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EFM8LB11F32ES0-C-QFN24R

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SILICON LABS Microcontroller Units (MCUs/MPUs/SOCs), QFN-24-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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EFM8LB11F32ES0-C-QFN24R

SILICON LABS · Microcontroller Units (MCUs/MPUs/SOCs) · QFN-24-EP(3x3)

EFM8LB11F32ES0-C-QFN24R from SILICON LABS, in a QFN-24-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P0.1 bidirectional Multifunction I/O with crossbar capability, also ADC0.0 and comparator 0 input CMP0P.0/CMP0N.0.
2 P0.0 bidirectional Multifunction I/O with crossbar capability, also VREF voltage reference pin.
3 GND power_in Ground.
4 VDD / VIO power_in Supply power input; device operation is specified from 2.2 V to 3.6 V supply.
5 RSTb / C2CK input Active-low reset input, also C2 debug clock.
6 P3.0 / C2D bidirectional Multifunction I/O, also C2 debug data (C2D).
7 P2.3 bidirectional Multifunction I/O with crossbar capability, also DAC3 output.
8 P2.2 bidirectional Multifunction I/O with crossbar capability, also DAC2 output.
9 P2.1 bidirectional Multifunction I/O with crossbar capability, also DAC1 output.
10 P2.0 bidirectional Multifunction I/O with crossbar capability, also DAC0 output.
11 P1.6 bidirectional Multifunction I/O with crossbar capability, also ADC0.11 and comparator 1 input CMP1P.5/CMP1N.5.
12 P1.5 bidirectional Multifunction I/O with crossbar capability, also ADC0.10 and comparator 1 input CMP1P.4/CMP1N.4.
13 P1.4 bidirectional Multifunction I/O with crossbar capability, also I2C0_SCL and ADC0.9.
14 P1.3 bidirectional Multifunction I/O with crossbar capability, also I2C0_SDA and comparator 1 input CMP1P.2/CMP1N.2.
15 GND power_in Ground.
16 P1.2 bidirectional Multifunction I/O with crossbar capability, also ADC0.8.
17 P1.1 bidirectional Multifunction I/O with crossbar capability, also ADC0.7.
18 P1.0 bidirectional Multifunction I/O with crossbar capability, also ADC0.6.
19 P0.7 bidirectional Multifunction I/O with crossbar capability, also ADC0.5, comparator 0 input CMP0P.5/CMP0N.5 and comparator 1 input CMP1P.1/CMP1N.1.
20 P0.6 bidirectional Multifunction I/O with crossbar capability, also CNVSTR, ADC0.4 and comparator inputs CMP0P.4/CMP0N.4 and CMP1P.0/CMP1N.0.
21 P0.5 bidirectional Multifunction I/O with crossbar capability, also UART0_RX and ADC0.3.
22 P0.4 bidirectional Multifunction I/O with crossbar capability, also UART0_TX and ADC0.2.
23 P0.3 bidirectional Multifunction I/O with crossbar capability, also EXTCLK external clock input and EXTOSC external oscillator.
24 P0.2 bidirectional Multifunction I/O with crossbar capability, also ADC0.1 and comparator 0 input CMP0P.1/CMP0N.1.
25 GND power_in Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer SILICON LABS
Package QFN-24-EP(3x3)
Category Single Chip Microcomputer/Microcontroller
Pins 25

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Supply Voltage on VDD VDD 2.2 3.6 V 18
Operating Supply Voltage on VIO VIO 2.2 V 18
Operating Supply Voltage on VIO (reduced range) VIO 1.713 V 18
System Clock Frequency fSYSCLK 0 73.5 MHz 18
Operating Ambient Temperature TA -40 105 °C 18
Digital Core Supply Current Normal Mode IDD 12.9 15 mA FSYSCLK = 72 MHz (HFOSC1) 19
Digital Core Supply Current Normal Mode IDD 4.2 5 mA FSYSCLK = 24.5 MHz (HFOSC0) 19
Digital Core Supply Current Normal Mode IDD 625 1050 μA FSYSCLK = 1.53 MHz (HFOSC0) 19
Digital Core Supply Current Normal Mode IDD 155 575 μA FSYSCLK = 80 kHz 19
Digital Core Supply Current Idle Mode IDD 9.6 11.1 mA FSYSCLK = 72 MHz (HFOSC1) 19
Digital Core Supply Current Idle Mode IDD 3.14 3.8 mA FSYSCLK = 24.5 MHz (HFOSC0) 19
Digital Core Supply Current Idle Mode IDD 520 950 μA FSYSCLK = 1.53 MHz (HFOSC0) 19
Digital Core Supply Current Idle Mode IDD 135 550 μA FSYSCLK = 80 kHz 19
Suspend Mode Supply Current IDD 125 545 μA LFO Running 19
Suspend Mode Supply Current IDD 120 535 μA LFO Stopped 19
Snooze Mode Supply Current IDD 23 430 μA LFO Running 19
Snooze Mode Supply Current IDD 19 425 μA LFO Stopped 19
Stop Mode Supply Current IDD 120 535 μA Core halted and all clocks stopped, Internal LDO On, Supply monitor off 19
Shutdown Mode Supply Current IDD 0.2 2.1 μA Core halted, all clocks stopped, Internal LDO Off, Supply monitor off 19
High-Frequency Oscillator 0 Supply Current IHFOSC0 120 135 μA Operating at 24.5 MHz, TA = 25 °C 19
High-Frequency Oscillator 1 Supply Current IHFOSC1 1285 1340 μA Operating at 72 MHz, TA = 25 °C 19
Low-Frequency Oscillator Supply Current ILFOSC 3.7 6 μA Operating at 80 kHz, TA = 25 °C 19
Throughput Rate High Speed Mode 14-bit fS 900 ksps 14 Bit Mode 24
Throughput Rate High Speed Mode 12-bit fS 1 Msps 12 Bit Mode 24
Throughput Rate High Speed Mode 10-bit fS 1.125 Msps 10 Bit Mode 24
Throughput Rate Low Power Mode 14-bit fS 320 ksps 14 Bit Mode 24
Throughput Rate Low Power Mode 12-bit fS 340 ksps 12 Bit Mode 24
Throughput Rate Low Power Mode 10-bit fS 360 ksps 10 Bit Mode 24
Tracking Time High Speed Mode tTRK 217.81 ns High Speed Mode 24
Tracking Time Low Power Mode tTRK 450 ns Low Power Mode 24
Power-On Time tPWR 1.2 μs 24
SAR Clock Frequency High Speed Mode fSAR 18.36 MHz High Speed Mode 24
SAR Clock Frequency Low Power Mode fSAR 12.25 MHz Low Power Mode 24
Voltage Reference Range VREF 1 V 24
Internal Fast Settling Reference Output Voltage VREFFS 1.62 1.65 1.68 V Full Temperature and Supply Range 27
Internal Fast Settling Reference Turn-on Time tREFFS 1.5 μs 27
On-chip Precision Reference Valid Supply Range 1.2 V Output VDD 2.2 3.6 V 1.2 V Output 27
On-chip Precision Reference Valid Supply Range 2.4 V Output VDD 2.7 3.6 V 2.4 V Output 27
On-chip Precision Reference Output Voltage 1.2 V VREFP 1.195 1.2 1.205 V 1.2 V Output, VDD = 3.3 V, T = 25 °C 27
On-chip Precision Reference Output Voltage 1.2 V VREFP 1.18 1.2 1.22 V 1.2 V Output 27
On-chip Precision Reference Output Voltage 2.4 V VREFP 2.39 2.4 2.41 V 2.4 V Output, VDD = 3.3 V, T = 25 °C 27
On-chip Precision Reference Output Voltage 2.4 V VREFP 2.36 2.4 2.44 V 2.4 V Output 27
Load Capacitor CVREFP 0.1 μF Load = 0 to 200 µA to GND 27
Short-circuit current ISCVREFP 8 mA 27
Linearity LIN -0.1 0.15 °C T = 0 °C to 70 °C 28
Linearity LIN -0.2 0.35 °C T = -20 °C to 85 °C 28
Linearity LIN -0.4 0.8 °C T = -40 °C to 105 °C 28
Temp Sensor Error Using Typical Slope and Factory-Calibrated Offset ETOT -2.6 1.8 °C T = 0 °C to 70 °C 28
Temp Sensor Error Using Typical Slope and Factory-Calibrated Offset ETOT -2.9 2.7 °C T = -20 °C to 85 °C 28
Temp Sensor Error Using Typical Slope and Factory-Calibrated Offset ETOT -3.2 4.2 °C T = -40 °C to 105 °C 28
Output Voltage 1.8V Internal LDO VOUT_1.8V 1.79 1.84 1.88 V 28
Thermal Resistance (Junction to Ambient) QFN24 θJA 30 °C/W QFN24 Packages 35
Thermal Resistance (Junction to Case) QFN24 θJC 32.8 °C/W QFN24 Packages 35
Ambient Temperature Under Bias TBIAS -55 125 °C 36
Storage Temperature TSTG -65 150 °C 36
Voltage on VDD VDD 4.2 V 36
Voltage on I/O pins or RSTb VIN 5.8 V VIO > 3.3 V 36
Total Current Sunk into Supply Pin IVDD 400 mA 36
Total Current Sourced out of Ground Pin IGND 400 mA 36
Current Sourced or Sunk by any I/O Pin or RSTb IIO -100 100 mA 36
Operating Junction Temperature TJ -40 130 °C TA = -40 °C to 105 °C 36

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for Small Body Components. 60

CAD (KiCad official)

  • Symbol: EFM8LB11F32ES0-C-QFN24R
  • Footprint: Package_DFN_QFN:QFN-24-1EP_3x3mm_P0.4mm_EP1.75x1.6mm
  • 3D model: QFN-24-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: efm8lb11f32es0-c-qfn24r-etched.step / efm8lb11f32es0-c-qfn24r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); efm8lb11f32es0-c-qfn24r.step / efm8lb11f32es0-c-qfn24r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SILICON LABS datasheet (77 pp, sha256 4bb882f3cda45564, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF