# ELE-500ETD4R7ME111

**NCC Nippon Chemi Con** · Aluminum Electrolytic Capacitors - Leaded · CP_Radial_D5.0mm_P2.00mm

ELE-500ETD4R7ME111 from NCC Nippon Chemi Con, in a CP_Radial_D5.0mm_P2.00mm. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of a POLARISED capacitor (Capacitors / Aluminum Electrolytic Capacitors - Leaded). Which terminal is the anode (+) is not yet recorded on this page: read it from the maker's datasheet before placing. |
| 2 | 2 | passive | Terminal 2 of a POLARISED capacitor (Capacitors / Aluminum Electrolytic Capacitors - Leaded). Which terminal is the anode (+) is not yet recorded on this page: read it from the maker's datasheet before placing. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | NCC Nippon Chemi Con |
| Package | CP_Radial_D5.0mm_P2.00mm |
| Category | Capacitors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Capacitance tolerance |  | -20 |  | 20 | % |  | 5 |
| Category temperature range |  | -40 |  | 105 | °C |  | 5 |
| Dissipation factor (tan δ) | tan δ |  |  | 0.19 |  | 120Hz ±20%; 0.5Vrms max. + 1.5 to 2.0VDC | 11 |
| Leakage current |  |  |  | 3 | µA | 2 minutes | 11 |
| Rated ripple current |  |  |  | 80 | mArms | 105°C, 100kHz | 11 |
| Surge voltage |  |  |  | 57.5 | VDC | Table-1, rated voltage 50VDC | 5 |
| Endurance capacitance change | ΔC/C | -25 |  | 25 | % | After 10,000 h at 105°C with maximum rated ripple current, restored to 20°C | 7 |
| Endurance dissipation factor (tan δ) | tan δ |  |  | 300 | % of initial specified value | After 10,000 h at 105°C with maximum rated ripple current | 7 |
| Damp heat capacitance change | ΔC/C | -20 |  | 20 | % | 40°C, 90 to 95%RH, 240 h | 7 |
| Damp heat dissipation factor (tan δ) | tan δ |  |  | 120 | % of initial specified value | 40°C, 90 to 95%RH, 240 h | 7 |
| Surge test capacitance change | ΔC/C | -20 |  | 20 | % | Surge voltage per Table-1, 1000 cycles, 1000 Ω series resistor | 7 |
| Surge test dissipation factor (tan δ) | tan δ |  |  | 200 | % of initial specified value | Surge voltage per Table-1, 1000 cycles, 1000 Ω series resistor | 7 |
| High temperature storage capacitance change | ΔC/C | -25 |  | 25 | % | 1,000 h at 105°C without applied voltage, restored to 20°C | 7 |
| High temperature storage dissipation factor (tan δ) | tan δ |  |  | 300 | % of initial specified value | 1,000 h at 105°C without applied voltage, restored to 20°C | 7 |
| Vibration capacitance change | ΔC/C | -5 |  | 5 | % | Vibration 10 to 55 Hz, 2 h in each of 3 directions | 6 |
| Soldering heat capacitance change | ΔC/C | -10 |  | 10 | % | Sn-3Ag-0.5Cu; 260±5°C for 10±1 s or 380±10°C for 3±0.5 s | 6 |
| High/low temperature impedance ratio Z-25°C/Z+20°C | Z-25℃/Z+20℃ |  |  | 3 |  | 120Hz, rated voltage 50VDC | 7 |
| High/low temperature leakage current |  |  |  | 8 | × initial specified value | Step 3, +105±2°C | 7 |
| High/low temperature capacitance change | ΔC/C | -25 |  | 25 | % | Step 3, +105±2°C | 7 |
| Rated voltage |  |  | 50 |  | VDC |  | 5 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | pc |  | The body of the capacitor with 12.5mm or larger in diameter or 25mm or longer in length, in addition, shall be anchored to the pc board with a fi xture. | 6 |
| contacts | copper |  | ④ Lead wire Bismuth-containing tinned copper clad steel | 4 |

## CAD (KiCad official)

- Symbol: `ELE-500ETD4R7ME111`
- Footprint: `Capacitor_THT:CP_Radial_D5.0mm_P2.00mm`
- 3D model: CP_Radial_D5.0mm_P2.00mm (KiCad packages3D, STEP)
- 3D model files: `ele-500etd4r7me111-etched.step` / `ele-500etd4r7me111-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ele-500etd4r7me111.step` / `ele-500etd4r7me111.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [NCC Nippon Chemi Con datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603039575304380416) (17 pp, sha256 `b7df449f49f6cdda`, retrieved 2026-11-07, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ele-500etd4r7me111-datasheet.pdf)