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docs eg1192l: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers pin 1: carry the footprint's marker into the .lbr, the viewer and page.json (silk-marker, drawn, top-left) · Ray
eg1192l-etched.fit.json eg1192l: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
eg1192l-etched.glb eg1192l: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
eg1192l-etched.step eg1192l: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
eg1192l.glb Publish 0.1.0 · Ray
eg1192l.kicad_mod Publish 0.1.0 · Ray
eg1192l.kicad_sym symbol: the symbol numbered its pins 0-8 against pads 1-9, so pin "0" bound to no pad and the thermal pad had no pin at… · Ray
eg1192l.lbr rebuild the library on adom-lbr 2.32.0. The published copy was built by 2.18.0, which imported every KiCad roundrect an… · Ray
eg1192l.step Publish 0.1.0 · Ray
package.json Publish 0.2.0 · Ray
pads.json symbol: the symbol numbered its pins 0-8 against pads 1-9, so pin "0" bound to no pad and the thermal pad had no pin at… · Ray
page.json eg1192l: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray
README.md eg1192l: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray

EG1192L

EG Micro · DC-DC Converters · ESOP-8

EG1192L from EG Micro, in a ESOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
0 VIN power_in Chip power-supply input tied to the exposed thermal pad on the backside of the package. Connect to the same net as pin 1 VIN (10 V to 100 V input range) and to the ground/thermal copper pour for heat dissipation.
1 VIN power_in Chip power-supply input. Wide-voltage range 10 V to 100 V; bypass with a low-ESR bulk capacitor and a 0.1 µF ceramic close to the pin.
2 GND power_in Device ground reference. Connect to the system ground plane; tie the exposed pad copper to this net for thermal performance.
3 EN input Enable input, active high - drives the switching converter on. Pulling EN low fully shuts down the chip for zero standby current.
4 VIA output Input-voltage sense/divider output. Internally the VIN rail is fed through a resistor divider (≈450 kΩ / 15 kΩ) and brought out here for input-voltage sampling by an external MCU/ADC.
5 FB input Output-voltage feedback input to the internal error amplifier (VREF ≈ 1.25 V). Connect through an external resistor divider from VOUT to program the output voltage.
6 VB passive Bootstrap (floating) supply for the high-side MOSFET gate driver. Connect a bootstrap capacitor (typ. 0.1 µF) between VB and VS.
7 VS output Switch node - floating ground reference for the high-side driver and drain of the freewheeling path. Connect to the external inductor and the anode of the freewheeling Schottky (e.g. SS310); return of the bootstrap capacitor.
8 IS input MOS peak current-limit sense input (VREF ≈ 0.18 V). Sets cycle-by-cycle over-current protection via an external sense resistor.

Key specifications

Parameter Value
Manufacturer EG Micro
Package ESOP-8
Category PMIC
Pins 9

CAD (KiCad official)

  • Symbol: EG1192L
  • Footprint: Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.41x3.3mm
  • 3D model: ESOP-8 (KiCad packages3D, STEP)
  • 3D model files: eg1192l-etched.step / eg1192l-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); eg1192l.step / eg1192l.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
eg1192l.step 255 KB You want the bare part, or you mark your own boards.
eg1192l-etched.step 1.5 MB You want the part with EG1192L already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 376 faces against 161 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: EG Micro datasheet (11 pp, sha256 3a8a9fa6494f7877, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF