component
EFM8UB11F16G-C-QSOP24
Public Made by Adomby adom
SILICON LABS Pre-ordered MCUs, QSOP-24-150mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
EFM8UB11F16G-C-QSOP24
SILICON LABS · Pre-ordered MCUs · QSOP-24-150mil
EFM8UB11F16G-C-QSOP24 from SILICON LABS, in a QSOP-24-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | P0.2 | bidirectional | Multifunction I/O with crossbar capability, also providing P0MAT.2, INT0.2/INT1.2, ADC0.2 and CMP0P.2/CMP0N.2 functions; all pins are 5 V tolerant under bias. |
| 2 | P0.1 | bidirectional | Multifunction I/O with crossbar capability, also providing P0MAT.1, INT0.1/INT1.1, ADC0.1 and CMP0P.1/CMP0N.1 functions; the datasheet also lists AGND against this pin's analog functions. |
| 3 | P0.0 | bidirectional | Multifunction I/O with crossbar capability, also providing P0MAT.0, INT0.0/INT1.0, ADC0.0 and CMP0P.0/CMP0N.0 functions; the datasheet also lists VREF against this pin's analog functions. |
| 4 | GND | power_in | Ground pin. |
| 5 | D+ | bidirectional | USB Data Positive, also available as ADC0.28; the USB transceiver is low-power full/low-speed. |
| 6 | D- | bidirectional | USB Data Negative, also available as ADC0.29; the USB transceiver is low-power full/low-speed. |
| 7 | VIO | power_in | I/O Power Input that supplies the external I/O pins. |
| 8 | VDD | power_in | Supply Power Input / 5V Regulator Output; all internal circuitry draws power from VDD. |
| 9 | VREGIN | power_in | 5V Regulator Input for the on-chip 5 V-to-3.3 V LDO regulator, allowing direct connection to a USB supply. |
| 10 | P3.1 / VBUS | bidirectional | Multifunction I/O (GPIO) with VBUS function; P3.1 is not available on the crossbar in this package. |
| 11 | RSTb / C2CK | input | Active-low Reset input that doubles as the C2 Debug Clock. |
| 12 | P2.0 / C2D | bidirectional | Multifunction I/O with C2 Debug Data function; the C2D pin is not available on the crossbar in this package. |
| 13 | P1.6 | bidirectional | Multifunction I/O with crossbar capability, also providing P1MAT.6, I2C0_SCL, ADC0.14, CMP1P.9 and CMP1N.9 functions. |
| 14 | P1.5 | bidirectional | Multifunction I/O with crossbar capability, also providing P1MAT.5, I2C0_SDA, ADC0.13, CMP1P.7 and CMP1N.7 functions. |
| 15 | P1.4 | bidirectional | Multifunction I/O with crossbar capability, also providing P1MAT.4, ADC0.12, CMP1P.6 and CMP1N.6 functions. |
| 16 | P1.3 | bidirectional | Multifunction I/O with crossbar capability, also providing P1MAT.3, ADC0.11, CMP1P.5 and CMP1N.5 functions. |
| 17 | P1.2 | bidirectional | Multifunction I/O with crossbar capability, also providing P1MAT.2, I2C0_SCL, ADC0.10, CMP1P.4 and CMP1N.4 functions. |
| 18 | P1.1 | bidirectional | Multifunction I/O with crossbar capability, also providing P1MAT.1, I2C0_SDA, ADC0.9, CMP1P.3 and CMP1N.3 functions. |
| 19 | P1.0 | bidirectional | Multifunction I/O with crossbar capability, also providing P1MAT.0, ADC0.8, CMP1P.2 and CMP1N.2 functions. |
| 20 | P0.7 | bidirectional | Multifunction I/O with crossbar capability, also providing P0MAT.7, INT0.7/INT1.7, ADC0.7, CMP1P.1, CMP1N.1, CMP0P.7 and CMP0N.7 functions. |
| 21 | P0.6 | bidirectional | Multifunction I/O with crossbar capability, also providing P0MAT.6, CNVSTR, INT0.6/INT1.6, ADC0.6, CMP1P.0, CMP1N.0, CMP0P.6 and CMP0N.6 functions. |
| 22 | P0.5 | bidirectional | Multifunction I/O with crossbar capability, also providing P0MAT.5, INT0.5/INT1.5, UART0_RX, ADC0.5, CMP0P.5 and CMP0N.5 functions. |
| 23 | P0.4 | bidirectional | Multifunction I/O with crossbar capability, also providing P0MAT.4, INT0.4/INT1.4, UART0_TX, ADC0.4, CMP0P.4 and CMP0N.4 functions. |
| 24 | P0.3 | bidirectional | Multifunction I/O with crossbar capability, also providing P0MAT.3, EXTCLK, INT0.3/INT1.3, ADC0.3, CMP0P.3 and CMP0N.3 functions. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SILICON LABS |
| Package | QSOP-24-150mil |
| Category | Embedded Processors & Controllers |
| Pins | 24 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating Supply Voltage on VDD | VDD | 2.2 | 3.6 | V | 16 | ||
| Operating Supply Voltage on VIO | VIO | 1.71 | V | Max printed as VDD | 16 | ||
| Operating Supply Voltage on VREGIN | VREGIN | 3 | 5.25 | V | 16 | ||
| System Clock Frequency | fSYSCLK | 0 | 50 | MHz | 16 | ||
| Operating Ambient Temperature | TA | -40 | 85 | °C | 16 | ||
| Digital Core Supply Current, Normal Mode | IDD | 9.4 | 10.1 | mA | Full speed, code executing from flash; FSYSCLK = 48 MHz (HFOSC1) | 17 | |
| Digital Core Supply Current, Normal Mode | IDD | 4.5 | 5.2 | mA | Full speed, code executing from flash; FSYSCLK = 24.5 MHz (HFOSC0) | 17 | |
| Digital Core Supply Current, Idle Mode | IDD | 6.3 | 6.8 | mA | Core halted with peripherals running; FSYSCLK = 48 MHz (HFOSC1) | 17 | |
| Digital Core Supply Current, Idle Mode | IDD | 2.9 | 3.3 | mA | Core halted with peripherals running; FSYSCLK = 24.5 MHz (HFOSC0) | 17 | |
| Oscillator Frequency, High Frequency Oscillator 0 (24.5 MHz) | fHFOSC0 | 24 | 24.5 | 25 | MHz | Full Temperature and Supply Range | 21 |
| Oscillator Frequency, High Frequency Oscillator 1 (48 MHz) | fHFOSC1 | 47.3 | 48 | 48.7 | MHz | Full Temperature and Supply Range | 21 |
| Oscillator Frequency, Low Frequency Oscillator (80 kHz) | fLFOSC | 75 | 80 | 85 | kHz | Full Temperature and Supply Range | 21 |
| External Input CMOS Clock Frequency (at EXTCLK pin) | fCMOS | 0 | 50 | MHz | 21 | ||
| External Input CMOS Clock High Time | tCMOSH | 9 | ns | 21 | |||
| External Input CMOS Clock Low Time | tCMOSL | 9 | ns | 21 | |||
| Throughput Rate (High Speed Mode) | fS | 200 | ksps | 12 Bit Mode | 22 | ||
| Throughput Rate (High Speed Mode) | fS | 800 | ksps | 10 Bit Mode | 22 | ||
| Throughput Rate (Low Power Mode) | fS | 62.5 | ksps | 12 Bit Mode | 22 | ||
| Throughput Rate (Low Power Mode) | fS | 250 | ksps | 10 Bit Mode | 22 | ||
| Tracking Time | tTRK | 230 | ns | High Speed Mode | 22 | ||
| Tracking Time | tTRK | 450 | ns | Low Power Mode | 22 | ||
| Power-On Time | tPWR | 1.2 | μs | 22 | |||
| SAR Clock Frequency | fSAR | 6.25 | MHz | High Speed Mode, Reference is 2.4 V internal | 22 | ||
| SAR Clock Frequency | fSAR | 12.5 | MHz | High Speed Mode, Reference is not 2.4 V internal | 22 | ||
| SAR Clock Frequency | fSAR | 4 | MHz | Low Power Mode | 22 | ||
| Input Voltage Range | VIN | 0 | V | Gain = 1; max printed as VREF | 22 | ||
| Voltage Reference Range | VREF | 1 | V | Max printed as VDD | 22 | ||
| Integral Nonlinearity | INL | -2.3 | 1 | 2.3 | LSB | 12 Bit Mode; printed ±1 typ, ±2.3 max | 22 |
| Integral Nonlinearity | INL | -0.6 | 0.2 | 0.6 | LSB | 10 Bit Mode; printed ±0.2 typ, ±0.6 max | 22 |
| Differential Nonlinearity (Guaranteed Monotonic) | DNL | -1 | 0.7 | 1.9 | LSB | 12 Bit Mode | 22 |
| Differential Nonlinearity (Guaranteed Monotonic) | DNL | -0.6 | 0.2 | 0.6 | LSB | 10 Bit Mode; printed ±0.2 typ, ±0.6 max | 22 |
| Offset Error | EOFF | -3 | 0 | 3 | LSB | 12 Bit Mode, VREF = 1.65 V | 22 |
| Offset Error | EOFF | -2 | 0 | 2 | LSB | 10 Bit Mode, VREF = 1.65 V | 22 |
| Slope Error | EM | -0.1 | 0.02 | 0.1 | % | 12 Bit Mode; printed ±0.02 typ, ±0.1 max | 23 |
| Slope Error | EM | -0.24 | 0.06 | 0.24 | % | 10 Bit Mode; printed ±0.06 typ, ±0.24 max | 23 |
| Signal-to-Noise | SNR | 61 | 66 | dB | 12 Bit Mode; 10 kHz sine wave input, 1 dB below full scale, max throughput, AGND pin | 23 | |
| Signal-to-Noise | SNR | 53 | 60 | dB | 10 Bit Mode; 10 kHz sine wave input, 1 dB below full scale, max throughput, AGND pin | 23 | |
| Internal Fast Settling Reference Output Voltage (1.65 V Setting) | VREFFS | 1.62 | 1.65 | 1.68 | V | Full Temperature and Supply Range | 23 |
| Internal Fast Settling Reference Output Voltage (2.4 V Setting) | VREFFS | 2.35 | 2.4 | 2.45 | V | 2.4 V Setting, VDD > 2.6 V | 23 |
| Internal Fast Settling Reference Turn-on Time | tREFFS | 1.5 | μs | 23 | |||
| 1.8 V Internal LDO Output Voltage | VOUT_1.8V | 1.78 | 1.85 | 1.92 | V | 24 | |
| 5 V Regulator Input Voltage Range | VREGIN | 3 | 5.25 | V | Input range to meet Output Voltage on VDD specification | 24 | |
| 5 V Regulator Output Voltage on VDD, Regulation Range | VREGOUT | 3.1 | 3.3 | 3.6 | V | Output Current = 1 to 100 mA; regulation range (VREGIN ≥ 4.1 V) | 24 |
| 5 V Regulator Output Current | IREGOUT | 100 | mA | 24 | |||
| 5 V Regulator Dropout Voltage | VDROPOUT | 0.8 | V | Output Current = 100 mA | 24 | ||
| Ambient Temperature Under Bias | TBIAS | -55 | 125 | °C | 30 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 30 | ||
| Voltage on VDD | VDD | -0.3 | 4.2 | V | Min printed as GND-0.3 (referenced to GND) | 30 | |
| Voltage on VIO | VIO | -0.3 | 4.2 | V | Min printed as GND-0.3 (referenced to GND) | 30 | |
| Voltage on VREGIN | VREGIN | -0.3 | 5.8 | V | Min printed as GND-0.3 (referenced to GND) | 30 | |
| Voltage on D+ or D- | VUSBD | -0.3 | V | Max printed as VDD+0.3 V; min printed as GND-0.3 | 30 | ||
| Voltage on I/O pins (including VBUS / P3.1) or RSTb | VIN | -0.3 | 5.8 | V | VIO > 3.3 V; min printed as GND-0.3 | 30 | |
| Voltage on I/O pins (including VBUS / P3.1) or RSTb | VIN | -0.3 | V | VIO < 3.3 V; max printed as VIO+2.5 V; min printed as GND-0.3 | 30 | ||
| Total Current Sunk into Supply Pin | IVDD | 400 | mA | 30 | |||
| Total Current Sourced out of Ground Pin | IGND | 400 | mA | 30 | |||
| Current Sourced or Sunk by any I/O Pin or RSTb | IIO | -100 | 100 | mA | 30 | ||
| Operating Junction Temperature | TJ | -40 | 105 | °C | 30 | ||
| Thermal Resistance (Junction to Ambient), QSOP-24 Package | θJA | 65 | °C/W | 30 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. | 51 |
CAD (KiCad official)
- Symbol:
EFM8UB11F16G-C-QSOP24 - Footprint:
Package_SO:QSOP-24_3.9x8.7mm_P0.635mm - 3D model: QSOP-24-150mil (KiCad packages3D, STEP)
- 3D model files:
efm8ub11f16g-c-qsop24-etched.step/efm8ub11f16g-c-qsop24-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);efm8ub11f16g-c-qsop24.step/efm8ub11f16g-c-qsop24.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SILICON LABS datasheet (64 pp, sha256
3e758157389e7851, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).