# ESD3C24V01V

**JF** · ESD Protection Devices · SOD-323

ESD3C24V01V from JF, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One terminal of the bidirectional TVS diode, rated for a reverse stand-off voltage (VRWM) of 24.0 V with a reverse breakdown voltage (VBR) of 26.7 V minimum at IT = 1 mA. |
| 2 | 2 | passive | Other terminal of the bidirectional TVS diode, with the same 24.0 V reverse stand-off voltage and 26.7 V breakdown voltage rating as pin 1. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | JF |
| Package | SOD-323 |
| Category | TVS/Fuse/Board Level Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power (tp=8/20μs) | PPP |  |  | 300 | Watts | tp=8/20μs | 2 |
| Peak Pulse Current (tp=8/20μs) (note1) | Ipp |  |  | 6 | A | tp=8/20μs | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD |  |  | 20 | kV |  | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD |  |  | 15 | kV |  | 2 |
| Junction Temperature | TJ | -55 |  | 150 | ℃ |  | 2 |
| Storage Temperature | Tstg | -55 |  | 150 | ℃ |  | 2 |
| Lead Soldering Temperature | TL |  |  | 260 | ℃ | 10 seconds | 2 |
| Reverse Stand-Off Voltage | VRWM |  | 24 |  | V |  | 2 |
| Reverse Breakdown Voltage | VBR |  | 26.7 |  | V | IT=1mA | 2 |
| Reverse Leakage Current | IR |  | 0.5 |  | uA | VRWM=24V, T=25℃ | 2 |
| Clamping Voltage | VC |  | 50 |  | V | IPP=6A, tp=8/20μs | 2 |
| Junction Capacitance | Cj |  | 15 |  | pF | VR=0V, f=1MHz | 2 |

## CAD (KiCad official)

- Symbol: `ESD3C24V01V`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `esd3c24v01v-etched.step` / `esd3c24v01v-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `esd3c24v01v.step` / `esd3c24v01v.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [JF datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588912459793383424) (4 pp, sha256 `6d309b6dc80f79f2`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/esd3c24v01v-datasheet.pdf)