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Contents

README

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ESD0502B-HXY

HXY MOSFET · TVS · SOT-523

ESD0502B-HXY from HXY MOSFET, in a SOT-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IO1 passive Protected line 1 connects to a unidirectional TVS diode with VRWM 5 V max, VBR 6 V min at 1 mA, VC 25 V max at IPP 4 A and 0.5 pF typ capacitance.
2 IO2 passive Protected line 2 connects to a unidirectional TVS diode with VRWM 5 V max, VBR 6 V min at 1 mA, VC 25 V max at IPP 4 A and 0.5 pF typ capacitance.
3 GND power_in Common node of the two unidirectional TVS diodes, taken as the ground reference, with IEC61000-4-2 protection of ±15 kV air and ±8 kV contact discharge.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-523
Category TVS/Fuse/Board Level Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak Pulse Power (tp = 8/20μs) PPP 100 W tp = 8/20μs, Tamb=25°C 1
Storage Temperature Range Tstg -55 150 °C 1
Operating Temperature Range Top -40 125 °C 1
Maximum junction temperature Tj 150 °C 1
Maximum lead temperature for soldering TL 260 °C during 10s 1
IEC61000-4-2 (ESD) air discharge -15 15 KV IEC61000-4-2, air discharge 1
IEC61000-4-2 (ESD) contact discharge -8 8 KV IEC61000-4-2, contact discharge 1
Reverse working voltage VRWM 5 V 2
Breakdown voltage VBR 6 V IT = 1 mA, pulse test (Note 1), 25°C 2
Reverse leakage current IR 0.5 uA @ VRWM 2
Clamping voltage VC 25 V @ IPP = 4 A (Max IPP) 2
Device capacitance C 0.5 pF 2

CAD (KiCad official)

  • Symbol: ESD0502B-HXY
  • Footprint: Package_TO_SOT_SMD:SOT-523
  • 3D model: SOT-523, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.8 mm nominal SOT-523 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: esd0502b-hxy-etched.step / esd0502b-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); esd0502b-hxy.step / esd0502b-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (4 pp, sha256 1ec5372883e2b39b, retrieved 2026-11-05, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF