component
EFM32G232F128G-E-QFP64
Public Made by Adomby adom
SILICON LABS SILICON LABS, QFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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EFM32G232F128G-E-QFP64
SILICON LABS · SILICON LABS · QFP-64(10x10)
EFM32G232F128G-E-QFP64 from SILICON LABS, in a QFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PA0 | bidirectional | GPIO PA0 with alternate functions TIM0_CC0 #0/1 and I2C0_SDA #0. |
| 2 | PA1 | bidirectional | GPIO PA1 with alternate functions TIM0_CC1 #0/1, I2C0_SCL #0 and CMU_CLK1 #0. |
| 3 | PA2 | bidirectional | GPIO PA2 with alternate functions TIM0_CC2 #0/1 and CMU_CLK0 #0. |
| 4 | PA3 | bidirectional | GPIO PA3 with alternate function TIM0_CDTI0 #0. |
| 5 | PA4 | bidirectional | GPIO PA4 with alternate function TIM0_CDTI1 #0. |
| 6 | PA5 | bidirectional | GPIO PA5 with alternate functions TIM0_CDTI2 #0 and LEU1_TX #1. |
| 7 | IOVDD_0 | power_in | Digital IO power supply 0. |
| 8 | VSS | power_in | Ground. |
| 9 | PC0 | bidirectional | GPIO PC0 with ACMP0_CH0, PCNT0_S0IN #1 and US1_TX #1. |
| 10 | PC1 | bidirectional | GPIO PC1 with ACMP0_CH1, PCNT0_S1IN #1 and US1_RX #1. |
| 11 | PC2 | bidirectional | GPIO PC2 with ACMP0_CH2 and US1_CLK #1. |
| 12 | PC3 | bidirectional | GPIO PC3 with ACMP0_CH3 and US1_CS #1. |
| 13 | PC4 | bidirectional | GPIO PC4 with ACMP0_CH4, LETIM0_OUT0 #3, PCNT1_S0IN #0 and US2_CLK #0. |
| 14 | PC5 | bidirectional | GPIO PC5 with ACMP0_CH5, LETIM0_OUT1 #3, PCNT1_S1IN #0 and US2_CS #0. |
| 15 | PB7 | bidirectional | GPIO PB7 with LFXTAL_P (low frequency crystal positive pin) and US1_CLK #0. |
| 16 | PB8 | bidirectional | GPIO PB8 with LFXTAL_N (low frequency crystal negative pin) and US1_CS #0. |
| 17 | PA8 | bidirectional | GPIO PA8 with alternate function TIM2_CC0 #0. |
| 18 | PA9 | bidirectional | GPIO PA9 with alternate function TIM2_CC1 #0. |
| 19 | PA10 | bidirectional | GPIO PA10 with alternate function TIM2_CC2 #0. |
| 20 | RESETn | input | Reset input, active low; drive low only during reset and let the internal pull-up release it. |
| 21 | PB11 | bidirectional | GPIO PB11 with DAC0_OUT0 and LETIM0_OUT0 #1. |
| 22 | VSS | power_in | Ground. |
| 23 | AVDD_1 | power_in | Analog power supply 1. |
| 24 | PB13 | bidirectional | GPIO PB13 with HFXTAL_P (high frequency crystal positive pin) and LEU0_TX #1. |
| 25 | PB14 | bidirectional | GPIO PB14 with HFXTAL_N (high frequency crystal negative pin, also optional external clock input) and LEU0_RX #1. |
| 26 | IOVDD_3 | power_in | Digital IO power supply 3. |
| 27 | AVDD_0 | power_in | Analog power supply 0. |
| 28 | PD0 | bidirectional | GPIO PD0 with ADC0_CH0, PCNT2_S0IN #0 and US1_TX #1. |
| 29 | PD1 | bidirectional | GPIO PD1 with ADC0_CH1, TIM0_CC0 #3, PCNT2_S1IN #0 and US1_RX #1. |
| 30 | PD2 | bidirectional | GPIO PD2 with ADC0_CH2, TIM0_CC1 #3 and US1_CLK #1. |
| 31 | PD3 | bidirectional | GPIO PD3 with ADC0_CH3, TIM0_CC2 #3 and US1_CS #1. |
| 32 | PD4 | bidirectional | GPIO PD4 with ADC0_CH4 and LEU0_TX #0. |
| 33 | PD5 | bidirectional | GPIO PD5 with ADC0_CH5 and LEU0_RX #0. |
| 34 | PD6 | bidirectional | GPIO PD6 with ADC0_CH6, LETIM0_OUT0 #0 and I2C0_SDA #1. |
| 35 | PD7 | bidirectional | GPIO PD7 with ADC0_CH7, LETIM0_OUT1 #0 and I2C0_SCL #1. |
| 36 | PD8 | bidirectional | GPIO PD8 with alternate function CMU_CLK1 #1. |
| 37 | PC6 | bidirectional | GPIO PC6 with ACMP0_CH6, LEU1_TX #0 and I2C0_SDA #2. |
| 38 | PC7 | bidirectional | GPIO PC7 with ACMP0_CH7, LEU1_RX #0 and I2C0_SCL #2. |
| 39 | VDD_DREG | power_in | Power supply for on-chip voltage regulator. |
| 40 | DECOUPLE | power_out | Decouple output for on-chip voltage regulator; an external capacitance of size CDECOUPLE is required at this pin. |
| 41 | PC8 | bidirectional | GPIO PC8 with ACMP1_CH0, TIM2_CC0 #2 and US0_CS #2. |
| 42 | PC9 | bidirectional | GPIO PC9 with ACMP1_CH1, TIM2_CC1 #2 and US0_CLK #2. |
| 43 | PC10 | bidirectional | GPIO PC10 with ACMP1_CH2, TIM2_CC2 #2 and US0_RX #2. |
| 44 | PC11 | bidirectional | GPIO PC11 with ACMP1_CH3 and US0_TX #2. |
| 45 | PC12 | bidirectional | GPIO PC12 with ACMP1_CH4 and CMU_CLK0 #1. |
| 46 | PC13 | bidirectional | GPIO PC13 with ACMP1_CH5, TIM0_CDTI0 #1/3, TIM1_CC0 #0 and PCNT0_S0IN #0. |
| 47 | PC14 | bidirectional | GPIO PC14 with ACMP1_CH6, TIM0_CDTI1 #1/3, TIM1_CC1 #0 and PCNT0_S1IN #0. |
| 48 | PC15 | bidirectional | GPIO PC15 with ACMP1_CH7, TIM0_CDTI2 #1/3, TIM1_CC2 #0 and DBG_SWO #1. |
| 49 | PF0 | bidirectional | GPIO PF0 with LETIM0_OUT0 #2 and DBG_SWCLK #0/1 (debug clock input enabled out of reset, built-in pull down). |
| 50 | PF1 | bidirectional | GPIO PF1 with LETIM0_OUT1 #2 and DBG_SWDIO #0/1 (debug data enabled out of reset, built-in pull up). |
| 51 | PF2 | bidirectional | GPIO PF2 with ACMP1_O #0 and DBG_SWO #0 (serial wire viewer output, not enabled after reset). |
| 52 | PF3 | bidirectional | GPIO PF3 with alternate function TIM0_CDTI0 #2. |
| 53 | PF4 | bidirectional | GPIO PF4 with alternate function TIM0_CDTI1 #2. |
| 54 | PF5 | bidirectional | GPIO PF5 with alternate function TIM0_CDTI2 #2. |
| 55 | IOVDD_5 | power_in | Digital IO power supply 5. |
| 56 | VSS | power_in | Ground. |
| 57 | PE8 | bidirectional | GPIO PE8 with alternate function PCNT2_S0IN #1. |
| 58 | PE9 | bidirectional | GPIO PE9 with alternate function PCNT2_S1IN #1. |
| 59 | PE10 | bidirectional | GPIO PE10 with TIM1_CC0 #1, US0_TX #0 and BOOT_TX (bootloader transmit). |
| 60 | PE11 | bidirectional | GPIO PE11 with TIM1_CC1 #1, US0_RX #0 and BOOT_RX (bootloader receive). |
| 61 | PE12 | bidirectional | GPIO PE12 with TIM1_CC2 #1 and US0_CLK #0. |
| 62 | PE13 | bidirectional | GPIO PE13 with US0_CS #0 and ACMP0_O #0. |
| 63 | PE14 | bidirectional | GPIO PE14 with alternate function LEU0_TX #2. |
| 64 | PE15 | bidirectional | GPIO PE15 with alternate function LEU0_RX #2. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SILICON LABS |
| Package | QFP-64(10x10) |
| Category | Embedded Processors & Controllers |
| Pins | 64 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage temperature range | TSTG | -40 | 150 | °C | 29 | ||
| Maximum soldering temperature | TS | 260 | °C | Latest IPC/JEDEC J-STD-020 Standard | 29 | ||
| External main supply voltage | VDDMAX | 0 | 3.8 | V | 29 | ||
| Voltage on any I/O pin (max is VDD+0.3) | VIOPIN | -0.3 | V | 29 | |||
| Current per I/O pin (sink) | IIOMAX_SINK | 100 | mA | 29 | |||
| Current per I/O pin (source) | IIOMAX_SOURCE | -100 | mA | 29 | |||
| Ambient temperature range | TAMB | -40 | 85 | °C | 29 | ||
| Operating supply voltage | VDDOP | 1.98 | 3.8 | V | 29 | ||
| Internal APB clock frequency | fAPB | 32 | MHz | 29 | |||
| Internal AHB clock frequency | fAHB | 32 | MHz | 29 | |||
| EM0 current | IEM0 | 181 | 206 | µA/MHz | 28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 | |
| EM0 current | IEM0 | 183 | 207 | µA/MHz | 21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 | |
| EM0 current | IEM0 | 185 | 211 | µA/MHz | 14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 | |
| EM0 current | IEM0 | 186 | 215 | µA/MHz | 11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 | |
| EM0 current | IEM0 | 191 | 218 | µA/MHz | 6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 | |
| EM1 current | IEM1 | 47 | 62 | µA/MHz | 28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 | |
| EM1 current | IEM1 | 50 | 69 | µA/MHz | 14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 | |
| EM1 current | IEM1 | 56 | 83 | µA/MHz | 6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 | |
| EM2 current | IEM2 | 0.9 | 1.5 | µA | RTC prescaled to 1 Hz, 32.768 kHz LFRCO, VDD= 3.0 V, TAMB=25 ºC | 30 | |
| EM2 current | IEM2 | 3 | 6 | µA | RTC prescaled to 1 Hz, 32.768 kHz LFRCO, VDD= 3.0 V, TAMB=85 ºC | 30 | |
| EM3 current | IEM3 | 0.59 | 1 | µA | VDD= 3.0 V, TAMB=25 ºC | 30 | |
| EM3 current | IEM3 | 2.75 | 5.8 | µA | VDD= 3.0 V, TAMB=85 ºC | 30 | |
| EM4 current | IEM4 | 0.02 | 0.045 | µA | VDD= 3.0 V, TAMB=25 ºC | 30 | |
| EM4 current | IEM4 | 0.25 | 0.7 | µA | VDD= 3.0 V, TAMB=85 ºC | 30 | |
| BOD threshold on falling external supply voltage | VBODextthr- | 1.74 | 1.96 | V | EM0 | 40 | |
| Power-on Reset threshold on rising external supply voltage | VPORthr+ | 1.98 | V | 40 | |||
| Negative pulse length to ensure complete reset | tRESET | 50 | ns | 40 | |||
| Flash erase cycles before failure | ECFLASH | 20000 | cycles | 41 | |||
| Flash data retention | RETFLASH | 10 | years | TAMB<85 ºC | 41 | ||
| Word (32-bit) programming time | tW_PROG | 20 | µs | 41 | |||
| Page erase time | tP_ERASE | 20.7 | 22 | 24.8 | ms | 41 | |
| Device erase time | tD_ERASE | 41.8 | 45 | 49.2 | ms | 41 | |
| Erase current | IERASE | 7 | mA | Measured at 25 °C | 41 | ||
| Write current | IWRITE | 7 | mA | Measured at 25 °C | 41 | ||
| Supply voltage during flash erase and write | VFLASH | 1.98 | 3.8 | V | 41 | ||
| Input leakage current | IIOLEAK | 0.1 | 40 | nA | High Impedance IO connected to GROUND or VDD | 43 | |
| Pulse width removed by glitch suppression filter | tIOGLITCH | 10 | 50 | ns | 43 | ||
| Supported crystal ESR | ESRLFXO | 30 | 120 | kOhm | 50 | ||
| Supported crystal external load range | CLFXOL | 25 | pF | 50 | |||
| HFXO supported nominal crystal frequency | fHFXO | 4 | 32 | MHz | 51 | ||
| LFRCO oscillation frequency | fLFRCO | 31.29 | 32.768 | 34.24 | kHz | VDD= 3.0 V, TAMB=25°C | 52 |
| HFRCO oscillation frequency | fHFRCO | 27.16 | 28 | 28.84 | MHz | 28 MHz frequency band, VDD= 3.0 V, TAMB=25 ºC | 53 |
| HFRCO oscillation frequency | fHFRCO | 13.58 | 14 | 14.42 | MHz | 14 MHz frequency band, VDD= 3.0 V, TAMB=25 ºC | 53 |
| HFRCO current consumption | IHFRCO | 99 | 120 | µA | fHFRCO = 14 MHz | 53 | |
| HFRCO duty cycle | DCHFRCO | 48.5 | 50 | 51 | % | fHFRCO = 14 MHz | 53 |
| ULFRCO oscillation frequency | fULFRCO | 0.7 | 1.75 | kHz | 25 °C, 3 V | 57 | |
| ADC fADCCLK | fADCCLK | 13 | MHz | BIASPROG=0xF4B | 59 | ||
| ADC offset voltage | VADCOFFSET | -4 | 0.3 | 4 | mV | After calibration, differential | 65 |
| ADC differential non-linearity | DNLADC | -1 | 0.7 | 4 | LSB | VDD= 3.0 V, external 2.5 V reference | 65 |
| ADC integral non-linearity | INLADC | -3 | 1.2 | 3 | LSB | VDD= 3.0 V, external 2.5 V reference, end point method | 65 |
| ADC VREF voltage | VREF | 1.2 | 1.25 | 1.3 | V | 1.25 V reference | 65 |
| ADC VREF voltage | VREF | 2.4 | 2.5 | 2.6 | V | 2.5 V reference | 65 |
| DAC load current | ILOAD_DC | 11 | mA | 72 | |||
| ACMP offset voltage | VACMPOFFSET | -12 | 0 | 12 | mV | BIASPROG= 0b1010, FULLBIAS=0 and HALFBIAS=0 in ACMPn_CTRL register | 73 |
| LCD supply voltage range | VLCD | 2 | 3.8 | V | Internal boost circuit enabled | 76 | |
| Voltage regulator decoupling capacitor | CDECOUPLE | 1 | µF | X5R capacitor recommended. Apply between DECOUPLE pin and GROUND | 40 | ||
| LFRCO temperature coefficient | TCLFRCO | 0.02 | %/°C | 52 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | gold | The TQFP64 Package is 10 by 10 mm in size and has a 0.5 mm pin pitch. The TQFP64 Package uses Nickel-Palladium-Gold preplated leadframe. | 176 |
CAD (KiCad official)
- Symbol:
EFM32G232F128G-E-QFP64 - Footprint:
Package_QFP:LQFP-64_10x10mm_P0.5mm - 3D model: QFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files:
efm32g232f128g-e-qfp64-etched.step/efm32g232f128g-e-qfp64-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);efm32g232f128g-e-qfp64.step/efm32g232f128g-e-qfp64.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: SILICON LABS datasheet (205 pp, sha256
1201f60cf3c01dda, retrieved 2026-11-13, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# EFM32G232F128G-E-QFP64
**SILICON LABS** · SILICON LABS · QFP-64(10x10)
EFM32G232F128G-E-QFP64 from SILICON LABS, in a QFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | PA0 | bidirectional | GPIO PA0 with alternate functions TIM0_CC0 #0/1 and I2C0_SDA #0. |
| 2 | PA1 | bidirectional | GPIO PA1 with alternate functions TIM0_CC1 #0/1, I2C0_SCL #0 and CMU_CLK1 #0. |
| 3 | PA2 | bidirectional | GPIO PA2 with alternate functions TIM0_CC2 #0/1 and CMU_CLK0 #0. |
| 4 | PA3 | bidirectional | GPIO PA3 with alternate function TIM0_CDTI0 #0. |
| 5 | PA4 | bidirectional | GPIO PA4 with alternate function TIM0_CDTI1 #0. |
| 6 | PA5 | bidirectional | GPIO PA5 with alternate functions TIM0_CDTI2 #0 and LEU1_TX #1. |
| 7 | IOVDD_0 | power_in | Digital IO power supply 0. |
| 8 | VSS | power_in | Ground. |
| 9 | PC0 | bidirectional | GPIO PC0 with ACMP0_CH0, PCNT0_S0IN #1 and US1_TX #1. |
| 10 | PC1 | bidirectional | GPIO PC1 with ACMP0_CH1, PCNT0_S1IN #1 and US1_RX #1. |
| 11 | PC2 | bidirectional | GPIO PC2 with ACMP0_CH2 and US1_CLK #1. |
| 12 | PC3 | bidirectional | GPIO PC3 with ACMP0_CH3 and US1_CS #1. |
| 13 | PC4 | bidirectional | GPIO PC4 with ACMP0_CH4, LETIM0_OUT0 #3, PCNT1_S0IN #0 and US2_CLK #0. |
| 14 | PC5 | bidirectional | GPIO PC5 with ACMP0_CH5, LETIM0_OUT1 #3, PCNT1_S1IN #0 and US2_CS #0. |
| 15 | PB7 | bidirectional | GPIO PB7 with LFXTAL_P (low frequency crystal positive pin) and US1_CLK #0. |
| 16 | PB8 | bidirectional | GPIO PB8 with LFXTAL_N (low frequency crystal negative pin) and US1_CS #0. |
| 17 | PA8 | bidirectional | GPIO PA8 with alternate function TIM2_CC0 #0. |
| 18 | PA9 | bidirectional | GPIO PA9 with alternate function TIM2_CC1 #0. |
| 19 | PA10 | bidirectional | GPIO PA10 with alternate function TIM2_CC2 #0. |
| 20 | RESETn | input | Reset input, active low; drive low only during reset and let the internal pull-up release it. |
| 21 | PB11 | bidirectional | GPIO PB11 with DAC0_OUT0 and LETIM0_OUT0 #1. |
| 22 | VSS | power_in | Ground. |
| 23 | AVDD_1 | power_in | Analog power supply 1. |
| 24 | PB13 | bidirectional | GPIO PB13 with HFXTAL_P (high frequency crystal positive pin) and LEU0_TX #1. |
| 25 | PB14 | bidirectional | GPIO PB14 with HFXTAL_N (high frequency crystal negative pin, also optional external clock input) and LEU0_RX #1. |
| 26 | IOVDD_3 | power_in | Digital IO power supply 3. |
| 27 | AVDD_0 | power_in | Analog power supply 0. |
| 28 | PD0 | bidirectional | GPIO PD0 with ADC0_CH0, PCNT2_S0IN #0 and US1_TX #1. |
| 29 | PD1 | bidirectional | GPIO PD1 with ADC0_CH1, TIM0_CC0 #3, PCNT2_S1IN #0 and US1_RX #1. |
| 30 | PD2 | bidirectional | GPIO PD2 with ADC0_CH2, TIM0_CC1 #3 and US1_CLK #1. |
| 31 | PD3 | bidirectional | GPIO PD3 with ADC0_CH3, TIM0_CC2 #3 and US1_CS #1. |
| 32 | PD4 | bidirectional | GPIO PD4 with ADC0_CH4 and LEU0_TX #0. |
| 33 | PD5 | bidirectional | GPIO PD5 with ADC0_CH5 and LEU0_RX #0. |
| 34 | PD6 | bidirectional | GPIO PD6 with ADC0_CH6, LETIM0_OUT0 #0 and I2C0_SDA #1. |
| 35 | PD7 | bidirectional | GPIO PD7 with ADC0_CH7, LETIM0_OUT1 #0 and I2C0_SCL #1. |
| 36 | PD8 | bidirectional | GPIO PD8 with alternate function CMU_CLK1 #1. |
| 37 | PC6 | bidirectional | GPIO PC6 with ACMP0_CH6, LEU1_TX #0 and I2C0_SDA #2. |
| 38 | PC7 | bidirectional | GPIO PC7 with ACMP0_CH7, LEU1_RX #0 and I2C0_SCL #2. |
| 39 | VDD_DREG | power_in | Power supply for on-chip voltage regulator. |
| 40 | DECOUPLE | power_out | Decouple output for on-chip voltage regulator; an external capacitance of size CDECOUPLE is required at this pin. |
| 41 | PC8 | bidirectional | GPIO PC8 with ACMP1_CH0, TIM2_CC0 #2 and US0_CS #2. |
| 42 | PC9 | bidirectional | GPIO PC9 with ACMP1_CH1, TIM2_CC1 #2 and US0_CLK #2. |
| 43 | PC10 | bidirectional | GPIO PC10 with ACMP1_CH2, TIM2_CC2 #2 and US0_RX #2. |
| 44 | PC11 | bidirectional | GPIO PC11 with ACMP1_CH3 and US0_TX #2. |
| 45 | PC12 | bidirectional | GPIO PC12 with ACMP1_CH4 and CMU_CLK0 #1. |
| 46 | PC13 | bidirectional | GPIO PC13 with ACMP1_CH5, TIM0_CDTI0 #1/3, TIM1_CC0 #0 and PCNT0_S0IN #0. |
| 47 | PC14 | bidirectional | GPIO PC14 with ACMP1_CH6, TIM0_CDTI1 #1/3, TIM1_CC1 #0 and PCNT0_S1IN #0. |
| 48 | PC15 | bidirectional | GPIO PC15 with ACMP1_CH7, TIM0_CDTI2 #1/3, TIM1_CC2 #0 and DBG_SWO #1. |
| 49 | PF0 | bidirectional | GPIO PF0 with LETIM0_OUT0 #2 and DBG_SWCLK #0/1 (debug clock input enabled out of reset, built-in pull down). |
| 50 | PF1 | bidirectional | GPIO PF1 with LETIM0_OUT1 #2 and DBG_SWDIO #0/1 (debug data enabled out of reset, built-in pull up). |
| 51 | PF2 | bidirectional | GPIO PF2 with ACMP1_O #0 and DBG_SWO #0 (serial wire viewer output, not enabled after reset). |
| 52 | PF3 | bidirectional | GPIO PF3 with alternate function TIM0_CDTI0 #2. |
| 53 | PF4 | bidirectional | GPIO PF4 with alternate function TIM0_CDTI1 #2. |
| 54 | PF5 | bidirectional | GPIO PF5 with alternate function TIM0_CDTI2 #2. |
| 55 | IOVDD_5 | power_in | Digital IO power supply 5. |
| 56 | VSS | power_in | Ground. |
| 57 | PE8 | bidirectional | GPIO PE8 with alternate function PCNT2_S0IN #1. |
| 58 | PE9 | bidirectional | GPIO PE9 with alternate function PCNT2_S1IN #1. |
| 59 | PE10 | bidirectional | GPIO PE10 with TIM1_CC0 #1, US0_TX #0 and BOOT_TX (bootloader transmit). |
| 60 | PE11 | bidirectional | GPIO PE11 with TIM1_CC1 #1, US0_RX #0 and BOOT_RX (bootloader receive). |
| 61 | PE12 | bidirectional | GPIO PE12 with TIM1_CC2 #1 and US0_CLK #0. |
| 62 | PE13 | bidirectional | GPIO PE13 with US0_CS #0 and ACMP0_O #0. |
| 63 | PE14 | bidirectional | GPIO PE14 with alternate function LEU0_TX #2. |
| 64 | PE15 | bidirectional | GPIO PE15 with alternate function LEU0_RX #2. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | SILICON LABS |
| Package | QFP-64(10x10) |
