# E3SB10E000008E

**Hosonic Elec** · Crystals · SMD3225-4P

E3SB10E000008E from Hosonic Elec, in a SMD3225-4P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | X1 | passive | Crystal terminal connected to the quartz blank (#1,#3 are X'tal connections); pin 1 is marked by the logo location on the lid. |
| 2 | GND | power_in | Ground pin, connected to the metal cover (#2,#4 are GND). |
| 3 | X2 | passive | Crystal terminal connected to the quartz blank (#1,#3 are X'tal connections), for a 10.000000 MHz fundamental crystal with 16 pF load capacitance. |
| 4 | GND | power_in | Ground pin, connected to the metal cover (#2,#4 are GND). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Hosonic Elec |
| Package | SMD3225-4P |
| Category | Crystal Oscillator/Oscillator/Resonator |
| Pins | 4 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Frequency Tolerance | △F/F0 | -20 |  | 20 | ppm | At 25℃±3℃ | 3 |
| Operating Temperature Range | TOPR | -40 |  | 85 | ℃ |  | 3 |
| Frequency Stability (over operating temperature) | TC | -30 |  | 30 | ppm | Ref. to 25℃ | 3 |
| Storage Temperature | TSTG | -55 |  | 125 | ℃ |  | 3 |
| Equivalent Series Resistance | ESR |  |  | 150 | Ω |  | 3 |
| Drive Level | DL |  | 100 | 200 | μW |  | 3 |
| Insulation Resistance | IR | 500 |  |  | MΩ | At 100VDC | 3 |
| Shunt Capacitance | C0 |  |  | 3 | pF |  | 3 |
| Aging Per Year | Fa | -2 |  | 2 | ppm | First Year | 3 |
| Nominal Frequency | F0 |  | 10 |  | MHz | Fundamental mode | 3 |
| Load capacitance | CL |  | 16 |  | pF |  | 3 |

## CAD (KiCad official)

- Symbol: `E3SB10E000008E`
- Footprint: `Crystal:Crystal_SMD_3225-4Pin_3.2x2.5mm`
- 3D model: SMD3225-4P (KiCad packages3D, STEP)
- 3D model files: `e3sb10e000008e-etched.step` / `e3sb10e000008e-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `e3sb10e000008e.step` / `e3sb10e000008e.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Hosonic Elec datasheet](docs/e3sb10e000008e-datasheet.pdf) (9 pp, sha256 `e7667b0f779067ca`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/e3sb10e000008e-datasheet.pdf)