component

ES5G

Public Made by Adom

by adom

BORN Fast Recovery / High Efficiency Diodes, SMC. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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ES5G

BORN · Fast Recovery / High Efficiency Diodes · SMC

ES5G from BORN, in a SMC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer BORN
Package SMC
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Max. Recurrent Peak Reverse Voltage (ES5G column) VRRM 400 V 2
Maximum RMS Voltage (ES5G column) VRMS 280 V 2
Maximum DC Blocking Voltage (ES5G column) VDC 400 V 2
Maximum Average Forward Rectified Current IAV 5 A 2
Forward Surge Current IFSM 150 A Half-sine wave, 1 cycle, Tj=25°C 2
Forward Surge Current IFSM 300 A @1ms, square wave, 1 cycle, Tj=25°C 2
Max. DC reverse current IR 5 uA Tj=25°C 2
Max. DC reverse current IR 100 uA Tj=125°C 2
Current squared time I2t 94 A2s @1ms≤t≤8.3ms Tj=25°C 2
Maximum reverse recovery time trr 35 ns @IF=0.5A, IR=1.0A, Irr=0.25A 2
Typical Thermal Resistance, junction to ambient RθJA 50 °C/W Mounted on P.C.B. with 0.6 x 0.6 in (16 x 16 mm) copper pad areas (note 1) 2
Typical Thermal Resistance, junction to lead RθJL 15 °C/W Mounted on P.C.B. with 0.6 x 0.6 in (16 x 16 mm) copper pad areas (note 1) 2
Typical Thermal Resistance, junction to case RθJC 12 °C/W 2
Operating Junction Temperature Range TJ -55 150 °C 2
Storage Temperature Range TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper Note1: (1)Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.6” x 0.6” (16 mm x 16 mm) copper pad areas 2

CAD (KiCad official)

  • Symbol: ES5G
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC (KiCad packages3D, STEP)
  • 3D model files: es5g-etched.step / es5g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); es5g.step / es5g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: BORN datasheet (4 pp, sha256 4cb1a4c5226f3bdc, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF