Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

ESD5425E-MS

MSKSEMI · ESD Protection Devices · SOT-23-6

ESD5425E-MS from MSKSEMI, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 I/O 1 passive Protected data/power line connection with 0.6 pF typ. (1.0 pF max) capacitance to other I/O pins and 1.2 pF typ. (2.0 pF max) to GND at VR=0V, f=1MHz.
2 GND power_in Ground reference for the steering diodes, connected to the anode side of the clamp.
3 I/O 3 passive Protected data/power line connection with 0.6 pF typ. (1.0 pF max) capacitance to other I/O pins and 1.2 pF typ. (2.0 pF max) to GND at VR=0V, f=1MHz.
4 I/O 4 passive Protected data/power line connection with 0.6 pF typ. (1.0 pF max) capacitance to other I/O pins and 1.2 pF typ. (2.0 pF max) to GND at VR=0V, f=1MHz.
5 Vcc power_in Positive rail connected to the TVS diode cathode, with reverse stand-off voltage VRWM of 5.0 V max and breakdown voltage VBR of 6 V min at 1 mA.
6 I/O 6 passive Protected data/power line connection with 0.6 pF typ. (1.0 pF max) capacitance to other I/O pins and 1.2 pF typ. (2.0 pF max) to GND at VR=0V, f=1MHz.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23-6
Category TVS/Fuse/Board Level Protection
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Junction Capacitance IO to IO Cj 0.6 1 pF VR = 0V, f = 1MHz, IO to IO 3
Junction Capacitance IO to GND Cj 1.2 2 pF VR = 0V, f = 1MHz, IO to GND 3
Peak Pulse Power PPP 250 W tp = 8/20μs 3
Peak Pulse Current Ipp 12 A tp = 8/20μs (note 1) 3
ESD per IEC 61000-4-2 (Air) VESD 15 kV IEC 61000-4-2 air discharge 3
ESD per IEC 61000-4-2 (Contact) VESD 12 kV IEC 61000-4-2 contact discharge 3
Lead Soldering Temperature TL 260 ℃ 10 seconds 3
Junction Temperature TJ -55 125 ℃ 3
Storage Temperature Tstg -55 125 ℃ 3
Reverse Stand-Off Voltage VRWM 5 V 3
Reverse Breakdown Voltage VBR 6 V IT = 1mA 3
Reverse Leakage Current IR 1 uA VRWM = 5V, T = 25℃ 3
Peak Pulse Current IPP 12 A tp = 8/20μs 3
Clamping Voltage VC 20 V IPP = 12A, tp = 8/20μs 3

CAD (KiCad official)

  • Symbol: ESD5425E-MS
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: esd5425e-ms-etched.step / esd5425e-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd5425e-ms.step / esd5425e-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (6 pp, sha256 a81425c981448607, retrieved 2026-11-04, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF