Electronic Load Molecule
Public Made by Adomby adom
Siglent SDL1020X-E electronic load equipment prototype: reconstructed carrier STEP/GLB, constant-current dashboard, serial-pinned SCPI driver, control-panel integration guide and purchase budget.
d1c6e4f
1d ago
Mechanical model and qualification
The SDL1020X-E published envelope is 256 x 115 x 410 mm (W/H/D), mass 5.8 kg. The reconstruction uses these overall dimensions; it does not contain internal electronics or manufacturer-dimensioned connectors. This is an envelope/cosmetic planning model, not a full correct measured twin.
The proposed carrier is 288 x 448 x 4 mm, with datum centers (16,16), (272,16), (16,432), (272,432) mm. Spans 256 and 416 mm are multiples of the scaffold's 32 mm grid. Datum markers are explicitly nonphysical; they are not fabricated pins. Four support pads show the intended load path to a rigid support structure. They are not a released interface to the alignment sheet: its existing panel and fastener locations must be included before machining.
The current base-scaffold page documents a 576 x 576 mm workspace, 200 mm height and 20 kg project mass. Instrument plus nominal carrier fits the gross envelope, but that alone does not establish vent space, dock clearance, lead bend radius, robot reach, payload or impact load. Budget the instrument's 200 W heat rejection for future profiles, even though the present DUT only supplies 5 W. Mount clear of intake/exhaust; no vendor minimum clearance has yet been verified. Do not drill the instrument chassis.
Before a full twin is accepted:
- Obtain manufacturer CAD or measure the purchased unit's feet, connectors, controls, handle travel and vents. Reconcile the stated envelope with protrusions.
- Replace all
_estimatedbodies and datum markers with measured/vendor geometry. Record source and tolerance for every mating face. - Design pin retention and rigid support attachment against the current base-scaffold assembly. Confirm current vs legacy alignment-sheet/control-panel revisions.
- Validate retention, center of mass, transport shocks, plate deflection and robot grip/payload. A 20 kg scaffold rating is not a 20 kg gripper rating.
- Add force/sense/USB/mains harness models, connector mating envelopes and cooling keepouts. Test cable strain relief and emergency disconnection.
- Verify coordinate origins, scale and model import on a disposable workcell layout before registering this as production equipment.
The original Adom MachinePinLargeShort STEP was inspected as reference but is not embedded in this concept: a verified retention arrangement must precede pin placement. No unverified pin geometry is disguised as the real part.
# Mechanical model and qualification
The SDL1020X-E published envelope is 256 x 115 x 410 mm (W/H/D), mass 5.8 kg. The reconstruction uses these overall dimensions; it does not contain internal electronics or manufacturer-dimensioned connectors. This is an envelope/cosmetic planning model, not a full correct measured twin.
The proposed carrier is 288 x 448 x 4 mm, with datum centers (16,16), (272,16), (16,432), (272,432) mm. Spans 256 and 416 mm are multiples of the scaffold's 32 mm grid. Datum markers are explicitly nonphysical; they are not fabricated pins. Four support pads show the intended load path to a rigid support structure. They are not a released interface to the alignment sheet: its existing panel and fastener locations must be included before machining.
The current base-scaffold page documents a 576 x 576 mm workspace, 200 mm height and 20 kg project mass. Instrument plus nominal carrier fits the gross envelope, but that alone does not establish vent space, dock clearance, lead bend radius, robot reach, payload or impact load. Budget the instrument's 200 W heat rejection for future profiles, even though the present DUT only supplies 5 W. Mount clear of intake/exhaust; no vendor minimum clearance has yet been verified. Do not drill the instrument chassis.
Before a full twin is accepted:
1. Obtain manufacturer CAD or measure the purchased unit's feet, connectors, controls, handle travel and vents. Reconcile the stated envelope with protrusions.
2. Replace all `_estimated` bodies and datum markers with measured/vendor geometry. Record source and tolerance for every mating face.
3. Design pin retention and rigid support attachment against the current base-scaffold assembly. Confirm current vs legacy alignment-sheet/control-panel revisions.
4. Validate retention, center of mass, transport shocks, plate deflection and robot grip/payload. A 20 kg scaffold rating is not a 20 kg gripper rating.
5. Add force/sense/USB/mains harness models, connector mating envelopes and cooling keepouts. Test cable strain relief and emergency disconnection.
6. Verify coordinate origins, scale and model import on a disposable workcell layout before registering this as production equipment.
The original Adom MachinePinLargeShort STEP was inspected as reference but is not embedded in this concept: a verified retention arrangement must precede pin placement. No unverified pin geometry is disguised as the real part.