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docs ee-sx1103: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
viewers ee-sx1103: viewers · Ray
ee-sx1103-etched.fit.json ee-sx1103: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
ee-sx1103-etched.glb ee-sx1103: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
ee-sx1103-etched.step ee-sx1103: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray
ee-sx1103.glb Publish 0.1.0 · Ray
ee-sx1103.kicad_mod Publish 0.1.0 · Ray
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ee-sx1103.step Publish 0.1.0 · Ray
package.json Publish 0.2.0 · Ray
page.json ee-sx1103: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray
README.md ee-sx1103: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray

EE-SX1103

Omron Electronics · Photointerrupters - Slot Type - Transistor Output · DIP-4

EE-SX1103 from Omron Electronics, in a DIP-4. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the infrared LED emitter. Drive with forward current up to IF = 50 mA (VF typ 1.3 V, max 1.6 V at 50 mA); peak emission wavelength 950 nm. Use an external series current-limiting resistor.
2 K passive Cathode of the infrared LED emitter. Normally returned to ground through the emitter side of the drive loop. Reverse voltage rating VR = 5 V.
3 C passive Collector of the NPN phototransistor detector. Typically tied to VCC through a load resistor RL; VCEO = 30 V max, IC = 30 mA max. Light current IL ≥ 0.5 mA at IF = 20 mA, VCE = 5 V.
4 E passive Emitter of the NPN phototransistor detector. Usually tied to ground; VECO = 4.5 V max. Output signal is taken across the collector load resistor.

Key specifications

Parameter Value
Manufacturer Omron Electronics
Package DIP-4
Category Sensor
Pins 4

CAD (KiCad official)

  • Symbol: EE-SX1103
  • Footprint: Package_DIP:DIP-4_W7.62mm
  • 3D model: DIP-4 (KiCad packages3D, STEP)
  • 3D model files: ee-sx1103-etched.step / ee-sx1103-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ee-sx1103.step / ee-sx1103.glb are the bare package body.

3D model downloads

Two STEP files. Same geometry, different body top:

File Size Use it when
ee-sx1103.step 158 KB You want the bare part, or you mark your own boards.
ee-sx1103-etched.step 1.6 MB You want the part with EE-SX1103 already on it.

The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 386 faces against 80 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Omron Electronics datasheet (4 pp, sha256 3964df21e560aaaa, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF