component
EFM32ZG222F32-B-QFP48R
Public Made by Adomby adom
SKYWORKS/SILICON LABS Microcontrollers (MCU/MPU/SOC), TQFP-48(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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EFM32ZG222F32-B-QFP48R
SKYWORKS/SILICON LABS · Microcontrollers (MCU/MPU/SOC) · TQFP-48(7x7)
EFM32ZG222F32-B-QFP48R from SKYWORKS/SILICON LABS, in a TQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PA0 | bidirectional | GPIO PA0 with alternate functions TIM0_CC0, LEU0_RX (location 4), I2C0_SDA (location 0), PRS_CH0 (location 0) and GPIO_EM4WU0 wake-up from EM4. |
| 2 | PA1 | bidirectional | GPIO PA1 with alternate functions TIM0_CC1, I2C0_SCL (location 0), CMU_CLK1 (location 0) and PRS_CH1 (location 0). |
| 3 | PA2 | bidirectional | GPIO PA2 with alternate functions TIM0_CC2 (locations 0/1) and CMU_CLK0 (location 0). |
| 4 | IOVDD_0 | power_in | Digital IO power supply 0. |
| 5 | VSS | power_in | Ground. |
| 6 | PC0 | bidirectional | GPIO PC0 with analog input ACMP0_CH0 and alternate functions TIM0_CC1 (location 4), PCNT0_S0IN (location 2), US1_TX (location 0), I2C0_SDA (location 4) and PRS_CH2 (location 0). |
| 7 | PC1 | bidirectional | GPIO PC1 with analog input ACMP0_CH1 and alternate functions TIM0_CC2 (location 4), PCNT0_S1IN (location 2), US1_RX (location 0), I2C0_SCL (location 4) and PRS_CH3 (location 0). |
| 8 | PC2 | bidirectional | GPIO PC2 with analog input ACMP0_CH2. |
| 9 | PC3 | bidirectional | GPIO PC3 with analog input ACMP0_CH3. |
| 10 | PC4 | bidirectional | GPIO PC4 with analog input ACMP0_CH4. |
| 11 | PB7 | bidirectional | GPIO PB7 used as LFXTAL_P low frequency crystal positive pin, with alternate functions TIM1_CC0 (location 3) and US1_CLK (location 0). |
| 12 | PB8 | bidirectional | GPIO PB8 used as LFXTAL_N low frequency crystal negative pin (also an optional external clock input), with alternate functions TIM1_CC1 (location 3) and US1_CS (location 0). |
| 13 | PA8 | bidirectional | GPIO PA8 with no alternate functionality listed in the pinout table. |
| 14 | PA9 | bidirectional | GPIO PA9 with no alternate functionality listed in the pinout table. |
| 15 | PA10 | bidirectional | GPIO PA10 with no alternate functionality listed in the pinout table. |
| 16 | RESETn | input | Reset input, active low; to apply an external reset, drive this pin low only during reset and let the internal pull-up release reset. |
| 17 | PB11 | bidirectional | GPIO PB11 with IDAC0_OUT current DAC output and alternate function TIM1_CC2 (location 3). |
| 18 | VSS | power_in | Ground. |
| 19 | AVDD_1 | power_in | Analog power supply 1. |
| 20 | PB13 | bidirectional | GPIO PB13 used as HFXTAL_P high frequency crystal positive pin, with alternate function LEU0_TX (location 1). |
| 21 | PB14 | bidirectional | GPIO PB14 used as HFXTAL_N high frequency crystal negative pin (also an optional external clock input), with alternate function LEU0_RX (location 1). |
| 22 | IOVDD_3 | power_in | Digital IO power supply 3. |
| 23 | AVDD_0 | power_in | Analog power supply 0. |
| 24 | PD4 | bidirectional | GPIO PD4 with analog input ADC0_CH4 and alternate function LEU0_TX (location 0). |
| 25 | PD5 | bidirectional | GPIO PD5 with analog input ADC0_CH5 and alternate function LEU0_RX (location 0). |
| 26 | PD6 | bidirectional | GPIO PD6 with analog input ADC0_CH6 and alternate functions TIM1_CC0 (location 4), PCNT0_S0IN (location 3), US1_RX (locations 2/3), I2C0_SDA (location 1) and ACMP0_O (location 2). |
| 27 | PD7 | bidirectional | GPIO PD7 with analog input ADC0_CH7 and alternate functions TIM1_CC1 (location 4), PCNT0_S1IN (location 3), US1_TX (locations 2/3), I2C0_SCL (location 1) and CMU_CLK0 (location 2). |
| 28 | VDD_DREG | power_in | Power supply for on-chip voltage regulator. |
| 29 | DECOUPLE | passive | Decouple output for on-chip voltage regulator; an external capacitance of size CDECOUPLE is required at this pin. |
| 30 | PC8 | bidirectional | GPIO PC8 with no alternate functionality listed in the pinout table. |
| 31 | PC9 | bidirectional | GPIO PC9 with alternate function GPIO_EM4WU2 that can wake the system up from EM4. |
| 32 | PC10 | bidirectional | GPIO PC10 with no alternate functionality listed in the pinout table. |
| 33 | PC11 | bidirectional | GPIO PC11 with no alternate functionality listed in the pinout table. |
| 34 | PC13 | bidirectional | GPIO PC13 with alternate functions TIM1_CC0 (location 0), TIM1_CC2 (location 4) and PCNT0_S0IN (location 0). |
| 35 | PC14 | bidirectional | GPIO PC14 with alternate functions TIM1_CC1 (location 0), PCNT0_S1IN (location 0), US1_CS (location 3) and PRS_CH0 (location 2). |
| 36 | PC15 | bidirectional | GPIO PC15 with alternate functions TIM1_CC2 (location 0), US1_CLK (location 3) and PRS_CH1 (location 2). |
| 37 | PF0 | bidirectional | GPIO PF0 with alternate functions TIM0_CC0 (location 5), US1_CLK (location 2), LEU0_TX (location 3), I2C0_SDA (location 5), DBG_SWCLK (location 0, built-in pull down) and BOOT_TX. |
| 38 | PF1 | bidirectional | GPIO PF1 with alternate functions TIM0_CC1 (location 5), US1_CS (location 2), LEU0_RX (location 3), I2C0_SCL (location 5), DBG_SWDIO (location 0, built-in pull up), GPIO_EM4WU3 and BOOT_RX. |
| 39 | PF2 | bidirectional | GPIO PF2 with alternate functions TIM0_CC2 (location 5), LEU0_TX (location 4) and GPIO_EM4WU4 wake-up from EM4. |
| 40 | PF3 | bidirectional | GPIO PF3 with alternate function PRS_CH0 (location 1). |
| 41 | PF4 | bidirectional | GPIO PF4 with alternate function PRS_CH1 (location 1). |
| 42 | PF5 | bidirectional | GPIO PF5 with alternate function PRS_CH2 (location 1). |
| 43 | IOVDD_5 | power_in | Digital IO power supply 5. |
| 44 | VSS | power_in | Ground. |
| 45 | PE10 | bidirectional | GPIO PE10 with alternate functions TIM1_CC0 (location 1) and PRS_CH2 (location 2). |
| 46 | PE11 | bidirectional | GPIO PE11 with alternate functions TIM1_CC1 (location 1) and PRS_CH3 (location 2). |
| 47 | PE12 | bidirectional | GPIO PE12 with alternate functions TIM1_CC2 (location 1), I2C0_SDA (location 6) and CMU_CLK1 (location 2). |
| 48 | PE13 | bidirectional | GPIO PE13 with alternate functions I2C0_SCL (location 6), ACMP0_O (location 0) and GPIO_EM4WU5 wake-up from EM4. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SKYWORKS/SILICON LABS |
| Package | TQFP-48(7x7) |
| Category | Embedded Processors & Controllers |
| Pins | 48 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage temperature range | TSTG | -40 | 150 | °C | 17 | ||
| Maximum soldering temperature | TS | 260 | °C | Latest IPC/JEDEC J-STD-020 Standard | 17 | ||
| External main supply voltage | VDDMAX | 0 | 3.8 | V | 17 | ||
| Voltage on any I/O pin | VIOPIN | -0.3 | V | Maximum printed as VDD+0.3 | 17 | ||
| Current per I/O pin (sink) | IIOMAX_SINK | 100 | mA | 17 | |||
| Current per I/O pin (source) | IIOMAX_SOURCE | -100 | mA | 17 | |||
| Ambient temperature range | TAMB | -40 | 85 | °C | 17 | ||
| Operating supply voltage | VDDOP | 1.98 | 3.8 | V | 17 | ||
| Internal APB clock frequency | fAPB | 24 | MHz | 17 | |||
| Internal AHB clock frequency | fAHB | 24 | MHz | 17 | |||
| BOD threshold on falling external supply voltage | VBODextthr- | 1.74 | 1.96 | V | 27 | ||
| Flash erase cycles before failure | ECFLASH | 20000 | cycles | 28 | |||
| Flash word write cycles between erase | WWCFLASH | 2 | cycles | Maximum of two writes to the same word between erases (Note 1) | 28 | ||
| Flash data retention | RETFLASH | 10000 | h | TAMB<150 °C | 28 | ||
| Flash data retention | RETFLASH | 10 | years | TAMB<85 °C | 28 | ||
| Flash data retention | RETFLASH | 20 | years | TAMB<70 °C | 28 | ||
| Word (32-bit) programming time | tW_PROG | 20 | µs | 28 | |||
| Page erase time | tPERASE | 20 | 20.4 | 20.8 | ms | 28 | |
| Device erase time | tDERASE | 40 | 40.8 | 41.6 | ms | 28 | |
| Erase current | IERASE | 7 | mA | Measured at 25 °C | 28 | ||
| Write current | IWRITE | 7 | mA | Measured at 25 °C | 28 | ||
| Supply voltage during flash erase and write | VFLASH | 1.98 | 3.8 | V | 28 | ||
| Input leakage current | IIOLEAK | -100 | 0.1 | 100 | nA | High impedance IO connected to GROUND or VDD | 30 |
| Pulse width of pulses to be removed by the glitch suppression filter | tIO-GLITCH | 10 | 50 | ns | 30 | ||
| Supported crystal equivalent series resistance (ESR) | ESRLFXO | 30 | 120 | kΩ | LFXO | 37 | |
| Supported crystal external load range | CLFXOL | 5 | 25 | pF | LFXO | 37 | |
| Supported nominal crystal frequency | fHFXO | 4 | 24 | MHz | HFXO | 37 | |
| Supported crystal equivalent series resistance (ESR) | ESRHFXO | 30 | 100 | Ω | Crystal frequency 24 MHz | 37 | |
| Supported crystal equivalent series resistance (ESR) | ESRHFXO | 400 | 1500 | Ω | Crystal frequency 4 MHz | 37 | |
| Transconductance of the HFXO input transistor at crystal startup | gmHFXO | 20 | mS | HFXOBOOST in CMU_CTRL equals 0b11 | 37 | ||
| Oscillation frequency | fLFRCO | 31.29 | 32.768 | 34.28 | kHz | VDD=3.0 V, TAMB=25°C | 38 |
| Oscillation frequency, 21 MHz band | fHFRCO | 20.37 | 21 | 21.63 | MHz | VDD=3.0 V, TAMB=25°C; 21 MHz frequency band | 39 |
| Oscillation frequency, 14 MHz band | fHFRCO | 13.58 | 14 | 14.42 | MHz | VDD=3.0 V, TAMB=25°C; 14 MHz frequency band | 39 |
| Oscillation frequency, 11 MHz band | fHFRCO | 10.67 | 11 | 11.33 | MHz | VDD=3.0 V, TAMB=25°C; 11 MHz frequency band | 39 |
| Oscillation frequency, 7 MHz band | fHFRCO | 6.4 | 6.6 | 6.8 | MHz | VDD=3.0 V, TAMB=25°C; 7 MHz frequency band | 39 |
| Oscillation frequency, 1 MHz band | fHFRCO | 1.15 | 1.2 | 1.25 | MHz | VDD=3.0 V, TAMB=25°C; 1 MHz frequency band | 39 |
| Current consumption, 21 MHz | IHFRCO | 93 | 175 | µA | fHFRCO = 21 MHz | 39 | |
| Current consumption, 14 MHz | IHFRCO | 77 | 140 | µA | fHFRCO = 14 MHz | 39 | |
| Current consumption, 11 MHz | IHFRCO | 72 | 125 | µA | fHFRCO = 11 MHz | 39 | |
| Current consumption, 6.6 MHz | IHFRCO | 63 | 105 | µA | fHFRCO = 6.6 MHz | 39 | |
| Current consumption, 1.2 MHz | IHFRCO | 22 | 40 | µA | fHFRCO = 1.2 MHz | 39 | |
| Average active current, ADC | IADC | 351 | 500 | µA | 1 MSamples/s, 12-bit, external reference | 43 | |
| Current consumption of internal voltage reference | IADCREF | 65 | 127 | µA | Internal voltage reference | 43 | |
| Input ON resistance | RADCIN | 300 | 800 | Ω | 43 | ||
| ADC clock frequency | fADCCLK | 13 | MHz | 43 | |||
| Conversion time 12-bit | tADCCONV | 13 | ADCCLK cycles | 12-bit | 43 | ||
| Acquisition time | tADCACQ | 1 | 256 | ADCCLK cycles | Programmable | 44 | |
| Required acquisition time for VDD/3 reference | tADCACQVDD3 | 2 | µs | 44 | |||
| Offset voltage | VADCOFFSET | -4 | 0.3 | 4 | mV | After calibration, single-ended | 46 |
| Differential non-linearity (DNL) | DNLADC | -1 | 0.7 | 4 | LSB | VDD=3.0 V, external 2.5V reference | 46 |
| Current consumption, EM0 24 MHz HFXO 25°C | IEM0 | 115 | 132 | µA/MHz | 24 MHz HFXO, all peripheral clocks disabled, VDD=3.0 V, TAMB=25°C | 18 | |
| Current consumption, EM4 85°C | IEM4 | 0.29 | 0.7 | µA | VDD=3.0 V, TAMB=85°C | 19 | |
| Current consumption, EM3 85°C | IEM3 | 1.3 | 2 | µA | EM3 current (ULFRCO enabled, LFRCO/LFXO disabled), VDD=3.0 V, TAMB=85°C | 19 | |
| SCL clock frequency, Standard-mode | fSCL | 0 | 100 | kHz | I2C Standard-mode (Sm) | 63 | |
| SDA hold time, Standard-mode | tHD,DAT | 8 | 3450 | ns | I2C Standard-mode (Sm); maximum applies only when SCL low time is not stretched | 63 | |
| SDA hold time, Fast-mode | tHD,DAT | 8 | 900 | ns | I2C Fast-mode (Fm); maximum applies only when SCL low time is not stretched | 63 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | gold | The TQFP48 package is 7 by 7 mm in size and has a 0.5 mm pin pitch. The TQFP48 package uses Nickel-Palladium-Gold preplated leadframe. | 95 |
CAD (KiCad official)
- Symbol:
EFM32ZG222F32-B-QFP48R - Footprint:
Package_QFP:TQFP-48_7x7mm_P0.5mm - 3D model: TQFP-48(7x7) (KiCad packages3D, STEP)
- 3D model files:
efm32zg222f32-b-qfp48r-etched.step/efm32zg222f32-b-qfp48r-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);efm32zg222f32-b-qfp48r.step/efm32zg222f32-b-qfp48r.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SKYWORKS/SILICON LABS datasheet (104 pp, sha256
6d1c4d21c94b4036, retrieved 2026-11-02, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# EFM32ZG222F32-B-QFP48R
**SKYWORKS/SILICON LABS** · Microcontrollers (MCU/MPU/SOC) · TQFP-48(7x7)
EFM32ZG222F32-B-QFP48R from SKYWORKS/SILICON LABS, in a TQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PA0 | bidirectional | GPIO PA0 with alternate functions TIM0_CC0, LEU0_RX (location 4), I2C0_SDA (location 0), PRS_CH0 (location 0) and GPIO_EM4WU0 wake-up from EM4. |
| 2 | PA1 | bidirectional | GPIO PA1 with alternate functions TIM0_CC1, I2C0_SCL (location 0), CMU_CLK1 (location 0) and PRS_CH1 (location 0). |
| 3 | PA2 | bidirectional | GPIO PA2 with alternate functions TIM0_CC2 (locations 0/1) and CMU_CLK0 (location 0). |
| 4 | IOVDD_0 | power_in | Digital IO power supply 0. |
| 5 | VSS | power_in | Ground. |
| 6 | PC0 | bidirectional | GPIO PC0 with analog input ACMP0_CH0 and alternate functions TIM0_CC1 (location 4), PCNT0_S0IN (location 2), US1_TX (location 0), I2C0_SDA (location 4) and PRS_CH2 (location 0). |
| 7 | PC1 | bidirectional | GPIO PC1 with analog input ACMP0_CH1 and alternate functions TIM0_CC2 (location 4), PCNT0_S1IN (location 2), US1_RX (location 0), I2C0_SCL (location 4) and PRS_CH3 (location 0). |
| 8 | PC2 | bidirectional | GPIO PC2 with analog input ACMP0_CH2. |
| 9 | PC3 | bidirectional | GPIO PC3 with analog input ACMP0_CH3. |
| 10 | PC4 | bidirectional | GPIO PC4 with analog input ACMP0_CH4. |
| 11 | PB7 | bidirectional | GPIO PB7 used as LFXTAL_P low frequency crystal positive pin, with alternate functions TIM1_CC0 (location 3) and US1_CLK (location 0). |
| 12 | PB8 | bidirectional | GPIO PB8 used as LFXTAL_N low frequency crystal negative pin (also an optional external clock input), with alternate functions TIM1_CC1 (location 3) and US1_CS (location 0). |
| 13 | PA8 | bidirectional | GPIO PA8 with no alternate functionality listed in the pinout table. |
| 14 | PA9 | bidirectional | GPIO PA9 with no alternate functionality listed in the pinout table. |
| 15 | PA10 | bidirectional | GPIO PA10 with no alternate functionality listed in the pinout table. |
| 16 | RESETn | input | Reset input, active low; to apply an external reset, drive this pin low only during reset and let the internal pull-up release reset. |
| 17 | PB11 | bidirectional | GPIO PB11 with IDAC0_OUT current DAC output and alternate function TIM1_CC2 (location 3). |
| 18 | VSS | power_in | Ground. |
| 19 | AVDD_1 | power_in | Analog power supply 1. |
| 20 | PB13 | bidirectional | GPIO PB13 used as HFXTAL_P high frequency crystal positive pin, with alternate function LEU0_TX (location 1). |
| 21 | PB14 | bidirectional | GPIO PB14 used as HFXTAL_N high frequency crystal negative pin (also an optional external clock input), with alternate function LEU0_RX (location 1). |
| 22 | IOVDD_3 | power_in | Digital IO power supply 3. |
| 23 | AVDD_0 | power_in | Analog power supply 0. |
| 24 | PD4 | bidirectional | GPIO PD4 with analog input ADC0_CH4 and alternate function LEU0_TX (location 0). |
| 25 | PD5 | bidirectional | GPIO PD5 with analog input ADC0_CH5 and alternate function LEU0_RX (location 0). |
| 26 | PD6 | bidirectional | GPIO PD6 with analog input ADC0_CH6 and alternate functions TIM1_CC0 (location 4), PCNT0_S0IN (location 3), US1_RX (locations 2/3), I2C0_SDA (location 1) and ACMP0_O (location 2). |
| 27 | PD7 | bidirectional | GPIO PD7 with analog input ADC0_CH7 and alternate functions TIM1_CC1 (location 4), PCNT0_S1IN (location 3), US1_TX (locations 2/3), I2C0_SCL (location 1) and CMU_CLK0 (location 2). |
| 28 | VDD_DREG | power_in | Power supply for on-chip voltage regulator. |
| 29 | DECOUPLE | passive | Decouple output for on-chip voltage regulator; an external capacitance of size CDECOUPLE is required at this pin. |
| 30 | PC8 | bidirectional | GPIO PC8 with no alternate functionality listed in the pinout table. |
| 31 | PC9 | bidirectional | GPIO PC9 with alternate function GPIO_EM4WU2 that can wake the system up from EM4. |
| 32 | PC10 | bidirectional | GPIO PC10 with no alternate functionality listed in the pinout table. |
| 33 | PC11 | bidirectional | GPIO PC11 with no alternate functionality listed in the pinout table. |
| 34 | PC13 | bidirectional | GPIO PC13 with alternate functions TIM1_CC0 (location 0), TIM1_CC2 (location 4) and PCNT0_S0IN (location 0). |
| 35 | PC14 | bidirectional | GPIO PC14 with alternate functions TIM1_CC1 (location 0), PCNT0_S1IN (location 0), US1_CS (location 3) and PRS_CH0 (location 2). |
| 36 | PC15 | bidirectional | GPIO PC15 with alternate functions TIM1_CC2 (location 0), US1_CLK (location 3) and PRS_CH1 (location 2). |
| 37 | PF0 | bidirectional | GPIO PF0 with alternate functions TIM0_CC0 (location 5), US1_CLK (location 2), LEU0_TX (location 3), I2C0_SDA (location 5), DBG_SWCLK (location 0, built-in pull down) and BOOT_TX. |
| 38 | PF1 | bidirectional | GPIO PF1 with alternate functions TIM0_CC1 (location 5), US1_CS (location 2), LEU0_RX (location 3), I2C0_SCL (location 5), DBG_SWDIO (location 0, built-in pull up), GPIO_EM4WU3 and BOOT_RX. |
| 39 | PF2 | bidirectional | GPIO PF2 with alternate functions TIM0_CC2 (location 5), LEU0_TX (location 4) and GPIO_EM4WU4 wake-up from EM4. |
| 40 | PF3 | bidirectional | GPIO PF3 with alternate function PRS_CH0 (location 1). |
| 41 | PF4 | bidirectional | GPIO PF4 with alternate function PRS_CH1 (location 1). |
| 42 | PF5 | bidirectional | GPIO PF5 with alternate function PRS_CH2 (location 1). |
| 43 | IOVDD_5 | power_in | Digital IO power supply 5. |
| 44 | VSS | power_in | Ground. |
| 45 | PE10 | bidirectional | GPIO PE10 with alternate functions TIM1_CC0 (location 1) and PRS_CH2 (location 2). |
| 46 | PE11 | bidirectional | GPIO PE11 with alternate functions TIM1_CC1 (location 1) and PRS_CH3 (location 2). |
| 47 | PE12 | bidirectional | GPIO PE12 with alternate functions TIM1_CC2 (location 1), I2C0_SDA (location 6) and CMU_CLK1 (location 2). |
| 48 | PE13 | bidirectional | GPIO PE13 with alternate functions I2C0_SCL (location 6), ACMP0_O (location 0) and GPIO_EM4WU5 wake-up from EM4. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SKYWORKS/SILICON LABS |
| Package | TQFP-48(7x7) |
| Category | Embedded Processors & Controllers |
| Pins | 48 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage temperature range | TSTG | -40 | | 150 | °C | | 17 |
| Maximum soldering temperature | TS | | | 260 | °C | Latest IPC/JEDEC J-STD-020 Standard | 17 |
| External main supply voltage | VDDMAX | 0 | | 3.8 | V | | 17 |
| Voltage on any I/O pin | VIOPIN | -0.3 | | | V | Maximum printed as VDD+0.3 | 17 |
| Current per I/O pin (sink) | IIOMAX_SINK | | | 100 | mA | | 17 |
| Current per I/O pin (source) | IIOMAX_SOURCE | -100 | | | mA | | 17 |
| Ambient temperature range | TAMB | -40 | | 85 | °C | | 17 |
| Operating supply voltage | VDDOP | 1.98 | | 3.8 | V | | 17 |
| Internal APB clock frequency | fAPB | | | 24 | MHz | | 17 |
| Internal AHB clock frequency | fAHB | | | 24 | MHz | | 17 |
| BOD threshold on falling external supply voltage | VBODextthr- | 1.74 | | 1.96 | V | | 27 |
| Flash erase cycles before failure | ECFLASH | 20000 | | | cycles | | 28 |
| Flash word write cycles between erase | WWCFLASH | | | 2 | cycles | Maximum of two writes to the same word between erases (Note 1) | 28 |
| Flash data retention | RETFLASH | 10000 | | | h | TAMB<150 °C | 28 |
| Flash data retention | RETFLASH | 10 | | | years | TAMB<85 °C | 28 |
| Flash data retention | RETFLASH | 20 | | | years | TAMB<70 °C | 28 |
| Word (32-bit) programming time | tW_PROG | 20 | | | µs | | 28 |
| Page erase time | tPERASE | 20 | 20.4 | 20.8 | ms | | 28 |
| Device erase time | tDERASE | 40 | 40.8 | 41.6 | ms | | 28 |
| Erase current | IERASE | | | 7 | mA | Measured at 25 °C | 28 |
| Write current | IWRITE | | | 7 | mA | Measured at 25 °C | 28 |
| Supply voltage during flash erase and write | VFLASH | 1.98 | | 3.8 | V | | 28 |
| Input leakage current | IIOLEAK | -100 | 0.1 | 100 | nA | High impedance IO connected to GROUND or VDD | 30 |
| Pulse width of pulses to be removed by the glitch suppression filter | tIO-GLITCH | 10 | | 50 | ns | | 30 |
| Supported crystal equivalent series resistance (ESR) | ESRLFXO | | 30 | 120 | kΩ | LFXO | 37 |
| Supported crystal external load range | CLFXOL | 5 | | 25 | pF | LFXO | 37 |
| Supported nominal crystal frequency | fHFXO | 4 | | 24 | MHz | HFXO | 37 |
| Supported crystal equivalent series resistance (ESR) | ESRHFXO | | 30 | 100 | Ω | Crystal frequency 24 MHz | 37 |
| Supported crystal equivalent series resistance (ESR) | ESRHFXO | | 400 | 1500 | Ω | Crystal frequency 4 MHz | 37 |
| Transconductance of the HFXO input transistor at crystal startup | gmHFXO | 20 | | | mS | HFXOBOOST in CMU_CTRL equals 0b11 | 37 |
| Oscillation frequency | fLFRCO | 31.29 | 32.768 | 34.28 | kHz | VDD=3.0 V, TAMB=25°C | 38 |
| Oscillation frequency, 21 MHz band | fHFRCO | 20.37 | 21 | 21.63 | MHz | VDD=3.0 V, TAMB=25°C; 21 MHz frequency band | 39 |
| Oscillation frequency, 14 MHz band | fHFRCO | 13.58 | 14 | 14.42 | MHz | VDD=3.0 V, TAMB=25°C; 14 MHz frequency band | 39 |
| Oscillation frequency, 11 MHz band | fHFRCO | 10.67 | 11 | 11.33 | MHz | VDD=3.0 V, TAMB=25°C; 11 MHz frequency band | 39 |
