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ES8JC

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Shandong Jingdao Microelectronics Diodes - Fast Recovery Rectifiers, SMC. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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es8jc-hero.glb es8jc: hero GLB from the etched model (keeps the MPN mark) · Ray 13d ago
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ES8JC

Shandong Jingdao Microelectronics · Diodes - Fast Recovery Rectifiers · SMC

ES8JC from Shandong Jingdao Microelectronics, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the ES8JC superfast recovery rectifier, which the datasheet rates for 600 V VRRM and 8 A average forward current.
2 Anode passive Anode terminal of the ES8JC superfast recovery rectifier, which the datasheet rates for 600 V VRRM and 8 A average forward current.

Key specifications

Parameter Value
Manufacturer Shandong Jingdao Microelectronics
Package SMC
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Peak Reverse Voltage VRRM 600 V ES8JC column (600 V) 1
Maximum RMS Voltage VRMS 420 V ES8JC column (600 V) 1
Maximum DC Blocking Voltage VDC 600 V ES8JC column (600 V) 1
Maximum Average Forward Rectified Current IF(AV) 8 A at Tc = 100 °C 1
Peak Forward Surge Current IFSM 125 A 8.3 ms single half sine wave superimposed on rated load 1
Maximum Forward Voltage VF 1.7 V at 8 A, ES8JC column 1
Operating and Storage Temperature Range Tj, Tstg -55 150 °C 1
Typical Thermal Resistance, junction to ambient RθJA 75 °C/W P.C.B. mounted with 2.0" x 2.0" (5 x 5 cm) copper pad areas 1
Typical Thermal Resistance, junction to lead RθJL 20 °C/W 1

CAD (KiCad official)

  • Symbol: ES8JC
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC (KiCad packages3D, STEP)
  • 3D model files: es8jc-etched.step / es8jc-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); es8jc.step / es8jc.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shandong Jingdao Microelectronics datasheet (3 pp, sha256 e4d577c5b565e9f2, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF