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DXT2907A-13
Public Made by Adomby adom
Diodes Incorporated Bipolar (BJT), SOT-89. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownDXT2907A-13
Diodes Incorporated · Bipolar (BJT) · SOT-89
DXT2907A-13 from Diodes Incorporated, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | B | input | Base of the PNP transistor; drawn at the bottom lead of the top-view pin-out, with VEBO limited to -5 V. |
| 2 | C | passive | Collector (center lead), connected internally to the exposed collector tab; VCEO -60 V, IC -600 mA, ICM -800 mA. |
| 3 | E | passive | Emitter of the PNP transistor; drawn at the top lead of the top-view pin-out, with VEBO limited to -5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-89 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Collector-Base Voltage | VCBO | -60 | V | 2 | |||
| Collector-Emitter Voltage | VCEO | -60 | V | 2 | |||
| Emitter-Base Voltage | VEBO | -5 | V | 2 | |||
| Collector Current | IC | -600 | mA | 2 | |||
| Peak Collector Current | ICM | -800 | mA | 2 | |||
| ESD Human Body Model | ESD HBM | 4000 | V | JEDEC Class 3A (Note 7) | 2 | ||
| ESD Machine Model | ESD MM | 400 | V | JEDEC Class C (Note 7) | 2 | ||
| Power Dissipation | PD | 0.75 | W | Note 5: minimum recommended pad layout, 1oz Cu, single-sided 1.6mm FR-4 | 2 | ||
| Power Dissipation | PD | 1.2 | W | Note 6: 25mm x 25mm 1oz copper pad | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RJA | 166 | °C/W | Note 5 | 2 | ||
| Thermal Resistance, Junction to Ambient Air | RJA | 104 | °C/W | Note 6 | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Collector-Base Breakdown Voltage | BVCBO | -60 | -120 | V | IC = -100µA | 3 | |
| Collector-Emitter Breakdown Voltage | BVCEO | -60 | -80 | V | IC = -10mA | 3 | |
| Emitter-Base Breakdown Voltage | BVEBO | -5 | -8.8 | V | IE = -100µA | 3 | |
| Collector Cut-off Current | ICBO | -1 | -50 | nA | VCB = -50V | 3 | |
| Collector Cut-off Current | ICBO | -50 | µA | VCB = -50V, TA = +100°C | 3 | ||
| Collector Cutoff Current | ICEX | -50 | nA | VCE = -30V, VEB(OFF) = -0.5V | 3 | ||
| Emitter Cut-off Current | IEBO | -50 | nA | VEB = -5V | 3 | ||
| Static Forward Current Transfer Ratio | hFE | 75 | 208 | IC = -100A, VCE = -10V (as printed) | 3 | ||
| Static Forward Current Transfer Ratio | hFE | 100 | 207 | IC = -1mA, VCE = -10V | 3 | ||
| Static Forward Current Transfer Ratio | hFE | 100 | 202 | IC = -10mA, VCE = -10V | 3 | ||
| Static Forward Current Transfer Ratio | hFE | 100 | 169 | 300 | IC = -150mA, VCE = -10V | 3 | |
| Static Forward Current Transfer Ratio | hFE | 50 | 103 | IC = -500mA, VCE = -10V | 3 | ||
| Collector-Emitter Saturation Voltage | VCE(SAT) | -130 | -400 | mV | IC = -150mA, IB = -15mA | 3 | |
| Collector-Emitter Saturation Voltage | VCE(SAT) | -0.4 | -1.6 | V | IC = -500mA, IB = -50mA | 3 | |
| Base-Emitter Saturation Voltage | VBE(SAT) | -0.86 | -1.3 | V | IC = -150mA, IB = -15mA | 3 | |
| Base-Emitter Saturation Voltage | VBE(SAT) | -1 | -2.6 | V | IC = -500mA, IB = -50mA | 3 | |
| Output Capacitance | Cobo | 8 | pF | VCB = -10V, IE = 0, f = 1MHz | 3 | ||
| Current Gain-Bandwidth Product | fT | 200 | MHz | VCE = -20V, IC = -50mA, f = 100MHz | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 | 1 |
CAD (KiCad official)
- Symbol:
DXT2907A-13 - Footprint:
Package_TO_SOT_SMD:SOT-89-3 - 3D model: SOT-89 (KiCad packages3D, STEP)
- 3D model files:
dxt2907a-13-etched.step/dxt2907a-13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dxt2907a-13.step/dxt2907a-13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (7 pp, sha256
8a071f3450401048, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).