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ESD3Z5.0C-HXY

HXY MOSFET · ESD And Surge Protection (TVS/ESD) · SOD-323

ESD3Z5.0C-HXY from HXY MOSFET, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation.
2 2 passive Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOD-323
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse working peak voltage VRWM 5 V 2
Reverse leakage current IR 1 uA @ VRWM 2
Breakdown voltage VBR 5.6 V @ IT (Note 1), IT = 1.0 mA; pulse test current at 25°C 2
Clamping voltage at max peak pulse current VC 9 V @ Max IPP; surge current waveform per Figure 1 2
Peak pulse current IPP 11 A Surge current waveform per Figure 1 2
Peak pulse power PPK 100 W Surge current waveform per Figure 1 2
Clamping voltage VC 8 V @ IPP = 5 A; surge current waveform per Figure 1 2
Device capacitance C 20 pF 2
Peak pulse power PPP 100 W tp = 8/20 μs 1
Maximum lead temperature for soldering TL 260 °C during 10 s 1
Storage temperature range Tstg -55 155 °C 1
Operating temperature range Top -40 125 °C 1
Maximum junction temperature Tj 150 °C 1
ESD withstand, air discharge IEC61000-4-2 (ESD) -15 15 KV IEC61000-4-2 (ESD) air discharge; printed ±15 1
ESD withstand, contact discharge IEC61000-4-2 (ESD) -8 8 KV IEC61000-4-2 (ESD) contact discharge; printed ±8 1
EFT protection IEC61000-4-4 (EFT) 40 A IEC61000-4-4 (EFT) 1
ESD voltage, human body model 16 KV Per Human Body Model 1

CAD (KiCad official)

  • Symbol: ESD3Z5.0C-HXY
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: esd3z5-0c-hxy-etched.step / esd3z5-0c-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd3z5-0c-hxy.step / esd3z5-0c-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 91eba316148479af, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF