# ES1DB

**LGE** · Diodes - General Purpose · SMB

ES1DB from LGE, in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, identified by the color band on the SMB/DO-214AA package. |
| 2 | A | passive | Anode terminal of the rectifier diode (the end opposite the color band). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | LGE |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum recurrent peak reverse voltage | VRRM |  |  | 200 | V |  | 1 |
| Maximum RMS voltage | VRMS |  |  | 140 | V |  | 1 |
| Maximum DC blocking voltage | VDC |  |  | 200 | V |  | 1 |
| Maximum average forward rectified current | IF(AV) |  |  | 1 | A | TA=75 | 1 |
| Peak forward surge current | IFSM |  |  | 30 | A | 8.3ms single half-sine-wave superimposed on rated load | 1 |
| Maximum instantaneous forward voltage | VF |  |  | 0.95 | V | IF=1.0 A | 1 |
| Maximum reverse current | IR |  |  | 5 | µA | TA=25, rated DC blocking voltage | 1 |
| Operating junction temperature range | TJ | -55 |  | 150 | °C |  | 1 |
| Storage temperature range | TSTG | -55 |  | 150 | °C |  | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper |  | 3. Thermal resistance f rom junction to ambient and junction to lead P.C.B.mounted on 0.27''X0.27''(7.0X7.0mm2) copper pad areas | 1 |

## CAD (KiCad official)

- Symbol: `ES1DB`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB (KiCad packages3D, STEP)
- 3D model files: `es1db-etched.step` / `es1db-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `es1db.step` / `es1db.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [LGE datasheet](docs/es1db-datasheet.pdf) (2 pp, sha256 `f108c6175d761c02`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/es1db-datasheet.pdf)