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DX7001

Public Made by Adom

by adom

Dersem LED Drivers, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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DX7001

Dersem · LED Drivers · SOP-8

DX7001 from Dersem, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 LD input Analog/segmented dimming input: floating selects full brightness, a pull-up above 20 µA (or a level 1 V above VDD) selects half-current mode, 0.2-1.2 V selects analog dimming with output off below 0.2 V, and absolute maximum is −0.3 to 7.0 V.
2 PWM input PWM dimming input: output is enabled when high and disabled when low, with rising threshold 1.4 V and falling threshold 0.8 V, resolving pulses down to 60 ns, defaulting high when floating, and absolute maximum of −0.3 to 7.0 V.
3 VDD power_in Chip supply pin, clamped to about 5.0 V (typical), which requires a bypass capacitor of at least 1.0 µF placed close to the pin; absolute maximum is −0.3 to 7.0 V.
4 CS input Source of the internal power MOSFET and current-sense input, where the 0.2 V reference sets output current as Iout = 0.2 V / RCS and the overcurrent threshold is 216-264 mV at VDD = 5 V.
5 D output Drain of the internal 200 mΩ / 100 V power MOSFET; this is a heat-dissipation pin that must be thermally treated according to the datasheet note.
6 D output Drain of the internal 200 mΩ / 100 V power MOSFET; this is a heat-dissipation pin that must be thermally treated according to the datasheet note.
7 GND power_in Chip ground, which per the layout guidance should be single-point connected with the VDD capacitor ground and the CS sense resistor ground.
8 GND power_in Chip ground, which per the layout guidance should be single-point connected with the VDD capacitor ground and the CS sense resistor ground.

Key specifications

Parameter Value
Manufacturer Dersem
Package SOP-8
Category LED Drivers
Pins 8

CAD (KiCad official)

  • Symbol: DX7001
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: dx7001-etched.step / dx7001-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dx7001.step / dx7001.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Dersem datasheet (13 pp, sha256 9c6d3be39c970df6, retrieved 2026-10-10, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF