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ES1B M2G

Taiwan Semiconductor · Fast Recovery / High Efficiency Diodes · DO-214AC

ES1B M2G from Taiwan Semiconductor, in a DO-214AC. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint.
2 A passive Anode.

Key specifications

Parameter Value
Manufacturer Taiwan Semiconductor
Package DO-214AC
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage VF 0.95 V IF = 1A, TJ = 25°C 2
Reverse current @ rated VR, TJ = 25°C IR 5 µA @ rated VR, TJ = 25°C 2
Reverse current @ rated VR, TJ = 125°C IR 100 µA TJ = 125°C 2
Reverse recovery time trr 35 ns IF = 0.5A, IR = 1.0A, Irr = 0.25A 2
Repetitive peak reverse voltage VRRM 100 V ES1B column 1
Reverse voltage, total rms value VR(RMS) 70 V ES1B column 1
Forward current IF 1 A 1
Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load IFSM 30 A 8.3ms single half sine-wave superimposed on rated load 1
Junction temperature TJ -55 150 °C 1
Storage temperature TSTG -55 150 °C 1
Junction capacitance CJ 16 pF 1MHz, VR = 4.0V 2
Junction-to-lead thermal resistance RӨJL 35 °C/W 2
Junction-to-ambient thermal resistance RӨJA 85 °C/W 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 2 whisker test 1

CAD (KiCad official)

  • Symbol: ES1B M2G
  • Footprint: Diode_SMD:D_SMA
  • 3D model: DO-214AC (KiCad packages3D, STEP)
  • 3D model files: es1b-m2g-etched.step / es1b-m2g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); es1b-m2g.step / es1b-m2g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Taiwan Semiconductor datasheet (7 pp, sha256 e306f435ac757578, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary cathode-band convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF