# E3SB32E00001WE

**Hosonic Elec** · Crystals · SMD3225-4P

E3SB32E00001WE from Hosonic Elec, in a SMD3225-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | X'tal | passive | Crystal terminal, connected internally to the crystal (pins #1 and #3 are the X'tal connections); 32.000000 MHz, CL 15 pF. |
| 2 | GND | power_in | Ground connection per the pin table (pins #2 and #4 are GND). |
| 3 | X'tal | passive | Crystal terminal, connected internally to the crystal (pins #1 and #3 are the X'tal connections); 32.000000 MHz, CL 15 pF. |
| 4 | GND | power_in | Ground connection per the pin table (pins #2 and #4 are GND). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Hosonic Elec |
| Package | SMD3225-4P |
| Category | Crystals, Oscillators, Resonators |
| Pins | 4 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Frequency Tolerance | △ F/F0 | -10 |  | 10 | ppm | At 25℃±3℃ | 3 |
| Operating Temperature Range | TOPR | -30 |  | 85 | ℃ |  | 3 |
| Frequency Stability | TC | -10 |  | 10 | ppm | Ref. to 25℃ | 3 |
| Storage Temperature | TSTG | -55 |  | 125 | ℃ |  | 3 |
| Equivalent Series Resistance | ESR |  |  | 50 | Ω |  | 3 |
| Drive Level | DL |  | 100 | 200 | μW |  | 3 |
| Insulation Resistance | IR | 500 |  |  | MΩ | At 100VDC | 3 |
| Shunt Capacitance | C0 |  |  | 3 | pF |  | 3 |
| Aging Per Year | Fa | -2 |  | 2 | ppm | First Year | 3 |
| Load Capacitance | CL |  | 15 |  | pF |  | 3 |
| Nominal Frequency | F0 |  | 32 |  | MHz |  | 3 |

## CAD (KiCad official)

- Symbol: `E3SB32E00001WE`
- Footprint: `Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm`
- 3D model: SMD3225-4P (KiCad packages3D, STEP)
- 3D model files: `e3sb32e00001we-etched.step` / `e3sb32e00001we-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `e3sb32e00001we.step` / `e3sb32e00001we.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Hosonic Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590230032179769344) (9 pp, sha256 `bb70ec08e63f1e9a`, retrieved 2026-10-21, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/e3sb32e00001we-datasheet.pdf)