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ESD3Z12V0
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EIC Semicon ESD Protection Devices, SOD-323. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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ESD3Z12V0
EIC Semicon · ESD Protection Devices · SOD-323
ESD3Z12V0 from EIC Semicon, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the ESD suppressor diode, as printed in the PINNING table of the SOD-323 package; the datasheet states no further pin-level limits. |
| 2 | Anode | passive | Anode terminal of the ESD suppressor diode, as printed in the PINNING table of the SOD-323 package; the datasheet states no further pin-level limits. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | EIC Semicon |
| Package | SOD-323 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-off Voltage | VRWM | 12 | V | 1 | |||
| Reverse Current | IR | 1 | µA | at VRWM | 1 | ||
| Breakdown Voltage | VBR | 13.3 | V | at IT 1 mA | 1 | ||
| Clamping Voltage | VC | 19 | V | at IPP 5 A, tp = 8/20 µs | 1 | ||
| Clamping Voltage | VC | 25 | V | at IPP 15 A, tp = 8/20 µs | 1 | ||
| Capacitance | Cj | 150 | pF | at f 1 MHz | 1 | ||
| Peak Pulse Power | Ppk | 350 | W | tp = 8/20 µs | 1 | ||
| Peak Pulse Current | IPP | 24 | A | tp = 8/20 µs | 1 | ||
| ESD Voltage | VPP | 30 | KV | HRB Waveform per IEC61000-4-2 | 1 | ||
| Operating Junction Temperature | Tj | -55 | 125 | °C | 1 | ||
| Storage Temperature Range | Tstg | -55 | 150 | °C | 1 |
CAD (KiCad official)
- Symbol:
ESD3Z12V0 - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
esd3z12v0-etched.step/esd3z12v0-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);esd3z12v0.step/esd3z12v0.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: EIC Semicon datasheet (3 pp, sha256
7a58f608908cea37, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ESD3Z12V0
**EIC Semicon** · ESD Protection Devices · SOD-323
ESD3Z12V0 from EIC Semicon, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Cathode | passive | Cathode terminal of the ESD suppressor diode, as printed in the PINNING table of the SOD-323 package; the datasheet states no further pin-level limits. |
| 2 | Anode | passive | Anode terminal of the ESD suppressor diode, as printed in the PINNING table of the SOD-323 package; the datasheet states no further pin-level limits. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | EIC Semicon |
| Package | SOD-323 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Stand-off Voltage | VRWM | | | 12 | V | | 1 |
| Reverse Current | IR | | | 1 | µA | at VRWM | 1 |
| Breakdown Voltage | VBR | 13.3 | | | V | at IT 1 mA | 1 |
| Clamping Voltage | VC | | | 19 | V | at IPP 5 A, tp = 8/20 µs | 1 |
| Clamping Voltage | VC | | | 25 | V | at IPP 15 A, tp = 8/20 µs | 1 |
| Capacitance | Cj | | | 150 | pF | at f 1 MHz | 1 |
| Peak Pulse Power | Ppk | | | 350 | W | tp = 8/20 µs | 1 |
| Peak Pulse Current | IPP | | | 24 | A | tp = 8/20 µs | 1 |
| ESD Voltage | VPP | | | 30 | KV | HRB Waveform per IEC61000-4-2 | 1 |
| Operating Junction Temperature | Tj | -55 | | 125 | °C | | 1 |
| Storage Temperature Range | Tstg | -55 | | 150 | °C | | 1 |
## CAD (KiCad official)
- Symbol: `ESD3Z12V0`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `esd3z12v0-etched.step` / `esd3z12v0-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esd3z12v0.step` / `esd3z12v0.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [EIC Semicon datasheet](docs/esd3z12v0-datasheet.pdf) (3 pp, sha256 `7a58f608908cea37`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/esd3z12v0-datasheet.pdf)