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EFM8BB10F8G-A-SOIC16R

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SILICON LABS Microcontroller Units (MCUs/MPUs/SOCs), SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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EFM8BB10F8G-A-SOIC16R

SILICON LABS · Microcontroller Units (MCUs/MPUs/SOCs) · SOIC-16

EFM8BB10F8G-A-SOIC16R from SILICON LABS, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P0.2 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P0MAT.2, INT0.2, INT1.2, ADC0.2, CMP0P.2 and CMP0N.2.
2 P0.1 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P0MAT.1, INT0.1, INT1.1, ADC0.1, CMP0P.1 and CMP0N.1.
3 P0.0 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P0MAT.0, INT0.0, INT1.0, ADC0.0, CMP0P.0 and CMP0N.0.
4 GND power_in Ground.
5 VDD power_in Supply power input, specified for 2.2 to 3.6 V operation.
6 RSTb / C2CK bidirectional Active-low reset input and C2 debug clock.
7 P2.0 / C2D bidirectional Multifunction I/O (no crossbar) and C2 debug data.
8 P1.3 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P1MAT.3, ADC0.11, CMP1P.5 and CMP1N.5.
9 P1.2 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P1MAT.2, ADC0.10, CMP1P.4 and CMP1N.4.
10 P1.1 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P1MAT.1, ADC0.9, CMP1P.3 and CMP1N.3.
11 P1.0 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P1MAT.0, ADC0.8, CMP1P.2 and CMP1N.2.
12 P0.7 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P0MAT.7, INT0.7, INT1.7, ADC0.7, CMP1P.1 and CMP1N.1.
13 P0.6 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P0MAT.6, CNVSTR, INT0.6, INT1.6, ADC0.6, CMP1P.0 and CMP1N.0.
14 P0.5 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P0MAT.5, INT0.5, INT1.5, ADC0.5, CMP0P.5 and CMP0N.5.
15 P0.4 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P0MAT.4, INT0.4, INT1.4, ADC0.4, CMP0P.4 and CMP0N.4.
16 P0.3 bidirectional Multifunction 5 V tolerant I/O with crossbar capability, also P0MAT.3, EXTCLK, INT0.3, INT1.3, ADC0.3, CMP0P.3 and CMP0N.3.

