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EG2106
Public Made by Adomby adom
EG Micro Gate Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownEG2106
EG Micro · Gate Drivers · SOIC-8
EG2106 from EG Micro, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Low-side supply input, 10 V to 20 V; a 1 µF high-frequency bypass capacitor is recommended to reduce high-frequency noise at this pin. |
| 2 | HIN | input | High-side logic input, active high: 1 turns the high-side power MOSFET on via HO and 0 turns it off; the input has an internal 200K pull-down so it is held off when left floating. |
| 3 | LIN | input | Low-side logic input, active high: 1 turns the low-side power MOSFET on via LO and 0 turns it off; the input has an internal 200K pull-down so it is held off when left floating. |
| 4 | GND | power_in | Chip ground terminal. |
| 5 | LO | output | Low-side gate drive output that switches the low-side power MOSFET on and off. |
| 6 | VS | power_in | High-side floating ground reference (return for the high-side driver), which is referenced to the bootstrap supply VB. |
| 7 | HO | output | High-side gate drive output that switches the high-side power MOSFET on and off. |
| 8 | VB | power_in | High-side floating bootstrap supply; charged from VCC through an external bootstrap diode and capacitor, with undervoltage lockout on this pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | EG Micro |
| Package | SOIC-8 |
| Category | Motor Driver ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High-side floating supply voltage (VB) | VB | -0.3 | 600 | V | TA=25℃ unless otherwise noted | 7 | |
| Low-side supply voltage (VCC) | VCC | -0.3 | 20 | V | TA=25℃ unless otherwise noted | 7 | |
| Low-side output LO | LO | -0.3 | V | TA=25℃ unless otherwise noted | 7 | ||
| High-channel logic input level (HIN) | -0.3 | V | TA=25℃ unless otherwise noted | 7 | |||
| Low-channel logic input level (LIN) | -0.3 | V | TA=25℃ unless otherwise noted | 7 | |||
| Ambient temperature (TA) | TA | -45 | 125 | ℃ | 7 | ||
| Storage temperature (Tstr) | Tstr | -55 | 150 | ℃ | 7 | ||
| Soldering temperature (TL) | TL | 300 | ℃ | T=10S | 7 | ||
| Supply voltage (Vcc) | Vcc | 10 | 15 | 20 | V | TA=25℃, VCC=15V, CL=1nF (table header) | 8 |
| Quiescent current (inputs floating) | Icc | 200 | 300 | uA | Inputs floating, Vcc=15V | 8 | |
| Input logic high level | Vin(H) | 2.5 | V | All input control signals | 8 | ||
| Input logic low level | Vin(L) | -0.3 | 0 | 1 | V | All input control signals | 8 |
| Input logic high-level current | Iin(H) | 30 | uA | Vin=5V | 8 | ||
| Input logic low-level current | Iin(L) | -10 | uA | Vin=0V | 8 | ||
| VCC turn-on voltage (UVLO) | Vcc(on) | 7.6 | 8.6 | 9.6 | V | 8 | |
| VCC turn-off voltage (UVLO) | Vcc(off) | 7.1 | 8.1 | 9.1 | V | 8 | |
| VB turn-on voltage (UVLO) | VB(on) | 7.6 | 8.6 | 9.6 | V | 8 | |
| VB turn-off voltage (UVLO) | VB(off) | 7 | 8 | 9 | V | 8 | |
| LO turn-on delay | Ton | 350 | 450 | nS | See Fig. 7-1 | 8 | |
| LO turn-off delay | Toff | 300 | 400 | nS | See Fig. 7-1 | 8 | |
| LO rise time | Tr | 70 | 170 | nS | See Fig. 7-1 | 8 | |
| LO fall time | Tf | 35 | 90 | nS | See Fig. 7-1 | 8 | |
| HO turn-on delay | Ton | 350 | 450 | nS | See Fig. 7-2 | 8 | |
| HO turn-off delay | Toff | 300 | 400 | nS | See Fig. 7-2 | 8 | |
| HO rise time | Tr | 70 | 170 | nS | See Fig. 7-2 | 8 | |
| HO fall time | Tf | 35 | 90 | nS | See Fig. 7-2 | 8 | |
| Output source current | IO+ | 0.3 | A | Vo=0V, VIN=VIH, PW≤10uS | 8 | ||
| Output sink current | IO- | 0.6 | A | Vo=12V, VIN=VIL, PW≤10uS | 8 |
CAD (KiCad official)
- Symbol:
EG2106 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
eg2106-etched.step/eg2106-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);eg2106.step/eg2106.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: EG Micro datasheet (11 pp, sha256
e4f011ceabdb177b, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).