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ES3GBG

Shikues · Fast Recovery / High Efficiency Diodes · SMB

ES3GBG from Shikues, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode of the superfast recovery rectifier, shown in the PINNING table as pin 1 of the SMB package; the device is rated for 3 A average forward current.
2 Anode passive Anode of the superfast recovery rectifier, shown in the PINNING table as pin 2 of the SMB package; the device is rated for 3 A average forward current.

Key specifications

Parameter Value
Manufacturer Shikues
Package SMB
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Peak Reverse Voltage VRRM 400 V ES3GBG column (400 V) of the 50 to 600 V rating row 1
Maximum RMS Voltage VRMS 280 V ES3GBG column (400 V) of the RMS voltage row 1
Maximum DC Blocking Voltage VDC 400 V ES3GBG column; column assignment inferred from the column order of the VRRM row 1
Maximum Average Forward Rectified Current IF(AV) 3 A Tc = 100 °C 1
Peak Forward Surge Current IFSM 90 A 8.3 ms single half sine wave superimposed on rated load 1
Maximum Forward Voltage VF 1.25 V at 3 A 1
Maximum DC Reverse Current IR 5 μA Ta = 25 °C at rated DC blocking voltage 1
Maximum DC Reverse Current IR 100 μA Ta = 125 °C at rated DC blocking voltage 1
Maximum Reverse Recovery Time trr 35 ns IF = 0.5 A, IR = 1 A, Irr = 0.25 A 1
Operating and Storage Temperature Range Tj, Tstg -55 150 °C 1
Typical Thermal Resistance junction to ambient RθJA 50 °C/W P.C.B. mounted with 2.0 in x 2.0 in (5 x 5 cm) copper pad areas 1
Typical Thermal Resistance junction to case RθJC 16 °C/W 1

CAD (KiCad official)

  • Symbol: ES3GBG
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB (KiCad packages3D, STEP)
  • 3D model files: es3gbg-etched.step / es3gbg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); es3gbg.step / es3gbg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Shikues datasheet (3 pp, sha256 4a16bce6817e143b, retrieved 2026-10-14, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF