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Contents

README

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ER2D_R1_00001

PANJIT International · Diodes - General Purpose · SMB(DO-214AA)

ER2D_R1_00001 from PANJIT International, in a SMB(DO-214AA). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal; the color band on the package denotes the cathode end, and the device is rated for 50 V to 600 V repetitive peak reverse voltage depending on variant.
2 Anode passive Anode terminal; forward current flows from anode to cathode, with a maximum average forward current of 2 A at TL = 110 °C and a 50 A peak forward surge current (8.3 ms half sine-wave).

Key specifications

Parameter Value
Manufacturer PANJIT International
Package SMB(DO-214AA)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum Recurrent Peak Reverse Voltage VRRM 200 V 1
Maximum RMS Voltage VRMS 140 V 1
Maximum DC Blocking Voltage VDC 200 V 1
Maximum Average Forward Current IF(AV) 2 A TL=110°C 1
Peak Forward Surge Current IFSM 50 A 8.3ms single half sine-wave superimposed on rated load 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 1 μA TJ=25°C 1
Maximum DC Reverse Current at Rated DC Blocking Voltage IR 150 μA TJ=100°C 1
Maximum Reverse Recovery Time trr 35 ns Note 1: IF=0.5A, IR=-1A, Irr=-0.25A 1
Typical Junction Capacitance CJ 25 pF Note 2: measured at 1 MHz and applied Vr=4 volts 1
Typical Thermal Resistance, junction to lead RθJL 20 °C/W Note 3: mounted on FR4 PCB, single-sided copper, 100cm2 copper pad area 1
Typical Thermal Resistance, junction to case RθJC 15 °C/W Note 3: mounted on FR4 PCB, single-sided copper, 100cm2 copper pad area 1
Operating Junction and Storage Temperature Range TJ,TSTG -55 150 °C 1

CAD (KiCad official)

  • Symbol: ER2D_R1_00001
  • Footprint: Diode_SMD:D_SMB
  • 3D model: SMB(DO-214AA) (KiCad packages3D, STEP)
  • 3D model files: er2d-r1-00001-etched.step / er2d-r1-00001-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); er2d-r1-00001.step / er2d-r1-00001.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: PANJIT International datasheet (5 pp, sha256 4cafcd18c1e4674a, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF