component
ES3B
Public Made by Adomby adom
onsemi Diodes - Fast Recovery Rectifiers, DO-214AB(SMC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownES3B
onsemi · Diodes - Fast Recovery Rectifiers · DO-214AB(SMC)
ES3B from onsemi, in a DO-214AB(SMC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, marked by the color band on the SMC/DO-214AB body; ES3B is rated 100 V VRRM and 3.0 A average rectified forward current. |
| 2 | A | passive | Anode, the terminal opposite the color band; ES3B has 100 V maximum repetitive reverse voltage and 100 A non-repetitive peak surge current (8.3 ms half-sine). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | DO-214AB(SMC) |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum Forward Voltage | VF | 0.95 | V | IF = 3.0 A | 3 | ||
| Reverse Recovery Time | trr | 20 | 30 | ns | IF = 0.5 A, IR = 1.0 A, IRR = 0.25 A | 3 | |
| Maximum Reverse Current at Rated VR | IR | 10 | µA | TA = 25C | 3 | ||
| Maximum Reverse Current at Rated VR | IR | 500 | µA | TA = 100C | 3 | ||
| Total Capacitance | CT | 45 | pF | VR = 4.0 V, f = 1.0 MHz | 3 | ||
| Maximum Repetitive Reverse Voltage | VRRM | 100 | V | 2 | |||
| Average Rectified Forward Current | IF(AV) | 3 | A | .375" Lead Length at TA = 75°C | 2 | ||
| Non-Repetitive Peak Forward Surge Current | IFSM | 100 | A | 8.3 ms Single Half-Sine Wave | 2 | ||
| Operating Junction and Storage Temperature Range | TJ, TSTG | -50 | 150 | °C | 2 | ||
| Power Dissipation | PD | 1.66 | W | TA = 25°C | 3 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 47 | °C/W | Maximum Land Pattern: 16 x 16 mm; device mounted on FR-4 PCB | 3 | ||
| Thermal Resistance, Junction to Ambient | RθJA | 125 | °C/W | Minimum Land Pattern: 2.6 x 3.2 mm; device mounted on FR-4 PCB | 3 | ||
| Thermal Resistance, Junction to Lead | RθJL | 12 | °C/W | Maximum Land Pattern: 16 x 16 mm; device mounted on FR-4 PCB | 3 | ||
| Thermal Resistance, Junction to Lead | RθJL | 16 | °C/W | Minimum Land Pattern: 2.6 x 3.2 mm; device mounted on FR-4 PCB | 3 |
CAD (KiCad official)
- Symbol:
ES3B - Footprint:
Diode_SMD:D_SMC - 3D model: DO-214AB(SMC) (KiCad packages3D, STEP)
- 3D model files:
es3b-etched.step/es3b-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);es3b.step/es3b.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (6 pp, sha256
20ac04b31169ac10, retrieved 2026-10-23, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).