# ESD3Z3V3BU

**MDD（Microdiode Electronics）** · ESD Protection Devices · SOD-323

ESD3Z3V3BU from MDD（Microdiode Electronics）, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Pin 1 is one terminal of the single-line ESD protection diode, which the datasheet rates for 3.3V reverse working voltage, 0.25pF typical capacitance, and ±15kV air / ±8kV contact IEC 61000-4-2 protection. |
| 2 | 2 | passive | Pin 2 is the other terminal of the single-line ESD protection diode, which the datasheet rates for 3.3V reverse working voltage, 0.25pF typical capacitance, and ±15kV air / ±8kV contact IEC 61000-4-2 protection. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MDD（Microdiode Electronics） |
| Package | SOD-323 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Working Voltage | VRWM |  |  | 3.3 | V |  | 2 |
| Reverse Breakdown Voltage | VBR | 4.2 |  |  | V | IT = 1mA | 2 |
| Reverse Leakage Current | IR |  |  | 100 | nA | VRWM = 3.3V | 2 |
| Clamping Voltage | VC |  |  | 12 | V | IPP = 1A, tp = 8/20μs | 2 |
| Clamping Voltage | VC |  |  | 25 | V | IPP = 4A, tp = 8/20μs | 2 |
| Junction Capacitance | CJ |  | 0.25 | 0.4 | pF | VR = 0V, f = 1MHz | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -20 |  | 20 | KV | ESD per IEC 61000-4-2 (Air) | 1 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -20 |  | 20 | KV | ESD per IEC 61000-4-2 (Contact) | 1 |
| Peak Pulse Power | PPP |  |  | 100 | W | 8/20us | 1 |
| Operating Temperature | TOPT | -55 |  | 125 | °C |  | 1 |
| Lead Solder Temperature - Maximum | TL |  |  | 260 | °C | 10 second duration | 1 |
| Storage Temperature | TSTG | -55 |  | 150 | °C |  | 1 |

## CAD (KiCad official)

- Symbol: `ESD3Z3V3BU`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `esd3z3v3bu-etched.step` / `esd3z3v3bu-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esd3z3v3bu.step` / `esd3z3v3bu.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MDD（Microdiode Electronics） datasheet](docs/esd3z3v3bu-datasheet.pdf) (4 pp, sha256 `aa34183650a93ae0`, retrieved 2026-11-05, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esd3z3v3bu-datasheet.pdf)