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EG2334

EG Micro · Gate Drive ICs · SOP-20-300mil

EG2334 from EG Micro, in a SOP-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 HIN1 input High-side logic input for channel 1 (active high, controls HO1); logic high threshold is 2.5 V minimum and logic low is 1.0 V maximum, with an internal pull-down that holds the output off when the input is floating.
2 HIN2 input High-side logic input for channel 2 (active high, controls HO2); logic high threshold is 2.5 V minimum and logic low is 1.0 V maximum, with an internal pull-down that holds the output off when the input is floating.
3 HIN3 input High-side logic input for channel 3 (active high, controls HO3); logic high threshold is 2.5 V minimum and logic low is 1.0 V maximum, with an internal pull-down that holds the output off when the input is floating.
4 LIN1 input Low-side logic input for channel 1 (active high, controls LO1); logic high threshold is 2.5 V minimum and logic low is 1.0 V maximum, with an internal pull-down that holds the output off when the input is floating.
5 LIN2 input Low-side logic input for channel 2 (active high, controls LO2); logic high threshold is 2.5 V minimum and logic low is 1.0 V maximum, with an internal pull-down that holds the output off when the input is floating.
6 LIN3 input Low-side logic input for channel 3 (active high, controls LO3); logic high threshold is 2.5 V minimum and logic low is 1.0 V maximum, with an internal pull-down that holds the output off when the input is floating.
7 GND power_in Analog ground reference for the device.
8 LO3 output Low-side gate drive output for channel 3 that drives the low-side power MOSFET; limited to -0.3 V to VCC+0.3 V.
9 LO2 output Low-side gate drive output for channel 2 that drives the low-side power MOSFET; limited to -0.3 V to VCC+0.3 V.
10 LO1 output Low-side gate drive output for channel 1 that drives the low-side power MOSFET; limited to -0.3 V to VCC+0.3 V.
11 VCC power_in Low-side supply pin, 4.5 V to 20 V operating range (absolute maximum -0.3 V to 25 V).
12 VS1 output High-side floating return for channel 1; limited to VB-25 V to VB+0.3 V, with a static negative limit of -6 V.
13 HO1 output High-side gate drive output for channel 1 that drives the high-side power MOSFET; limited to VS-0.3 V to VB+0.3 V.
14 VB1 power_in Floating high-side bootstrap supply for channel 1; absolute maximum 600 V.
15 VS2 output High-side floating return for channel 2; limited to VB-25 V to VB+0.3 V, with a static negative limit of -6 V.
16 HO2 output High-side gate drive output for channel 2 that drives the high-side power MOSFET; limited to VS-0.3 V to VB+0.3 V.
17 VB2 power_in Floating high-side bootstrap supply for channel 2; absolute maximum 600 V.
18 VS3 output High-side floating return for channel 3; limited to VB-25 V to VB+0.3 V, with a static negative limit of -6 V.
19 HO3 output High-side gate drive output for channel 3 that drives the high-side power MOSFET; limited to VS-0.3 V to VB+0.3 V.
20 VB3 power_in Floating high-side bootstrap supply for channel 3; absolute maximum 600 V.

Key specifications

Parameter Value
Manufacturer EG Micro
Package SOP-20-300mil
Category Power Management ICs
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Bootstrap high-side supply VB VB1、VB2、VB3 -0.3 600 V 7
Low-side output LO LO1、LO2、LO3 -0.3 V 7
Supply VCC VCC -0.3 25 V 7
High-channel logic input HIN1、HIN2、HIN3 -0.3 V 7
Low-channel logic input LIN1、LIN2、LIN3 -0.3 V 8
Ambient temperature -40 125 ℃ 8
Storage temperature -55 150 ℃ 8
Soldering temperature 300 ℃ T=10S 8
Supply VDD, high-voltage-turn-on MOSFETs (recommended) VDD 10 15 V 高压开启MOS管 (high-voltage MOSFET turn-on, typical 10V-15V) 10
Supply VCC, low-voltage-turn-on MOSFETs (recommended) VCC 4.5 10 V 低压开启MOS管 (low-voltage MOSFET turn-on) 10
Supply VDD VDD 4.5 12 20 V 8
Quiescent current Icc 1 5 uA 输入悬空,VCC=12V 8
Logic input high voltage Vin(H) 2.5 V 所有输入控制信号 8
Logic input low voltage Vin(L) -0.3 0 1 V 所有输入控制信号 8
Logic input high-level current Iin(H) 15 uA Vin=5V 8
Logic input low-level current Iin(L) -15 uA Vin=0V 8
Floating supply leakage current ILK 0.1 1 uA VB1,2,3=VS1,2,3=600V 8
VBS quiescent current IQBS 0.1 10 uA VIN=0 或者 VIN=5V 8
LIN high-level input bias current ILINH 20 40 uA VLIN=5V 8
LIN low-level input bias current ILINL 1 uA VLIN=0V 8
HIN high-level input bias current IHINH 20 40 uA VLIN=5V 8
HIN low-level input bias current IHINL 1 uA VLIN=0V 8
High-side output voltage (IO max drive) VOH 0.7 1 A IO=100mA 8
Low-side output voltage (IO max drive) VOL 0.3 0.45 A IO=100mA 8
LO turn-on delay Ton 300 400 nS 见图 7-1 9
LO turn-off delay Toff 100 200 nS 见图 7-1 9
LO rise time Tr 25 200 nS 见图 7-1 9
LO fall time Tf 20 100 nS 见图 7-1 9
HO turn-on delay Ton 220 400 nS 见图 7-2 9
HO turn-off delay Toff 200 400 nS 见图 7-2 9
HO rise time Tr 25 200 nS 见图 7-2 9
HO fall time Tf 20 100 nS 见图 7-2 9
Dead time DT 50 100 200 nS 见图 7-3,无负载电容 CL=0 9
VS static negative voltage VSN -6 V 8
Output source current (IO+) IO+ 1.2 A Vo=0V,VIN=VIH PW≤10uS 9
Output sink current (IO-) IO- -1.4 A Vo=12V,VIN=VIL PW≤10uS 9

CAD (KiCad official)

  • Symbol: EG2334
  • Footprint: Package_SO:SOP-20_7.5x12.8mm_P1.27mm
  • 3D model: SOP-20-300mil, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: eg2334-etched.step / eg2334-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); eg2334.step / eg2334.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: EG Micro datasheet (12 pp, sha256 441c3a9d1aa6c9a6, retrieved 2026-10-26, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF