component

ES1F

Public Made by Adom

by adom

ONSEMI Global Sourcing Parts, SMA(DO-214AC). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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ES1F

ONSEMI · Global Sourcing Parts · SMA(DO-214AC)

ES1F from ONSEMI, in a SMA(DO-214AC). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode terminal of the rectifier diode; the color band on the SMA package denotes the cathode.
2 ANODE passive Anode terminal of the rectifier diode, opposite the cathode band.

Key specifications

Parameter Value
Manufacturer ONSEMI
Package SMA(DO-214AC)
Category Global Sourcing Parts
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Forward Voltage VF 1.3 V @ IF = 1.0 A 1
Maximum Reverse Current, TA = 25C IR 5 A @ rated VR, TA = 25C 1
Maximum Reverse Current, TA = 100C IR 100 A @ rated VR, TA = 100C 1
Maximum Reverse Recovery Time Trr 35 ns IF = 0.5 A, IR = 1.0 A, IRR = 0.25 A 1
Typical Junction Capacitance Cj 10 pF VR = 4.0 V, f = 1.0 MHz 1
Maximum Repetitive Reverse Voltage VRRM 300 V 1
Average Rectified Forward Current IF(AV) 1 A 1
Non-repetitive Peak Forward Surge Current IFSM 30 A 8.3 ms single half-sine-wave (JEDEC method) 1
Operating Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1
Power Dissipation PD 1.47 W 1
Thermal Resistance, Junction-to-Ambient RθJA 85 °C/W PCB mounted on 0.2 in x 0.2 in (5 x 5 mm) copper pad area (Note 1) 1
Thermal Resistance, Junction-to-Case RθJC 61 °C/W PCB mounted on 0.2 in x 0.2 in (5 x 5 mm) copper pad area (Note 1) 1
Thermal Resistance, Junction-to-Lead RθJL 35 °C/W PCB mounted on 0.2 in x 0.2 in (5 x 5 mm) copper pad area (Note 1) 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper RθJL Thermal Resistance, Junction−to−Lead (Note 1) 35 °C/W 1. P. C. B mounted on 0.2″ × 0.2″ (5 × 5 mm) copper Pad Area. 1

CAD (KiCad official)

  • Symbol: ES1F
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA(DO-214AC) (KiCad packages3D, STEP)
  • 3D model files: es1f-etched.step / es1f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); es1f.step / es1f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ONSEMI datasheet (4 pp, sha256 f8a8cefa6cfcdb8e, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF