component

ES3D

Public Made by Adom

by adom

onsemi Diodes - General Purpose, SMC(DO-214AB). Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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ES3D

onsemi · Diodes - General Purpose · SMC(DO-214AB)

ES3D from onsemi, in a SMC(DO-214AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer onsemi
Package SMC(DO-214AB)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Repetitive Reverse Voltage VRRM 200 V 2
Average Rectified Forward Current IF(AV) 3 A .375 in lead length at TA = 75°C 2
Non-Repetitive Peak Forward Surge Current IFSM 100 A 8.3 ms single half-sine wave 2
Operating Junction and Storage Temperature Range TJ, TSTG -50 150 °C 2
Maximum Forward Voltage VF 0.95 V IF = 3.0 A 3
Reverse Recovery Time trr 20 30 ns IF = 0.5 A, IR = 1.0 A, IRR = 0.25 A 3
Maximum Reverse Current at Rated VR IR 10 μA TA = 25C 3
Maximum Reverse Current at Rated VR IR 500 μA TA = 100C 3
Total Capacitance CT 45 pF VR = 4.0 V, f = 1.0 MHz 3
Thermal Resistance, Junction to Ambient (maximum land pattern 16 x 16 mm) RJA 47 C/W Device mounted on FR-4 PCB; maximum land pattern 16 x 16 mm 3
Thermal Resistance, Junction to Ambient (minimum land pattern 2.6 x 3.2 mm) RJA 125 C/W Device mounted on FR-4 PCB; minimum land pattern 2.6 x 3.2 mm 3
Thermal Resistance, Junction to Lead (maximum land pattern 16 x 16 mm) RJL 12 C/W Device mounted on FR-4 PCB; maximum land pattern 16 x 16 mm 3
Thermal Resistance, Junction to Lead (minimum land pattern 2.6 x 3.2 mm) RJL 16 C/W Device mounted on FR-4 PCB; minimum land pattern 2.6 x 3.2 mm 3
Power Dissipation PD 1.66 W 3

CAD (KiCad official)

  • Symbol: ES3D
  • Footprint: Diode_SMD:D_SMC
  • 3D model: SMC(DO-214AB) (KiCad packages3D, STEP)
  • 3D model files: es3d-etched.step / es3d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); es3d.step / es3d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (6 pp, sha256 a69bf07008365cf1, retrieved 2026-10-21, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF