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EB13E2H2H-8.000M TR

Ecliptek · Oscillators · SMD3225-4P

EB13E2H2H-8.000M TR from Ecliptek, in a SMD3225-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Tri-State input Tri-state enable input: 80% of Vdd minimum or no connect enables the output, 20% of Vdd maximum disables the output (high impedance).
2 Case/Ground power_in Case and ground connection; a 0.1µF tantalum in parallel with a 0.01µF ceramic bypass capacitor is required close to the ground and VDD pins.
3 Output output CMOS clock output, 15pF maximum load, VOH 90% of Vdd minimum at IOH = -4mA and VOL 10% of Vdd maximum at IOL = +4mA.
4 Supply Voltage power_in Supply voltage pin, 3.3Vdc ±5%, with a 0.1µF tantalum in parallel with a 0.01µF ceramic bypass capacitor close to the pin.

Key specifications

Parameter Value
Manufacturer Ecliptek
Package SMD3225-4P
Category Resonators/Oscillators
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage tolerance Vdd -5 3.3 5 % 3.3Vdc ±5% (typ is in Vdc) 1
Input Current 3 mA Nominal Frequency 1.024MHz to 9.999999MHz 1
Output Voltage Logic High VOH 90 % of Vdd IOH = -4mA 1
Output Voltage Logic Low VOL 10 % of Vdd IOL = +4mA 1
Rise/Fall Time 5 nSec Measured at 20% to 80% of waveform; 1.024MHz to 24MHz 1
Duty Cycle -5 50 5 % Measured at 50% of waveform; 50 ±5(%) 1
Load Drive Capability CL 15 pF 1
Tri-State Input Voltage High Vih 80 % of Vdd or No Connect to Enable Output 1
Tri-State Input Voltage Low Vil 20 % of Vdd to Disable Output (High Impedance) 1
Standby Current 10 µA Disabled Output: High Impedance 1
RMS Phase Jitter Fj 1 pSec Fj = 12kHz to 20MHz 1
Start Up Time 10 mSec 1
Storage Temperature Range -55 125 °C 1
High Temp Manual Soldering 260 °C 5 Seconds Maximum, 2 times Maximum, applied to body 7
High Temp Reflow Peak Temperature TP 260 °C 10 Seconds Maximum 7
Low Temp Manual Soldering 185 °C 10 Seconds Maximum, 2 times Maximum, applied to body 8
Low Temp Reflow Peak Temperature TP 240 °C 240°C Maximum 2 Times / 230°C Maximum 1 Time 8

CAD (KiCad official)

  • Symbol: EB13E2H2H-8.000M TR
  • Footprint: Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm
  • 3D model: SMD3225-4P (KiCad packages3D, STEP)
  • 3D model files: eb13e2h2h-8-000m-tr-etched.step / eb13e2h2h-8-000m-tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); eb13e2h2h-8-000m-tr.step / eb13e2h2h-8-000m-tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Ecliptek datasheet (8 pp, sha256 b2a139dd8af86334, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF