component
EG2224
Public Made by Adomby adom
EG Micro Gate Drive ICs, SSOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownEG2224
EG Micro · Gate Drive ICs · SSOP-16
EG2224 from EG Micro, in a SSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN1 | input | Channel 1 logic input controlling the output MOSFETs: 0 sets LO1 high and HO1 low, and 1 sets HO1 high and LO1 low. |
| 2 | SD1 | input | Active-low shutdown input for channel 1 that forces LO1 and HO1 low when pulled low. |
| 3 | IN2 | input | Channel 2 logic input controlling the output MOSFETs: 0 sets LO2 high and HO2 low, and 1 sets HO2 high and LO2 low. |
| 4 | SD2 | input | Active-low shutdown input for channel 2 that forces LO2 and HO2 low when pulled low. |
| 5 | VCC | power_in | Chip supply input with a stated range of 10V to 20V; an external high-frequency bypass capacitor reduces high-frequency noise at the input. |
| 6 | LO2 | output | Drives the channel 2 low-side power MOSFET gate. |
| 7 | LO1 | output | Drives the channel 1 low-side power MOSFET gate. |
| 8 | GND | power_in | Low-side ground reference for the device. |
| 9 | VS2 | power_in | High-side floating ground reference for channel 2. |
| 10 | HO2 | output | Drives the channel 2 high-side power MOSFET gate. |
| 11 | VB2 | power_in | High-side floating supply for channel 2, fed by the external bootstrap circuit. |
| 12 | NC | unconnected | Not connected; left floating (悬空). |
| 13 | NC | unconnected | Not connected; left floating (悬空). |
| 14 | VS1 | power_in | High-side floating ground reference for channel 1. |
| 15 | HO1 | output | Drives the channel 1 high-side power MOSFET gate. |
| 16 | VB1 | power_in | High-side floating supply for channel 1, fed by the external bootstrap circuit. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | EG Micro |
| Package | SSOP-16 |
| Category | Power Management |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Bootstrap high-side supply VB1, VB2 | VB1, VB2 | -0.3 | 600 | V | 11 | ||
| Supply voltage VCC | VCC | -0.3 | 25 | V | 11 | ||
| Ambient temperature TA | TA | -40 | 125 | ℃ | 12 | ||
| Storage temperature Tstr | Tstr | -55 | 150 | ℃ | 12 | ||
| Soldering temperature TL | TL | 300 | ℃ | T=10S | 12 | ||
| Supply voltage VCC (recommended) | Vcc | 10 | 15 | 20 | V | 12 | |
| Static current | Icc | 60 | 190 | 400 | uA | 输入悬空，CIN=0，CIP=1 | 12 |
| Logic input high level | INH | 2.5 | V | 所有输入控制信号 | 12 | ||
| Logic input low level | INL | -0.3 | 0 | 1 | V | 所有输入控制信号 | 12 |
| VCC turn-on threshold | Vcc(on) | 7.4 | 8.4 | 9.4 | V | 12 | |
| VCC turn-off threshold | Vcc(off) | 6.9 | 7.9 | 8.9 | V | 12 | |
| VB turn-on threshold | VB(on) | 6.8 | 7.8 | 8.8 | V | 12 | |
| VB turn-off threshold | VB(off) | 6.3 | 7.3 | 8.3 | V | 12 | |
| LO turn-on delay | Ton | 700 | 900 | nS | 见图 7-1 | 12 | |
| LO turn-off delay | Toff | 170 | 300 | nS | 见图 7-1 | 12 | |
| LO rise time | Tr | 70 | 170 | nS | 见图 7-1 | 12 | |
| LO fall time | Tf | 35 | 90 | nS | 见图 7-1 | 12 | |
| HO turn-on delay | Ton | 700 | 900 | nS | 见图 7-2 | 13 | |
| HO turn-off delay | Toff | 170 | 300 | nS | 见图 7-2 | 13 | |
| HO rise time | Tr | 70 | 170 | nS | 见图 7-2 | 13 | |
| HO fall time | Tf | 35 | 90 | nS | 见图 7-2 | 13 | |
| Comparator input offset voltage | VCOS | 10 | mV | 13 | |||
| Comparator input voltage range | VCICR | 0.1 | V | 13 | |||
| Dead time | DT | 350 | 530 | 700 | nS | 见图 7-3，无负载电容 CL=0 | 13 |
| IO+ peak source current | IO+ | 0.3 | A | Vo=0V,VIN=VIH PW≤10uS | 13 | ||
| IO- peak sink current | IO- | 0.6 | A | Vo=12V,VIN=VIL PW≤10uS | 13 |
CAD (KiCad official)
- Symbol:
EG2224 - Footprint:
Package_SO:SSOP-16_5.3x6.2mm_P0.65mm - 3D model: SSOP-16 (KiCad packages3D, STEP)
- 3D model files:
eg2224-etched.step/eg2224-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);eg2224.step/eg2224.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: EG Micro datasheet (18 pp, sha256
268c94bf027a4600, retrieved 2026-11-04, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).