| Oscillation frequency, 7 MHz band | fHFRCO | 6.4 | 6.6 | 6.8 | MHz | VDD=3.0 V, TAMB=25°C; 7 MHz frequency band | 39 |
| Oscillation frequency, 1 MHz band | fHFRCO | 1.15 | 1.2 | 1.25 | MHz | VDD=3.0 V, TAMB=25°C; 1 MHz frequency band | 39 |
| Current consumption, 21 MHz | IHFRCO | | 93 | 175 | µA | fHFRCO = 21 MHz | 39 |
| Current consumption, 14 MHz | IHFRCO | | 77 | 140 | µA | fHFRCO = 14 MHz | 39 |
| Current consumption, 11 MHz | IHFRCO | | 72 | 125 | µA | fHFRCO = 11 MHz | 39 |
| Current consumption, 6.6 MHz | IHFRCO | | 63 | 105 | µA | fHFRCO = 6.6 MHz | 39 |
| Current consumption, 1.2 MHz | IHFRCO | | 22 | 40 | µA | fHFRCO = 1.2 MHz | 39 |
| Average active current, ADC | IADC | | 351 | 500 | µA | 1 MSamples/s, 12-bit, external reference | 43 |
| Current consumption of internal voltage reference | IADCREF | | 65 | 127 | µA | Internal voltage reference | 43 |
| Input ON resistance | RADCIN | 300 | | 800 | Ω | | 43 |
| ADC clock frequency | fADCCLK | | | 13 | MHz | | 43 |
| Conversion time 12-bit | tADCCONV | 13 | | | ADCCLK cycles | 12-bit | 43 |
| Acquisition time | tADCACQ | 1 | | 256 | ADCCLK cycles | Programmable | 44 |
| Required acquisition time for VDD/3 reference | tADCACQVDD3 | 2 | | | µs | | 44 |
| Offset voltage | VADCOFFSET | -4 | 0.3 | 4 | mV | After calibration, single-ended | 46 |
| Differential non-linearity (DNL) | DNLADC | -1 | 0.7 | 4 | LSB | VDD=3.0 V, external 2.5V reference | 46 |
| Current consumption, EM0 24 MHz HFXO 25°C | IEM0 | | 115 | 132 | µA/MHz | 24 MHz HFXO, all peripheral clocks disabled, VDD=3.0 V, TAMB=25°C | 18 |
| Current consumption, EM4 85°C | IEM4 | | 0.29 | 0.7 | µA | VDD=3.0 V, TAMB=85°C | 19 |
| Current consumption, EM3 85°C | IEM3 | | 1.3 | 2 | µA | EM3 current (ULFRCO enabled, LFRCO/LFXO disabled), VDD=3.0 V, TAMB=85°C | 19 |
| SCL clock frequency, Standard-mode | fSCL | 0 | | 100 | kHz | I2C Standard-mode (Sm) | 63 |
| SDA hold time, Standard-mode | tHD,DAT | 8 | | 3450 | ns | I2C Standard-mode (Sm); maximum applies only when SCL low time is not stretched | 63 |
| SDA hold time, Fast-mode | tHD,DAT | 8 | | 900 | ns | I2C Fast-mode (Fm); maximum applies only when SCL low time is not stretched | 63 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | gold | The TQFP48 package is 7 by 7 mm in size and has a 0.5 mm pin pitch. The TQFP48 package uses Nickel-Palladium-Gold preplated leadframe. | 95 |
## CAD (KiCad official)
- Symbol: `EFM32ZG222F32-B-QFP48R`
- Footprint: `Package_QFP:TQFP-48_7x7mm_P0.5mm`
- 3D model: TQFP-48(7x7) (KiCad packages3D, STEP)
- 3D model files: `efm32zg222f32-b-qfp48r-etched.step` / `efm32zg222f32-b-qfp48r-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `efm32zg222f32-b-qfp48r.step` / `efm32zg222f32-b-qfp48r.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [SKYWORKS/SILICON LABS datasheet](docs/efm32zg222f32-b-qfp48r-datasheet.pdf) (104 pp, sha256 `6d1c4d21c94b4036`, retrieved 2026-11-02, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/efm32zg222f32-b-qfp48r-datasheet.pdf)