component
ES1E
Public Made by Adomby adom
NH Fast Recovery/High Efficiency Diode, SMA. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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ES1E
NH · Fast Recovery/High Efficiency Diode · SMA
ES1E from NH, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | NH |
| Package | SMA |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | 300 | V | 1 | |||
| Maximum RMS voltage | VRMS | 210 | V | 1 | |||
| Maximum DC blocking voltage | VDC | 300 | V | 1 | |||
| Maximum average forward rectified current | IF(AV) | 1 | A | see fig.1 | 1 | ||
| Peak forward surge current | IFSM | 30 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method at rated TL) | 1 | ||
| Maximum instantaneous forward voltage | VF | 1.25 | V | Note 1: pulse width < 300 uS, duty cycle < 2% | 1 | ||
| Maximum instantaneous reverse current at rated DC blocking voltage, Ta=25℃ | IRRM | 5 | uA | Ta=25℃, rated DC blocking voltage (Note 1) | 1 | ||
| Maximum instantaneous reverse current at rated DC blocking voltage, Ta=125℃ | IRRM | 100 | uA | Ta=125℃, rated DC blocking voltage (Note 1) | 1 | ||
| Typical junction capacitance | CJ | 15 | pF | 4V, 1MHz | 1 | ||
| Maximum reverse recovery time | TRR | 30 | ns | IF=0.5A, IR=1.0A, IRR=0.25A | 1 | ||
| Operating junction temperature range | TJ | -55 | 150 | ℃ | Operating junction and storage temperature range | 1 | |
| Storage temperature range | TSTG | -55 | 150 | ℃ | 1 | ||
| Typical thermal resistance, junction to ambient | RθJA | 85 | ℃/W | 1 | |||
| Typical thermal resistance, junction to lead | RθJL | 35 | ℃/W | Note 2: junction to lead, vertical P.C.B. mounted, 0.375"(9.5mm) lead length, polymide PCB, 2 oz copper | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | 2. Thermal resistance from junction to lead vertical P.C.B. mounted , 0.375"(9.5mm)lead length,Polymide PCB, 2 oz Copper. | 1 |
CAD (KiCad official)
- Symbol:
ES1E - Footprint:
Diode_SMD:D_SMA - 3D model: SMA (KiCad packages3D, STEP)
- 3D model files:
es1e-etched.step/es1e-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);es1e.step/es1e.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: NH datasheet (5 pp, sha256
f19c36fc3802f908, retrieved 2026-10-21, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# ES1E
**NH** · Fast Recovery/High Efficiency Diode · SMA
ES1E from NH, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | NH |
| Package | SMA |
| Category | Diodes |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | | | 300 | V | | 1 |
| Maximum RMS voltage | VRMS | | | 210 | V | | 1 |
| Maximum DC blocking voltage | VDC | | | 300 | V | | 1 |
| Maximum average forward rectified current | IF(AV) | | | 1 | A | see fig.1 | 1 |
| Peak forward surge current | IFSM | | | 30 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method at rated TL) | 1 |
| Maximum instantaneous forward voltage | VF | | | 1.25 | V | Note 1: pulse width < 300 uS, duty cycle < 2% | 1 |
| Maximum instantaneous reverse current at rated DC blocking voltage, Ta=25℃ | IRRM | | | 5 | uA | Ta=25℃, rated DC blocking voltage (Note 1) | 1 |
| Maximum instantaneous reverse current at rated DC blocking voltage, Ta=125℃ | IRRM | | | 100 | uA | Ta=125℃, rated DC blocking voltage (Note 1) | 1 |
| Typical junction capacitance | CJ | | 15 | | pF | 4V, 1MHz | 1 |
| Maximum reverse recovery time | TRR | | | 30 | ns | IF=0.5A, IR=1.0A, IRR=0.25A | 1 |
| Operating junction temperature range | TJ | -55 | | 150 | ℃ | Operating junction and storage temperature range | 1 |
| Storage temperature range | TSTG | -55 | | 150 | ℃ | | 1 |
| Typical thermal resistance, junction to ambient | RθJA | | 85 | | ℃/W | | 1 |
| Typical thermal resistance, junction to lead | RθJL | | 35 | | ℃/W | Note 2: junction to lead, vertical P.C.B. mounted, 0.375"(9.5mm) lead length, polymide PCB, 2 oz copper | 1 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | | 2. Thermal resistance from junction to lead vertical P.C.B. mounted , 0.375"(9.5mm)lead length,Polymide PCB, 2 oz Copper. | 1 |
## CAD (KiCad official)
- Symbol: `ES1E`
- Footprint: `Diode_SMD:D_SMA`
- 3D model: SMA (KiCad packages3D, STEP)
- 3D model files: `es1e-etched.step` / `es1e-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `es1e.step` / `es1e.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [NH datasheet](docs/es1e-datasheet.pdf) (5 pp, sha256 `f19c36fc3802f908`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/es1e-datasheet.pdf)