| Category | Embedded Processors & Controllers |
| Pins | 64 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage temperature range | TSTG | -40 | | 150 | °C | | 29 |
| Maximum soldering temperature | TS | | | 260 | °C | Latest IPC/JEDEC J-STD-020 Standard | 29 |
| External main supply voltage | VDDMAX | 0 | | 3.8 | V | | 29 |
| Voltage on any I/O pin (max is VDD+0.3) | VIOPIN | -0.3 | | | V | | 29 |
| Current per I/O pin (sink) | IIOMAX_SINK | | | 100 | mA | | 29 |
| Current per I/O pin (source) | IIOMAX_SOURCE | | | -100 | mA | | 29 |
| Ambient temperature range | TAMB | -40 | | 85 | °C | | 29 |
| Operating supply voltage | VDDOP | 1.98 | | 3.8 | V | | 29 |
| Internal APB clock frequency | fAPB | | | 32 | MHz | | 29 |
| Internal AHB clock frequency | fAHB | | | 32 | MHz | | 29 |
| EM0 current | IEM0 | | 181 | 206 | µA/MHz | 28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 |
| EM0 current | IEM0 | | 183 | 207 | µA/MHz | 21 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 |
| EM0 current | IEM0 | | 185 | 211 | µA/MHz | 14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 |
| EM0 current | IEM0 | | 186 | 215 | µA/MHz | 11 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 |
| EM0 current | IEM0 | | 191 | 218 | µA/MHz | 6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 |
| EM1 current | IEM1 | | 47 | 62 | µA/MHz | 28 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 |
| EM1 current | IEM1 | | 50 | 69 | µA/MHz | 14 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 |
| EM1 current | IEM1 | | 56 | 83 | µA/MHz | 6.6 MHz HFRCO, all peripheral clocks disabled, VDD= 3.0 V | 30 |
| EM2 current | IEM2 | | 0.9 | 1.5 | µA | RTC prescaled to 1 Hz, 32.768 kHz LFRCO, VDD= 3.0 V, TAMB=25 ºC | 30 |
| EM2 current | IEM2 | | 3 | 6 | µA | RTC prescaled to 1 Hz, 32.768 kHz LFRCO, VDD= 3.0 V, TAMB=85 ºC | 30 |
| EM3 current | IEM3 | | 0.59 | 1 | µA | VDD= 3.0 V, TAMB=25 ºC | 30 |
| EM3 current | IEM3 | | 2.75 | 5.8 | µA | VDD= 3.0 V, TAMB=85 ºC | 30 |
| EM4 current | IEM4 | | 0.02 | 0.045 | µA | VDD= 3.0 V, TAMB=25 ºC | 30 |
| EM4 current | IEM4 | | 0.25 | 0.7 | µA | VDD= 3.0 V, TAMB=85 ºC | 30 |
| BOD threshold on falling external supply voltage | VBODextthr- | 1.74 | | 1.96 | V | EM0 | 40 |
| Power-on Reset threshold on rising external supply voltage | VPORthr+ | | | 1.98 | V | | 40 |
| Negative pulse length to ensure complete reset | tRESET | 50 | | | ns | | 40 |
| Flash erase cycles before failure | ECFLASH | 20000 | | | cycles | | 41 |
| Flash data retention | RETFLASH | 10 | | | years | TAMB<85 ºC | 41 |
| Word (32-bit) programming time | tW_PROG | 20 | | | µs | | 41 |
| Page erase time | tP_ERASE | 20.7 | 22 | 24.8 | ms | | 41 |
| Device erase time | tD_ERASE | 41.8 | 45 | 49.2 | ms | | 41 |
| Erase current | IERASE | | | 7 | mA | Measured at 25 °C | 41 |
| Write current | IWRITE | | | 7 | mA | Measured at 25 °C | 41 |
| Supply voltage during flash erase and write | VFLASH | 1.98 | | 3.8 | V | | 41 |
| Input leakage current | IIOLEAK | | 0.1 | 40 | nA | High Impedance IO connected to GROUND or VDD | 43 |
| Pulse width removed by glitch suppression filter | tIOGLITCH | 10 | | 50 | ns | | 43 |
| Supported crystal ESR | ESRLFXO | | 30 | 120 | kOhm | | 50 |
| Supported crystal external load range | CLFXOL | | | 25 | pF | | 50 |
| HFXO supported nominal crystal frequency | fHFXO | 4 | | 32 | MHz | | 51 |
| LFRCO oscillation frequency | fLFRCO | 31.29 | 32.768 | 34.24 | kHz | VDD= 3.0 V, TAMB=25°C | 52 |
| HFRCO oscillation frequency | fHFRCO | 27.16 | 28 | 28.84 | MHz | 28 MHz frequency band, VDD= 3.0 V, TAMB=25 ºC | 53 |
| HFRCO oscillation frequency | fHFRCO | 13.58 | 14 | 14.42 | MHz | 14 MHz frequency band, VDD= 3.0 V, TAMB=25 ºC | 53 |
| HFRCO current consumption | IHFRCO | | 99 | 120 | µA | fHFRCO = 14 MHz | 53 |
| HFRCO duty cycle | DCHFRCO | 48.5 | 50 | 51 | % | fHFRCO = 14 MHz | 53 |
| ULFRCO oscillation frequency | fULFRCO | 0.7 | | 1.75 | kHz | 25 °C, 3 V | 57 |
| ADC fADCCLK | fADCCLK | | | 13 | MHz | BIASPROG=0xF4B | 59 |
| ADC offset voltage | VADCOFFSET | -4 | 0.3 | 4 | mV | After calibration, differential | 65 |
| ADC differential non-linearity | DNLADC | -1 | 0.7 | 4 | LSB | VDD= 3.0 V, external 2.5 V reference | 65 |
| ADC integral non-linearity | INLADC | -3 | 1.2 | 3 | LSB | VDD= 3.0 V, external 2.5 V reference, end point method | 65 |
| ADC VREF voltage | VREF | 1.2 | 1.25 | 1.3 | V | 1.25 V reference | 65 |
| ADC VREF voltage | VREF | 2.4 | 2.5 | 2.6 | V | 2.5 V reference | 65 |
| DAC load current | ILOAD_DC | | | 11 | mA | | 72 |
| ACMP offset voltage | VACMPOFFSET | -12 | 0 | 12 | mV | BIASPROG= 0b1010, FULLBIAS=0 and HALFBIAS=0 in ACMPn_CTRL register | 73 |
| LCD supply voltage range | VLCD | 2 | | 3.8 | V | Internal boost circuit enabled | 76 |
| Voltage regulator decoupling capacitor | CDECOUPLE | | 1 | | µF | X5R capacitor recommended. Apply between DECOUPLE pin and GROUND | 40 |
| LFRCO temperature coefficient | TCLFRCO | | 0.02 | | %/°C | | 52 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | gold | The TQFP64 Package is 10 by 10 mm in size and has a 0.5 mm pin pitch. The TQFP64 Package uses Nickel-Palladium-Gold preplated leadframe. | 176 |
## CAD (KiCad official)
- Symbol: `EFM32G232F128G-E-QFP64`
- Footprint: `Package_QFP:LQFP-64_10x10mm_P0.5mm`
- 3D model: QFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files: `efm32g232f128g-e-qfp64-etched.step` / `efm32g232f128g-e-qfp64-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `efm32g232f128g-e-qfp64.step` / `efm32g232f128g-e-qfp64.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [SILICON LABS datasheet](docs/efm32g232f128g-e-qfp64-datasheet.pdf) (205 pp, sha256 `1201f60cf3c01dda`, retrieved 2026-11-13, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/efm32g232f128g-e-qfp64-datasheet.pdf)