# ER2M

**SMC(Sangdest Microelectronicstronic (Nanjing))** · Fast Recovery / High Efficiency Diodes · SMB

ER2M from SMC(Sangdest Microelectronicstronic (Nanjing)), in a SMB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | SMC(Sangdest Microelectronicstronic (Nanjing)) |
| Package | SMB |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Repetitive Reverse Voltage | VRRM |  |  | 1000 | V |  | 1 |
| Working Peak Reverse Voltage | VRWM |  |  | 1000 | V |  | 1 |
| DC Blocking Voltage | VR |  |  | 1000 | V |  | 1 |
| RMS Reverse Voltage | VR(RMS) |  |  | 700 | V |  | 1 |
| Average Rectified Output Current | Io |  |  | 2 | A | @TA = 75°C | 1 |
| Non-Repetitive Peak Forward Surge Current | IFSM |  |  | 50 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method) | 1 |
| Operating and Storage Temperature Range | TJ, TSTG | -65 |  | 150 | °C |  | 1 |
| Maximum Reverse Recovery Time | Trr |  |  | 75 | ns | IF=0.5A, IR=1.0A, Irr=0.25A (Note 2) | 1 |
| Typical Thermal Resistance Junction to Ambient | RθJA |  | 40 |  | °C/W | Mounted on P.C. board with 8.0mm² lead area (Note 1) | 1 |
| Typical Junction Capacitance | CJ |  | 60 |  | pF | Measured at 1.0 MHz and applied reverse voltage of 4.0 VDC (Note 3) | 1 |
| Forward Voltage | VF |  | 1.7 |  | V | @IF = 2.0A, TJ=25°C | 1 |
| Peak Reverse Current | IRM |  | 5 |  | µA | @TA = 25°C, at rated DC blocking voltage | 1 |
| Peak Reverse Current | IRM |  | 50 |  | µA | @TA = 100°C, at rated DC blocking voltage | 1 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts |  | tin |  Terminals finish: Tin Lead-free plated  This is a Pb − Free Device | 1 |

## CAD (KiCad official)

- Symbol: `ER2M`
- Footprint: `Diode_SMD:D_SMB`
- 3D model: SMB (KiCad packages3D, STEP)
- 3D model files: `er2m-etched.step` / `er2m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `er2m.step` / `er2m.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [SMC(Sangdest Microelectronicstronic (Nanjing)) datasheet](docs/er2m-datasheet.pdf) (4 pp, sha256 `43ad97fb43f14f6a`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/er2m-datasheet.pdf)