# ESD3Z6V0

**CBI** · ESD And Surge Protection (TVS/ESD) · SOD-323

ESD3Z6V0 from CBI, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode of the unidirectional TVS diode; ESD3Z6V0 has 6 V reverse stand-off voltage, 6.8 V min breakdown at 1 mA and 12.4 V max clamping at 5 A (8/20 µs). |
| 2 | Anode | passive | Anode of the TVS diode, normally connected to ground; device withstands 30 kV ESD (IEC61000-4-2 HRB) and 24 A peak pulse current (8/20 µs). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | CBI |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-off Voltage | VRWM |  |  | 6 | V | Ta = 25 °C | 1 |
| Reverse Current | IR |  |  | 5 | µA | at VRWM | 1 |
| Breakdown Voltage | VBR | 6.8 |  |  | V | at IT = 1 mA | 1 |
| Clamping Voltage | VC |  |  | 12.4 | V | at IPP = 5 A, tp = 8/20 µs | 1 |
| Clamping Voltage | VC |  |  | 20.5 | V | at IPP = 8.8 A, tp = 8/20 µs | 1 |
| Capacitance | Cj |  |  | 70 | pF | f = 1 MHz | 1 |
| Forward Voltage | VF |  |  | 0.9 | V | IF = 10 mA | 1 |
| Peak Pulse Power | Ppk |  |  | 350 | W | tp = 8/20 µs, Ta = 25 °C | 1 |
| Peak Pulse Current | IPP |  |  | 24 | A | tp = 8/20 µs, Ta = 25 °C | 1 |
| ESD Voltage | VPP |  |  | 30 | KV | HRB Waveform per IEC61000-4-2 | 1 |
| Operating Junction Temperature | Tj | -55 |  | 125 | °C |  | 1 |
| Storage Temperature Range | Tstg | -55 |  | 150 | °C |  | 1 |

## CAD (KiCad official)

- Symbol: `ESD3Z6V0`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `esd3z6v0-etched.step` / `esd3z6v0-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esd3z6v0.step` / `esd3z6v0.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [CBI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590921055437873152) (3 pp, sha256 `5aceb669a47152d0`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esd3z6v0-datasheet.pdf)