-4-2 contact discharge VESD -30 30 kV IEC61000-4-2 contact discharge 2
Reverse stand-off voltage VRWM -3.3 3.3 V 3
Reverse leakage current IR 1 100 nA VRWM = 3.3V 3
Junction capacitance CJ 17.5 22 pF VR = 0V, f = 1MHz 3
Junction capacitance CJ 12.5 16 pF VR = 3.3V, f = 1MHz 3
Operating temperature TOP -40 85 oC 2
Junction temperature TJ 125 oC 2
Lead temperature TL 260 oC 2
Storage temperature TSTG -55 150 oC 2
Reverse breakdown voltage VBR 3.4 V IBR = 1mA 3
Reverse holding voltage VHOLD 3.4 V IHOLD = 50mA 3
Clamping voltage 1) VCL 8 V IPP = 16A, tp = 100ns (TLP) 3
Clamping voltage 2) VCL 8 V VESD = 8kV (contact discharge) 3
Clamping voltage 3) VCL 6 V IPP = 1A, tp = 8/20μs 3
Clamping voltage 3) VCL 8 V IPP = 5A, tp = 8/20μs 3
Clamping voltage 3) VCL 10 V IPP = 10A, tp = 8/20μs 3
Dynamic resistance RDYN 0.2 Ω TLP, calculated from 4A to 16A 3

CAD (KiCad official)

  • Symbol: ESD5431N-2
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2L (KiCad packages3D, STEP)
  • 3D model files: esd5431n-2-etched.step / esd5431n-2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd5431n-2.step / esd5431n-2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: WILLSEMI(Will Semicon) datasheet (7 pp, sha256 08bb7e55ed958ed3, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF