component
EG2302
Public Made by Adomby adom
EG Micro Gate Drivers, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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EG2302
EG Micro · Gate Drivers · SOP-8
EG2302 from EG Micro, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Chip operating supply input, 5V to 25V; an external 0.1uF high-frequency bypass capacitor is recommended to reduce high-frequency noise on the supply. |
| 2 | IN | input | Logic input controlling the conduction of the output MOSFETs (1 turns HO high and LO low, 0 turns LO high and HO low); logic-high threshold is 2.5V minimum and logic-low threshold is 1.0V maximum, with an internal 200K pull-down. |
| 3 | SD | input | Active-low shutdown input that forces LO and HO low when set to 0 and allows normal IN control when set to 1; it has an internal 500K pull-up. |
| 4 | GND | power_in | Ground terminal of the chip. |
| 5 | LO | output | Drives the low-side power MOSFET on and off; the datasheet states a maximum sink current of 0.6A and maximum source current of 0.3A (pulse width up to 10 µs). |
| 6 | VS | power_in | High-side floating ground reference, rated from VB-25V to VB+0.3V. |
| 7 | HO | output | Drives the high-side power MOSFET on and off; output is rated from VS-0.3V to VB+0.3V. |
| 8 | VB | power_in | High-side floating supply for the bootstrap circuit; the high-side channel withstands up to 600V, and VB is rated -0.3V to 600V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | EG Micro |
| Package | SOP-8 |
| Category | Motor Driver ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-side floating supply VB (absolute max) | VB | -0.3 | 600 | V | 7 | ||
| Supply voltage VCC (absolute max) | VCC | -0.3 | 25 | V | 7 | ||
| Low-side output LO (absolute max) | LO | -0.3 | V | 7 | |||
| High-channel logic input level IN (absolute max) | IN | -0.3 | V | 7 | |||
| Low-channel logic input level SD (absolute max) | SD | -0.3 | V | 7 | |||
| Ambient temperature TA (absolute max) | TA | -40 | 125 | ℃ | 7 | ||
| Storage temperature Tstr (absolute max) | Tstr | -55 | 150 | ℃ | 7 | ||
| Soldering temperature TL (absolute max) | TL | 300 | ℃ | T=10S | 7 | ||
| Supply voltage Vcc | Vcc | 5 | 15 | 25 | V | 8 | |
| Quiescent current Icc | Icc | 200 | 350 | 450 | uA | 输入悬空，Vcc=15V | 8 |
| Input logic high voltage Vin(H) | Vin(H) | 2.5 | V | 所有输入控制信号 | 8 | ||
| Input logic low voltage Vin(L) | Vin(L) | -0.3 | 0 | 1 | V | 所有输入控制信号 | 8 |
| Input logic high current Iin(H) | Iin(H) | 30 | uA | Vin=5V | 8 | ||
| Input logic low current Iin(L) | Iin(L) | -10 | uA | Vin=0V | 8 | ||
| VCC turn-on voltage Vcc(on) | Vcc(on) | 4.2 | 4.6 | 5 | V | 8 | |
| VCC turn-off voltage Vcc(off) | Vcc(off) | 3.8 | 4.2 | 4.6 | V | 8 | |
| VB turn-on voltage VB(on) | VB(on) | 3.1 | 3.5 | 3.9 | V | 8 | |
| VB turn-off voltage VB(off) | VB(off) | 2.7 | 3.1 | 3.5 | V | 8 | |
| LO turn-on delay Ton | Ton | 600 | 700 | 800 | nS | 见图 7-1 | 8 |
| LO turn-off delay Toff | Toff | 100 | 200 | 300 | nS | 见图 7-1 | 8 |
| LO rise time Tr | Tr | 35 | 75 | 170 | nS | 见图 7-1 | 8 |
| LO fall time Tf | Tf | 15 | 35 | 90 | nS | 见图 7-1 | 8 |
| HO turn-on delay Ton | Ton | 600 | 700 | 800 | nS | 见图 7-2 | 8 |
| HO turn-off delay Toff | Toff | 100 | 200 | 300 | nS | 见图 7-2 | 8 |
| HO rise time Tr | Tr | 35 | 75 | 170 | nS | 见图 7-2 | 8 |
| HO fall time Tf | Tf | 15 | 35 | 90 | nS | 见图 7-2 | 8 |
| Dead time DT | DT | 380 | 540 | 700 | nS | 见图 7-3，无负载电容 CL=0 | 8 |
| IO source current IO+ | IO+ | 0.3 | A | Vo=0V,VIN=VIH PW≤10uS | 8 | ||
| IO sink current IO- | IO- | 0.6 | A | Vo=12V,VIN=VIL PW≤10uS | 9 |
CAD (KiCad official)
- Symbol:
EG2302 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
eg2302-etched.step/eg2302-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);eg2302.step/eg2302.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: EG Micro datasheet (12 pp, sha256
0749f1493bdfb91a, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).