Key specifications

Parameter Value
Manufacturer SILICON LABS
Package SOIC-16
Category Single Chip Microcomputer/Microcontroller
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating Supply Voltage on VDD VDD 2.2 3.6 V 15
System Clock Frequency fSYSCLK 0 25 MHz 15
Operating Ambient Temperature TA -40 85 °C G-grade devices 15
Normal Mode supply current IDD 4.45 4.85 mA FSYSCLK = 24.5 MHz, G-grade 16
Normal Mode supply current IDD 915 1150 μA FSYSCLK = 1.53 MHz, G-grade 16
Normal Mode supply current IDD 250 290 μA FSYSCLK = 80 kHz, TA = 25 °C, G-grade 16
Normal Mode supply current IDD 250 380 μA FSYSCLK = 80 kHz, G-grade 16
Idle Mode supply current IDD 2.05 2.3 mA FSYSCLK = 24.5 MHz, G-grade 16
Idle Mode supply current IDD 550 700 μA FSYSCLK = 1.53 MHz, G-grade 16
Idle Mode supply current IDD 125 130 μA FSYSCLK = 80 kHz, TA = 25 °C, G-grade 16
Idle Mode supply current IDD 125 200 μA FSYSCLK = 80 kHz, G-grade 16
Stop Mode supply current IDD 105 120 μA TA = 25 °C, G-grade 16
Stop Mode supply current IDD 105 170 μA TA = -40 to +85 °C, G-grade 16
Shutdown Mode supply current IDD 0.2 μA Internal LDO Off, Supply monitor off 16
High-Frequency Oscillator supply current IHFOSC 155 µA Operating at 24.5 MHz, TA = 25 °C 16
Low-Frequency Oscillator supply current ILFOSC 3.5 µA Operating at 80 kHz, TA = 25 °C 16
External Input CMOS Clock Frequency fCMOS 0 25 MHz at EXTCLK pin 20
External Input CMOS Clock High Time tCMOSH 18 ns 20
External Input CMOS Clock Low Time tCMOSL 18 ns 20
ADC Throughput Rate (High Speed Mode) fS 200 ksps 12 Bit Mode 21
ADC Throughput Rate (High Speed Mode) fS 800 ksps 10 Bit Mode 21
ADC Throughput Rate (Low Power Mode) fS 62.5 ksps 12 Bit Mode 21
ADC Throughput Rate (Low Power Mode) fS 250 ksps 10 Bit Mode 21
ADC Tracking Time tTRK 230 ns High Speed Mode 21
ADC Tracking Time tTRK 450 ns Low Power Mode 21
ADC Power-On Time tPWR 1.2 µs 21
SAR Clock Frequency fSAR 6.25 MHz High Speed Mode, Reference is 2.4 V internal 21
SAR Clock Frequency fSAR 12.5 MHz High Speed Mode, Reference is not 2.4 V internal 21
SAR Clock Frequency fSAR 4 MHz Low Power Mode 21
ADC Voltage Reference Range VREF 1 V max printed as VDD 21
ADC Input Voltage Range VIN 0 V Gain = 1, max printed as VREF 21
ADC Integral Nonlinearity INL 1 2.3 LSB 12 Bit Mode, printed ± 21
ADC Integral Nonlinearity INL 0.2 0.6 LSB 10 Bit Mode, printed ± 21
ADC Differential Nonlinearity DNL -1 0.7 1.9 LSB 12 Bit Mode, typ printed ± 21
ADC Differential Nonlinearity DNL 0.2 0.6 LSB 10 Bit Mode, printed ± 21
ADC Offset Error EOFF -3 0 3 LSB 12 Bit Mode, VREF = 1.65 V 21
ADC Offset Error EOFF -2 0 2 LSB 10 Bit Mode, VREF = 1.65 V 21
ADC Slope Error EM 0.02 0.1 % 12 Bit Mode, printed ± 22
ADC Slope Error EM 0.06 0.24 % 10 Bit Mode, printed ± 22
ADC Signal-to-Noise SNR 61 66 dB 12 Bit Mode, 10 kHz sine wave 1dB below full scale, max throughput, using AGND pin 22
ADC Signal-to-Noise SNR 53 60 dB 10 Bit Mode, 10 kHz sine wave 1dB below full scale, max throughput, using AGND pin 22
ADC Signal-to-Noise Plus Distortion SNDR 61 66 dB 12 Bit Mode, 10 kHz sine wave 1dB below full scale, max throughput, using AGND pin 22
ADC Signal-to-Noise Plus Distortion SNDR 53 60 dB 10 Bit Mode, 10 kHz sine wave 1dB below full scale, max throughput, using AGND pin 22
Internal Fast Settling Reference Output Voltage VREFFS 1.62 1.65 1.68 V 1.65 V Setting 22
Internal Fast Settling Reference Output Voltage VREFFS 2.35 2.4 2.45 V 2.4 V Setting, VDD ≥ 2.6 V 22
Reference Temperature Coefficient TCREFFS 50 ppm/°C 22
Reference Turn-on Time tREFFS 1.5 µs 22
1.8 V LDO Output Voltage VOUT_1.8V 1.74 1.8 1.85 V 23
Temperature Sensor Slope M 2.85 mV/°C 23
Thermal Resistance (Junction to Ambient) θJA 70 °C/W SOIC-16 Packages 29
Ambient Temperature Under Bias TBIAS -55 125 °C 29
Storage Temperature TSTG -65 150 °C 29
Voltage on VDD VDD -0.3 4.2 V min printed as GND-0.3 29
Voltage on I/O pins or RST VIN -0.3 5.8 V VDD ≥ 3.3 V, min printed as GND-0.3 29
Voltage on I/O pins or RST VIN -0.3 V V < 3.3 V, min printed as GND-0.3, max printed as VDD+2.5 29
Total Current Sunk into Supply Pin IVDD 200 mA 29
Total Current Sourced out of Ground Pin IGND 200 mA 29
Current Sourced or Sunk by Any I/O Pin or RSTb IIO -100 100 mA 29
Operating Junction Temperature TJ -40 105 °C TA = -40 °C to 85 °C 29

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components. 45

CAD (KiCad official)

  • Symbol: EFM8BB10F8G-A-SOIC16R
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: efm8bb10f8g-a-soic16r-etched.step / efm8bb10f8g-a-soic16r-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); efm8bb10f8g-a-soic16r.step / efm8bb10f8g-a-soic16r.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SILICON LABS datasheet (57 pp, sha256 1da0fc0d823d42c4, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF